Featured Content




As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

Two become one: How to turn green light blue

08/10/2016  Metal-organic frameworks with a piggyback structure open up new possibilities for solar cells and LEDs -- publication in the Advanced Materials scientific journal.

Tailored probes for atomic force microscopes

08/10/2016  3-D laser lithography enhances microscope for studying nanostructures in biology and engineering/ publication in Applied Physics Letters.

POET Technologies announces milestone toward commercialization integrated opto-electronics tech platform

08/10/2016  The milestone achieved is the first demonstration of functional Hetero-junction Field Effect Transistors (HFETs) down to 250nm effective gate lengths on the same proprietary epitaxy and utilizing the same integrated process sequence that was previously used to demonstrate high performance detectors.

Expanded focus areas and opportunities to exhibit at SEMICON Europa

08/10/2016  Europe's largest electronics manufacturing exhibition SEMICON Europa (25-27 October) will take place in Grenoble at ALPEXPO.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

08/09/2016  Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Toshiba debuts new technology, highlights latest memory and storage products at Flash Memory Summit

08/09/2016  Toshiba America Electronic Components, Inc. (TAEC) will be on hand at the Flash Memory Summit (FMS) this week to showcase its latest memory and storage solutions.

Transmitting energy in soft materials

08/09/2016  A new way to send mechanical signals through soft materials.

NREL technique leads to improved perovskite solar cells

08/09/2016  Scientists at the Energy Department's National Renewable Energy Laboratory (NREL), in collaboration with researchers at Shanghai Jiao Tong University (SJTU), devised a method to improve perovskite solar cells, making them more efficient and reliable with higher reproducibility.

Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology

08/08/2016  Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market at ICCGE-18 (the 18th International Conference on Crystal Growth and Epitaxy) in Nagoya, Japan, August 7th - 12th, 2016.

MEMS & Sensors Industry Group Conference Asia explores MEMS, sensors in IoT of today and tomorrow

08/08/2016  MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.

Smarter self-assembly opens new pathways for nanotechnology

08/08/2016  To continue advancing, next-generation electronic devices must fully exploit the nanoscale, where materials span just billionths of a meter. But balancing complexity, precision, and manufacturing scalability on such fantastically small scales is inevitably difficult.

Making a solar energy conversion breakthrough with help from a ferroelectrics pioneer

08/08/2016  Philadelphia-based team shows how a ferroelectric insulator can surpass shockley-queisser limit.

Diamond-based light sources could lay a foundation for quantum communications of the future

08/08/2016  Electrified quantum diamond could become the heart of quantum networks and computers of the future.

ON Semiconductor joins Automotive Equipment Supplier Association

08/05/2016  ON Semiconductor (Nasdaq: ON) this week announced that it is joining the Original Equipment Suppliers Association.

Cascade Microtech releases 1/f measurement solution with Keysight Technologies

08/05/2016  Cascade Microtech today announced the release of a comprehensive low-frequency noise measurement solution for device modeling, characterization and reliability testing with MeasureOne solution partner Keysight Technologies.

Park Systems launches Park NX20 300mm research AFM with full 300mm semiconductor wafer scan

08/05/2016  Park Systems announced NX20 300mm, the only AFM on the market capable of scanning the entire sample area of 300mm wafers using a 300mm vacuum chuck while keeping the system noise level below 0.5angstrom RMS.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors