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01/27/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

01/27/2014  At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EUÂ’s 10/100/20 strategy.

01/27/2014  Looking at the semi-equipment booking should be the first step in any attempt to assess future semiconductor trends.

01/24/2014  The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

01/23/2014  Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

01/23/2014  Lasertec is an industry leader in inspection and metrology for the semiconductor, compound semiconductor, FPD, renewable energy, life science and other industries.

01/23/2014  Improving economic competitiveness through cost reduction, cycle time improvement and more eco-friendly processing.

01/23/2014  A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

01/23/2014  In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

01/23/2014  The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.

01/23/2014  At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

01/23/2014  New technology eliminates the need for specialized equipment for wafer pre- or post-treatment.

01/23/2014  Green is the color for the decade and future decades as each country is developing its own standards for energy consumption and implementing its green initiatives.

01/23/2014  Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

01/23/2014  At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortiumÂ’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

01/23/2014  As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, whatÂ’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

01/23/2014  The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.

01/23/2014  The company will initiate production operations in mid 2014 and install an annual capacity in excess of 1 million units for its UVB and UVC LED illumination sources.