11/04/2013 Quantum Electro Opto Systems Sdn. Bhd. (QEOS), a leading innovator in LED technology, announced today that it is entering the LED lighting and LED lighting systems business
11/01/2013 Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.
11/01/2013 UPV/EHU-University of the Basque Country researchers have developed and patented a new source of light emitter based on boron nitride nanotubes and suitable for developing high-efficiency optoelectronic devices.
11/01/2013 SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.
11/01/2013 Peregrine Semiconductor and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on PeregrineÂ’s new UltraCMOS 10 RF SOI technologies.
11/01/2013 This year is a significant year for the touch panel market as adoption of non-ITO films made of silver nanowire, copper mesh, silver mesh, silver halide, and silver nano particle has been examined and implemented in full scale
10/31/2013 Mentor Graphics Corporation yesterday announced the Valor Information Highway and the Valor Warehouse Management products, two supply chain-focused tools designed to enhance Enterprise Resource Planning (ERP) effectiveness and assist electronics manufacturers in reducing material costs.
10/31/2013 Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.
10/30/2013 At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).
10/30/2013 Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.
10/30/2013 The next major roadblock to progress in the ongoing push to develop EUV lithography for volume production is the availability of defect-free mask blanks.
10/30/2013 3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.
10/30/2013 Senior executives from Semiconductor Industry Association (SIA) member companies and other multi-national semiconductor companies around the globe sent a letter to Chinese Vice Premiers Wang Yang and Ma Kai on October 16, encouraging China to support duty-free coverage for semiconductor products in an expanded Information Technology Agreement (ITA).
