09/01/2008 I’ll attempt to provide here a brief review and update of the “MEMS State of the Nation” by using my MEMS Commercialization Report Card”1 to help track the recent changes and the trends in the critical success factors to the commercialization of MEMS.
09/01/2008 The number of products incorporating nanoscale materials is increasing at a rapid rate, but manufacturers are still struggling to find ways to control these materials in the production environment as they ramp up to commercial scale.
09/01/2008 With three of the key end markets for MEMS devices currently struggling I find it especially interesting that current emerging market drivers aren’t necessarily coming in the form of new MEMS devices as in the past, but rather new ways to apply existing MEMS devices
09/01/2008 Low cost is imperative when manufacturing any kind of sensor—particularly one used in mass-market applications such as automotive, home and consumer electronics—and this means keeping the sensing structure as simple and practical as possible.
09/01/2008 Microelectrical-mechanical systems (MEMS) devices have experienced impressive and steady growth as they are integrated into people’s everyday lives.
09/01/2008 Chemical air filtration combined with on-site analytical evaluation of filtered area and filter solution provides cost reduction by optimizing filter lifetime.
09/01/2008 No matter where you sit, stand, or walk, or what you wear in a critical, clean environment, eliminating electrostatic discharge is a top consideration.
08/31/2008 STATS ChipPAC Ltd. and Infineon Technologies have signed a second agreement in which STATS ChipPAC will provide manufacturing services for products based on Infineon's first generation embedded wafer-level ball grid array (eWLB) technology. This agreement between the two companies comes closely follows the Aug. 7 release announcing an agreement between Infineon, STMicroelectronics and STATS ChipPAC on joint development of next generation eWLB technology.
08/29/2008 August 29, 2008: BioForce Nanosciences Holdings, Inc., a developer of systems integration at the micro- and nanoscales to create products for the life sciences, has entered into a collaboration agreement with the College of Nanoscale Science and Engineering (CNSE) of the U. at Albany, through which faculty, scientists, and researchers at CNSE will utilize BioForce's Nano eNabler molecular printer for the development and evaluation of novel applications.
08/29/2008 August 29, 2008: American Elements, a manufacturer of nanoscale materials, now offers I-Mite, a new nanoscale indium powder, which can be produced in commercial scale batches to meet the needs of many recently developed transparent anti-static coatings and surfaces.
08/29/2008 August 29, 2008: Virtus Advanced Sensors, a developer of multi-axis inertial sensor technology, has introduced its first sensor product, an analog 3-axis accelerometer for low-cost consumer electronics applications. Its affiliated company, applications developer Virtus Asia Ltd., has developed two products utilizing this technology, including a wireless motion sensing mote kit and multi-sensing data recorder.
08/28/2008 August 28, 2008: Small or large companies and tech-savvy entrepreneurs who want to bring nanotechnology products to world markets can now access technical and business services at a new facility in Edmonton's Research Park.
08/28/2008 August 28, 2008: An SAE J1321 Type II fuel consumption test, performed by Claude Travis & Associates, an independent testing company, has verified the ability of a ceramic nanotechnology product from CerMet Lab to increase fuel economy in a heavy-duty truck.
08/28/2008 August 28, 2008: CytoViva Inc., a provider of optical imaging solutions to the nanotechnology research market, has integrated new hyperspectral imaging technology (HSI) with its advanced nanoscale microscope system. This combination of technologies will enable scientists to make advances in a wide range of nano-medicine and nano-materials research initiatives.
08/28/2008 The MATRIX 355 BE from Coherent, Inc. is a frequency-tripled, diode pumped solid state (DPSS) laser that combines low output noise and low beam divergence. This is achieved by incorporating an integral beam expander within the sealed laser head, which results in an output beam diameter (1/e2) of 2.2mm and a divergence of only 0.5mrad.
08/28/2008 USJ formation at 32nm was the focus of the West Coast Junction Technology Group's meeting at SEMICON West, but also discussed was what lies ahead at the 22nm node. Ultratech execs provide additional insight to SST about the company's WCJTG talk on laser spike annealing.
08/28/2008 Laminated Thin Film Resistors on LCP By Swapan K. Bhattacharya, Stephen Horst, and John Papapolymerou, Georgia Institute of Technology
Embedded resistors are generally implemented with either thick- or thin-film processes. Thin-film processes use a variety of metal alloys usually deposited by sputtering process under vacuum An alternative to this approach involves the use of commercially available resistive films on a carrier conductive copper foil.5-8
