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Intel opens wallet for EUV litho

01/26/2004  January 26, 2004 - Intel Corp., Santa Clara, CA, will invest $20 million over three years in Cymer Inc., San Diego, CA, to help develop extreme-ultraviolet (EUV) lithography.

Tessera and Oki sign licensing agreement

01/26/2004  (January 26, 2004) San Jose, Calif.—Tessera Technologies Inc. and Oki Electric Industry Co. Ltd. have signed a new licensing agreement. Oki and their subcontract assemblers plan to use Tessera's semiconductor packaging technology in devices such as microcontrollers and ASICs.

Industry can help groundbreaking nanotech bill fulfill its promise

01/26/2004  Opinion: Now that the nanotechnology bill has passed, it is important to avoid developing a stagnant “technocracy.” We need to embrace dynamism – a world that allows for constant creation, discovery and competition. To make this happen, we continuously must work with government leaders on creating an entrepreneurial environment.

NVE gets DARPA cash for nanoscale magnetics

01/26/2004  NVE Corp., an Eden Prairie, Minn., developer of spintronics technology, has been awarded about $450,000 by the Defense Advanced Research Projects Agency, according to a news release.

August Technology expands Taiwan operations

01/23/2004  JAN. 23--MINNEAPOLIS--August Technology Corp., a supplier of inspection and metrology solutions for the microelectronic industries, announced the expansion of their Taiwan operations in Hsinchu to better serve the growing number of customers in this region.

Toshiba unveils nine-layer stack

01/23/2004  January 23, 2004 - Toshiba Corp. said it has developed a multi-chip package that can stack nine layers, with 70-micron chip thickness and an overall thickness of 1.4mm -- the same as the company's 6-layer, 85-micron chip stack.

Amkor reports surge in demand, plans capacity expansion

01/23/2004  (January 23, 2004) Chandler, Ariz.— Amkor Technology Inc., citing an accelerating demand for advanced packaging solutions for cell phones and other handheld applications, is aggressively expanding capacity for stacked chip-scale packages (S-CSPs). Amkor's factories in Korea and Japan already produce stacked packages. The company will install S-CSP capacity in its factories in Taiwan and China early in 2004.

Microbridge chooses German foundry

01/23/2004  Microbridge Technologies Inc., a Montreal-based microsystems developer, has chosen X-FAB Semiconductor Foundries AG to make its microresistor device that adjusts the electrical current flow of components in a circuit.

Nano re-created in business's image; is this the best of all futures?

01/23/2004  Opinion: The nanotech act of 2003 is one for the history books. Future marketing students might marvel at how a group of salesmen achieved total political victory – complete with requisite silencing of dissenters.

IBM defense cross-examines former nurse, manager

01/22/2004  JAN. 22--SANTA CLARA, Calif.--The plaintiffs in the cleanroom cancer suit against IBM Corp. have rested their case, and at press time, Big Blue was ready to present a defense that will challenge testimony from former company nurse, Audrey Misako Crouch, who said it was an unwritten policy among the computer giant's medical staff to never utter chemicals as the cause for worker ailments.

Asia-Pacific governments invest in nano labs and research centers

01/22/2004  A number of new research parks have opened in the Asia-Pacific region in the past few months, illustrating an increased level of commitment by local governments toward investment in nanotechnology and related fields. Among the new centers is Singapore's Biopolis research park, aimed at establishing bio and nanotech businesses.

MEMSCAP launches new version of design tool

01/22/2004  MEMSCAP SA (News, Web), a France and Silicon Valley-based MEMS designer and manufacturer, released a second version of its MemsMaster design tool, according to a news release.

Kulicke & Soffa releases 1Q results

01/21/2004  (January 21, 2004) Willow Grove, Penn.—Kulicke & Soffa's financial results for its first quarter of fiscal year 2004, ended December 31, 2003, show that revenue was $160.4 million for the chip assembly and test interconnect services provider—compared to revenue in the quarter ended December 2002 of $111.4 million.

MEMC licenses strained silicon technology from IMEC

01/21/2004  (January 21, 2004) St. Peters, Miss.—MEMC Electronic Materials, Inc. has entered into an agreement with IMEC (Leuven, Belgium) to join its Industrial Affiliation Program (IIAP) that targets the implementation of high-mobility layers and advanced source/drain engineering solutions in scaled planar devices, as well as to license IMEC's strained silicon technology.

Jazz Semi eyes IPO

01/21/2004  January 21, 2004 - Jazz Semiconductor, a Newport Beach, CA-based wafer foundry, has filed with the SEC for an initial public offering of common stock.

SIA releases 2003 ITRS

01/21/2004  January 21, 2004 - The Semiconductor Industry Association (ITRS) has released the 2003 edition of the International Technology Roadmap for Semiconductors (ITRS), which provides detailed technical guidance and milestones for semiconductor manufacturing for the next 15 years.

Chipmakers, IR settle litigation

01/21/2004  January 21, 2004 - Litigation brought by International Rectifier Corp. against Hitachi Ltd. and Renesas Technology Corp., Hitachi's JV with Mitsubishi Electric, has been settled, with all parties reaching patent cross-licensing agreement.

MEMC signs licensing deals for strained-Si, SOI

01/21/2004  January 21, 2004 - MEMC Electronic Materials, St. Peters, MO, has agreed to license strained silicon technology from European consortium IMEC, and bonded-SOI wafer transfer technology from Silicon Genesis Corp.

IMEC, ASML extend litho pact to 193nm

01/21/2004  January 21, 2004 - ASML and European research center IMEC have extended their collaboration on immersion lithography with the planned launch of an industrial affiliation program for 193nm liquid immersion lithography.

Nanometrics, Hitachi High-Tech sign supplier deal

01/21/2004  January 21, 2004 - Nanometrics, Milpitas, CA, has signed a deal to supply metrology units to be integrated into Tokyo-based Hitachi High-Technologies' (HHT) semiconductor inspection products.