12/22/2017 The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.
12/21/2017 Researchers at the Center for Integrated Nanostructure Physics, within the Institute for Basic Science (IBS), have shown that defects in monolayer molybdenum disulfide (MoS2) exhibit electrical switching, providing new insights into the electrical properties of this material. As MoS2 is one of the most promising 2D semiconductors, it is expected that these results will contribute to its future use in opto-electronics.
12/21/2017 The Korea Advanced Back-end Factory Integration Task Force, in response to the industry's demand, has decided to revise SEMI E142-0211 (Reapproved 1016), Specification for Substrate Mapping by adding an assembly and packaging raw materials traceability method.
12/20/2017 JEDEC Solid State Technology Association announces the successful launch of its newest committee: JC-70 Wide Bandgap Power Electronic Conversion Semiconductors.
12/20/2017 Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industryÂ’s first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM.
12/20/2017 Electronics manufacturing executives will sharpen their competitive edge in Dublin, Ireland, on 4-6 March at Europe's SEMI Industry Strategy Symposium (ISS Europe).
12/20/2017 New embedded transducer approach allows surface acoustic wave device to transmit signals with six times the speed of most commercially used devices.
12/19/2017 EPC2049 GaN power transistor offers power systems designers a 40 V, 5 m? power transistor about 8 times smaller than equivalently rated silicon MOSFETs for point of load converters, LiDAR, and low inductance motor drive.
12/19/2017 Renesas Electronics Corporation today announced the integration of Intersil Corporation as a legal entity and a new branding policy following the acquisition of Intersil on February 24, 2017.
12/19/2017 Nova, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, today announced that Ronnie (Miron) Kenneth, former CEO of Voltaire Technologies Ltd. and former CEO of Pontis Ltd., has been appointed to the company's Board of Directors.
12/19/2017 Newly opened building with advanced cleanroom technology provides additional space for final assembly of EVG process equipment and technical source inspection by the company's global customers.
12/19/2017 More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth.
12/18/2017 Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industryÂ’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2).
12/18/2017 Researchers from North Carolina State University have found that the transfer of triplet excitons from nanomaterials to molecules also creates a feedback mechanism that returns some energy to the nanocrystal, causing it to photoluminesce on long time scales. The mechanism can be adjusted to control the amount of energy transfer, which could be useful in optoelectronic applications.
12/15/2017 The global wafer mounter equipment market is expected to grow at a CAGR of more than 4% from 2017-2021, according to a new market research report by Technavio.
12/15/2017 One of the world's largest independent MEMS foundries ready to manufacture MEMS and image sensor products utilizing Invensas wafer bonding and 3D interconnect technology.
