03/18/2014 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.
03/17/2014 GaN Systems, a developer of gallium nitride power switching semiconductors, today announced the appointment of Jim Witham as CEO of the corporation.
03/17/2014 Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.
03/14/2014 Researchers have discovered that creating a graphene-copper-graphene “sandwich” strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.
03/14/2014 With anticipated economic limits to the continuation of MooreÂ’s Law now on the horizon, it seems that moving into the 3rd dimension (3D) by stacking multiple layers of integrated circuits (IC) will be the ultimate expression of CMOS technology.
03/14/2014 Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.
03/13/2014 Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.
03/13/2014 Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.
03/12/2014 On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.
03/12/2014 EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.
03/12/2014 STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.
03/12/2014 SEMI, the global industry association for companies that supply manufacturing technology and materials to the worldÂ’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.
03/11/2014 The Caltech chip eliminates the need for bulky and expensive lenses and bulbs and instead uses a so-called integrated optical phased array (OPA) to project the image electronically with only a single laser diode as light source and no mechanically moving parts.
03/11/2014 Samsung Electronics today announced that it is mass producing the most advanced DDR3 memory, based on a new 20nm process technology, for use in a wide range of computing applications.
