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Multitest ships first MEMS tri-temp solution for 3+2 axis magnetic test and calibration

11/25/2013  Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its solution for 3-axis magnetometer plus 2-axis low g-test and calibration fully supports the technical features of todayÂ’s advanced 3D hall sensors.

What can happen when graphene meets a semiconductor

11/25/2013  For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.

Dongbu HiTek starts volume production of 5 megapixel CMOS image sensor chips

11/25/2013  Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.

Next-generation Leti magnetometers on board Swarm satellites

11/22/2013  CEA-LetiÂ’s next-generation magnetometer technology was launched into space today on board the European Space AgencyÂ’s three Swarm satellites to collect unprecedented detail about the EarthÂ’s magnetic field.

Unraveling the mind-body connection with power-efficient IC chip

11/22/2013  Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.