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01/31/2019  The Semiconductor Industry Association today announced the addition of Broadcom Inc. as an SIA member.

01/31/2019  Intel Corporation today announced that its board of directors has named Robert (Bob) Swan as chief executive officer.

01/31/2019  Water molecules distort the electrical resistance of graphene, but a team of European researchers has discovered that when this two-dimensional material is integrated with the metal of a circuit, contact resistance is not impaired by humidity. This finding will help to develop new sensors -the interface between circuits and the real world- with a significant cost reduction.

01/31/2019  Researchers from the Dresden Integrated Center for Applied Physics and Photonic Materials (IAPP) and the Center for Advancing Electronics Dresden (cfaed) at TU Dresden, in cooperation with Stanford University (USA) and the Institute for Molecular Science in Okazaki (Japan), have identified the key parameters that influence electrical conductivity in doped organic conductors.

01/31/2019  Vanguard International Semiconductor Corporation (VIS) and GLOBALFOUNDRIES (GF) today announced that VIS will acquire GF's Fab 3E in Tampines, Singapore.

01/30/2019  Inaugural summit offers latest insights in semiconductor manufacturing and applications.

01/30/2019  Revenues improve but remain below 2007 peak.

01/30/2019  SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summitin Dresden, Germany.

01/30/2019  Fabless power semiconductor company Helix Semiconductors today announced that Rudi De Winter has joined its board of directors.

01/25/2019  Laser systems specialist LPKF Laser & Electronics, based in Hannover, Germany has added a foundry service for thin glass substrates to its product portfolio.

01/25/2019  Alliance Memory today announced that it is offering several end-of-life 8G DDR3L SDRAMs for which Micron Technology Inc.

01/25/2019  December billings of North American equipment manufacturers ended 2018 on a positive note.

01/24/2019  ULVAC Technologies, Inc. has introduced the LS series of dry screw pumps as a high performance, more compact and lower cost replacement to multi-stage dry Roots pumps for a wide range of vacuum applications.

01/24/2019  Researchers at the University of Exeter have developed an innovative technique that could help create the next generation of everyday flexible electronics.

01/24/2019  In the quest for smaller, faster 2D processors, NYU Tandon-led research team invents thermal lithography process for higher quality, lower cost, and mass production potential.

01/24/2019  Semiconductor units forecast to increase 7% in 2019 with IC units rising 8%, O-S-D units growing 7%.

01/23/2019  Global shipments of large thin-film transistor (TFT) liquid crystal display (LCD) panels rose again in 2018 despite concerns of over-supply in the market.

01/23/2019  ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

01/23/2019  New printing technique and materials could be used to develop intelligent materials and self-adaptive infrastructures and transducers.

01/23/2019  Nikon Corporation, ASML Holding N.V., and Carl Zeiss SMT GmbH have signed a Memorandum of Understanding relating to a comprehensive settlement of all legal proceedings over patents for lithography equipment and digital cameras.