08/17/2016 SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.
08/16/2016 Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.
08/16/2016 Researchers at McMaster University have cleared that obstacle by developing a new way to purify carbon nanotubes -- the smaller, nimbler semiconductors that are expected to replace silicon within computer chips and a wide array of electronics.
08/16/2016 Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports.
08/16/2016 Semiconductor Research Corporation today announced that Tokyo Electron Limited has joined SRC's Nanomanufacturing Materials and Processes initiative.
08/16/2016 Problems frequently arise as a result of an incomplete or absent formal risk assessment when processes are modified or new materials introduced.
08/16/2016 New wafer processing technologies overcome FOWLPÂ’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.
08/15/2016 Recent breakthroughs in materials engineering of low-resistance W barriers/liners and bulk fill are making it possible to extend W use to next-generation devices.
08/15/2016 Semiconductor processes have long been a mystery for many circuit designers. They didnÂ’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.
08/15/2016 Pixelligent Technologies, a developer of high-index advanced materials for solid state lighting and display applications and producer of PixClear products, announced today that it closed $10.4 million in new funding.
08/15/2016 Mentor Graphics Corporation today announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today's advanced systems designs.
08/12/2016 A major research institution has placed orders for two Advanced Vacuum plasma processing systems that will provide etch and deposition capabilities to be used in nanoelectronics research and development.
08/12/2016 Veeco Instruments Inc. announced today that Epistar Corporation has ordered multiple TurboDisc EPIK 700 GaN MOCVD Systems for the production of LEDs.
08/12/2016 Samsung Electronics Co., Ltd. this week introduced a blueprint for next-generation flash memory solutions that will meet the ever-increasing demands of big data networks, cloud computing and real-time analysis.
08/12/2016 ChipMOS TECHNOLOGIES (Bermuda) LTD. a provider of outsourced semiconductor assembly and test services, today announced that its shareholders have approved the merger of ChipMOS with and into ChipMOS TECHNOLOGIES INC.
08/11/2016 Cypress Semiconductor Corporation today announced that Hassane El-Khoury has been named its president, chief executive officer, and a member of its board of directors.
08/11/2016 Scientists from the Institute of Physical Chemistry of the Polish Academy of Sciences (IPC PAS) in Warsaw and the Faculty of Chemistry of the Warsaw University of Technology (FC WUT) have shown that zinc oxide (ZnO) quantum dots prepared by an original method developed by them, after modification by the click reaction with the participation of copper ions, fully retain their ability to emit light.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
