08/01/2008 An exposure control plan is only as effective as the understanding and compliance of the personnel who implement it, so biosafety reviews are crucial.
08/01/2008 FORT WASHINGTON PA — In a strategic move to further capitalize on its strengths as an equipment manufacturer, Kulicke & Soffa Industries announced that the company will acquire the assets of Orthodyne Electronics Corp, while also divesting its wire business unit to W.C. Heraeus GmbH.
08/01/2008 The development of a comprehensive PHSS monograph will enhance the recognition of RABS as an alternative to isolators and provide a framework for regulatory compliance.
08/01/2008 The transfer of product or equipment from one area to another presents a prime opportunity for a contamination event to occur. Doors and pass-throughs specifically designed for clean processing environments can help maintain necessary cleanliness levels.
08/01/2008 Power dissipation and small packages are creating heat fluxes that must be addressed at either the package or system level. Designers face such challenges as thermal management as a gating factor and integration of small dies in larger packages. Contact and spreading resistance are mitigating factors for design success.
08/01/2008 The line in the sand is slowly being washed away. At this year’s SEMICON West, it was hard to tell the difference between the front-end and back-end players.
08/01/2008 STUTTGART, GERMANY — Shifting away from focus on 3D IC and TSV processes, this year’s Advanced Packaging Conference, at SEMICON Europa, titled “Technologies, Manufacturing And Supply Chain”, will focus on more immediate issues facing the back-end sector of the semiconductor industries.
08/01/2008 In a slowing economy, everyone looks for signs of hope for a strong future. Unfortunately at times like these, funding for R&D often takes a back seat to the basic needs of a company to conduct commerce and basically stay in business by doing the same things in the same way just to keep pace.
08/01/2008 Thin, strong chips are assembled in chip packages; not bonded wafers. Therefore, die singulation must be considered from the start. Remote cold dry etching technology allows for the manufacturing of strong silicon chips in terms of highest possible mechanical properties and bending capability.
08/01/2008 Without underfill materials, many of today’s advances in packaging technologies wouldn’s be possible. A novel material system called epoxy flux combines a flux component with an epoxy system that facilitates solder joint formation while adding devide protection for increased process efficiency.
07/31/2008 Gartner and VLSI Research analysts tell SST what's the driving interest behind KLA-Tencor's proposed acquisition of Vistec Semiconductor Systems' inspection business, and where areas of overlap might be leveraged to take on other sector competitors.
07/31/2008 July 31, 2008 -- The National Institute of Standards and Technology (NIST) will use SouthWest NanoTechnologies Inc.'s (http://swentnano.com) SWeNT SG65 single-wall carbon nanotubes, manufactured by the CoMoCAT process, as the starting material for a Standard Reference Material (SRMs).
07/31/2008 July 31, 2008 -- A new report from Yole Développement criticizes MEMS-based sensor and actuator firms for not figuring out how tap into what it says is the largest growth opportunity for MEMS devices over the next five years: wireless handsets.
07/31/2008 July 31, 2008 -- Using the same technology with which they created the world's first fully functional nanotube radio, researchers with Berkeley Lab and the University of California (UC) at Berkeley have fashioned a nanoelectromechanical system (NEMS) that can function as a scale sensitive enough to measure the mass of a single atom of gold.
07/31/2008 A new report from Yole Développement criticizes MEMS-based sensor and actuator firms for not figuring out how tap into what it says is the largest growth opportunity for MEMS devices over the next five years: wireless handsets.
