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August Technology revs Taiwan operations

01/21/2004  January 21, 2004 - August Technology, Bloomington, MN, a provider of automated inspection and metrology equipment, is expanding its service and applications operations in Hsinchu, Taiwan.

SEMI says industry posted December book-to-bill ratio of 1.20

01/21/2004  (January 21, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.1 billion in orders in December 2003 (three-month average basis) and a book-to-bill ratio of 1.20, according to the December 2003 Express Report published by SEMI.

BioMEMS firm Proteus raises $5.3 million

01/21/2004  Proteus Biomedical, a Menlo Park, Calif., developer of MEMS devices to treat congestive heart failure, raised $5.3 million in a Series B round of financing, according to the company's chief executive. The companyÂ’s Series A was a seed round.

Report: Bad schools threaten California's nanotech dominance

01/21/2004  CaliforniaÂ’s inability to produce a technically skilled work force compromises the stateÂ’s standing as a leader in nanotechnology, according to a state-sponsored report released today. But the problem lies as much with state legislators as with its beleaguered public education system, particularly if lawmakers see school cuts as a quick-fix solution to the stateÂ’s budget crisis, proponents said.

Report: Market for MEMS sensors growing

01/21/2004  The market for MEMS gyroscopes and accelerometers should continue to be strong during the next few years, with gyros growing at an even faster rate as the technology matures and costs come down, according to a new report.

China's economy swells

01/20/2004  JAN. 21--BEIJING--China's economy grew a surprising 9.9 percent in the final quarter of last year, the Communist country's National Bureau of Statistics reported in late January, signaling a quick recovery from SARS-induced economic fallout and foreshadowing a favorable outlook for 2004.

Entegris unveils FOUP cleaning system

01/20/2004  JAN. 20--CHASKA, Minn.--Entegris, Inc., a materials integrity management company, has announced that semiconductor manufacturers can now decrease the time, costs and contamination risks associated with cleaning front opening unified pods (FOUPs).

Dow takes aim at 193nm litho

01/20/2004  January 20, 2004 - Dow Corning, Midland, MI, has unveiled new lithographic materials for use in developing 193nm photoresists and anti-reflective coatings used in 65nm processes.

Profits and shares to improve, despite overall maturing of tech sector

01/20/2004  (January 20, 2004) New York, N.Y.—Shares of companies in the semiconductor group overall have the potential to appreciate between 20 to 25 percent over the next 12 months, according to a Standard & Poor's Equity Research Services report on the semiconductor industry.

Praxair, Samsung ink supplier deals

01/20/2004  January 20, 2004 - Praxair Inc., Danbury, CT, has signed agreements to supply various gases including nitrogen, helium, and hydrogen for two of Samsung Electronics' production facilities in Korea.

ASAT to provide flip chip technology to Shanghai Fudan Microelectronics

01/20/2004  (January 20, 2004) Pleasanton, Calif.—ASAT Holdings Ltd. and ASAT Inc., global providers of semiconductor package design, assembly and test, will provide flip chip land grid array (LGA) technology to Shanghai Fudan Microelectronics Co. Ltd. (Hong Kong, China) for multimedia applications.

Advanced Switching V1.0 specification ratification complete

01/20/2004  (January 20, 2004) Santa Clara, Calif.—The Advanced Switching (ASI-SIG) Interconnect Special Interest Group has completed the ratification of the AS V1.0 specification and has made it available to communications designers everywhere.

NIST researchers develop micro-oscillators

01/20/2004  (January 20, 2004) Gaitherburg, Md.—A tiny, novel device for generating tunable microwave signals has been developed by researchers at the National Institute of Standards and Technology (NIST).

Amkor chosen by Oki for advanced packaging solutions

01/20/2004  (January 20, 2004) Chandler, Ariz.—Oki Electric Industry Co. Ltd. has chosen Amkor Technology Inc. to assemble and test single- and stacked-die chip scale packages for its broad range of advanced semiconductor devices, including microcontrollers, application-specific digital audio controllers and SoC ASICs.

Molecular memory not a dream as ZettaCore attracts real money

01/20/2004  Your cell phone, like an increasing number of electronic devices, constantly drinks electricity to maintain its memory. If you could somehow get it to sip instead of gulp, you might get a week from the battery instead of a day. That's one potential benefit of technology under development at ZettaCore, which is expected to announce today that a venerated venture capital firm has taken an equity stake.

Renesas eyes IPO

01/19/2004  January 19, 2004 - Renesas Technology Corp., the JV between Hitachi and Mitsubishi Electric, has reportedly signed Goldman Sachs and Daiwa SMBC to manage its initial public offering later this year.

PSi enters supply agreement with Philips

01/19/2004  (January 19, 2004) Hong Kong, China—PSi Technologies has signed a long-term supply agreement with Royal Philips Electronics to provide outsourced power semiconductor assembly and test services through PSi's facility in Chengdu, Sichuan Province, Peoples' Republic of China.

It's IBM's turn to make a case

01/19/2004  JAN. 19--SANTA CLARA, Calif.--The IBM toxics trial enters a new phase this week as Big Blue gets its chance to present to jurors its answer to charges that the company knowingly exposed two workers to cancer-causing chemicals.

SUSS MEMS equipment package chosen by SensoNor to make tire pressure sensors

01/19/2004  (January 19, 2004) Munich, Germany—SUSS MicroTec AG's MEMS production systems have been chosen by SensoNor, a MEMS manufacturer for the automotive industry, to manufacture tire pressure sensors. Lithography and wafer-to-wafer bonding are two important steps in the MEMS fabrication process.