06/06/2018 Researchers at Oregon State University are looking at a highly durable organic pigment, used by humans in artwork for hundreds of years, as a promising possibility as a semiconductor material.
06/06/2018 ROHM and GaN Systems announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.
06/05/2018 IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award.
06/05/2018 Company showcases G-FET and G-DRIVE products for easy-to-design electrical converters and a small, highly efficient 65-watt USB PD 3.0 charger demonstration.
06/04/2018 Dow Performance Silicones further enhanced design flexibilities and processing options for consumer device and display OEMs today with the addition of DOWSIL™ SE 9100 and DOWSIL™ SE 9160 Adhesives to its portfolio of one-part, room-temperature cure (RTV) silicone solutions.
06/04/2018 At this weekÂ’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene.
06/04/2018 SEMI reported that worldwide semiconductor manufacturing equipment billings reached a historic quarterly high of US$17.0 billion for the first quarter of 2018, surging 59 percent in March to end the quarter with an all-time monthly high of $7.8 billion.
06/04/2018 NVIDIA and Taiwan's Ministry of Science and Technology today announced an extensive collaboration that will advance Taiwan's artificial intelligence capabilities.
EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.
06/01/2018 Synopsys, Inc. today announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation's BiCS FLASH vertically stacked three-dimensional (3D) flash memory.
06/01/2018 BISTel, a provider of intelligent, real-time data management, advanced analytics and predictive solutions for smart manufacturing announced today an innovative new Chamber Matching (CM) application that enables semiconductor manufacturers to better guard against events that negatively impact yield.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
