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Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

02/12/2014  At this weekÂ’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

02/12/2014  Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

Intermolecular and Guardian Industries expand collaboration

02/11/2014  Intermolecular, Inc. and Guardian Industries announced today the expansion and extension of their collaborative development program and strategic IP licensing agreement.

Rudolph announces shipments for 3D metrology of TSVs

02/11/2014  Rudolph Technologies, Inc. announced today the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a research organization based in Grenoble, France.

Chips that listen to bacteria

02/11/2014  A research team led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering, and Lars Dietrich, assistant professor of biological sciences at Columbia University, has demonstrated that integrated circuit technology, the basis of modern computers and communications devices, can be used for a most unusual application—the study of signaling in bacterial colonies.

CEA-Leti announces the launch of PIEZOMAT

02/11/2014  CEA-Leti today announced the launch of PIEZOMAT, a research project funded by the European Commission to design and implement a new technology of fingerprint sensor that enables ultra-high resolution reconstruction of the smallest features of human fingerprints.

EV Group unveils high-volume manufacturing photoresist processing system

02/11/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

Versatile Epoxy Compounds for Electronic Applications

02/10/2014  Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.

Digitally controlled lab unit for small sample material processing

02/07/2014  Microfluidics International Corporation introduces the new LM10 Microfluidizer, a digitally controlled lab unit for small sample material processing.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

02/07/2014  Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

The impact on OPC and SRAF caused by EUV shadowing effect

02/07/2014  EUVÂ’s off-axis mask illumination introduces a special problem in EUV OPC – the shadowing effect.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Silicon reclaim wafer market increased 14% in 2013

02/06/2014  The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

The 2014 European 2.5/3DIC Summit

02/06/2014  SEMIÂ’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.

Intel elects five new corporate vice presidents

02/06/2014  Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

Global wafer-level packaging equipment market to grow at a CAGR of 2.9

02/05/2014  Analysts at ReportsNReports.com forecast the global wafer-level packaging equipment market to grow at a CAGR of 2.9 percent over the period 2013-2018.

Capturing ultrasharp images of multiple cell components at once

02/04/2014  A new microscopy method could enable scientists to generate snapshots of dozens of different biomolecules at once in a single human cell, a team from the Wyss Institute of Biologically Inspired Engineering at Harvard University reported Sunday in Nature Methods.