03/01/2008 As ICs move toward high clock speeds with pin densities reaching 0.5-mm pitch and pin counts over 1000, packaging for such devices must feature finer interconnections and improved electrical and mechanical performance.
03/01/2008 Driving around after a recent snowstorm in the Northeast U.S., and seeing how rapidly the roads are kept clear, got me thinking about socket contact cleaning.
03/01/2008 The advent of pulsed lasers with short wavelength, focusable output, and high power levels presents opportunities for tool builders and end-users in package singulation.
03/01/2008 Driving forces for 3D integration have been clearly identified and through-wafer via (TSV) technology continues to move closer to high volume production.
03/01/2008 Technical process innovations in wafer-level packaging (WLP) have increased due to higher functional density, critical device real estate, an increase in market entry barriers, and stronger process integration capabilities.
03/01/2008 Although most of the semiconductor industries’ greatest discoveries and inventions are the results of years of research and development at prestigious universities and research institutes, some of the best solutions out there were developed in the trenches, on the manufacturing floor.
02/29/2008 Feb. 29, 2008 - In what is essentially the last in a divestiture of its semiconductor foundry operations, Zarlink Semiconductor has sold its analog foundry in Swindon, UK to a subsidiary of domestic electronics component supplier MHS Electronics -- with a grand pricetag of €1 (~$1.51).
02/29/2008 Feb. 29, 2008 - Zygo says it has acquired the assets of Solvision, a Canadian provider of visual inspection equipment, for an undisclosed amount.
02/29/2008 Feb, 29, 2008 - In this exclusive video interview, IBM's Lars Liebmann talks about his papers presented at this week's SPIE, including persistent misconceptions about restricted design rules, and the need for designers to react to systematic and stable effects with broad, coarse layout adjustments vs. minor movements based on a specific moment. He also discusses the opportunities at 22nm with "soft" and "hard" DFM, and how these concepts will be required to keep the scaling path profitable.
02/29/2008 ; Zygo Corp. has announced that it has acquired the assets of Solvision Inc., a Canadian-based company, including the shares of its Singapore subsidiary. With this acquisition, Zygo enters the market for in-line inspection of flip chip substrates and packaged ICs.
02/29/2008 ; The IMAPS Global Business Council (GBC) is pleased to announce that Bi Keyun, PhD and president of the China Electronic Packaging Society, will head a delegation from China and will speak at GBC Spring Conference in Scottsdale, AZ, on March 16 and 17, 2008.
02/29/2008 Adnavance Technologies Inc., a developer of microarray-based direct detection molecular diagnostic tests for medical applications, has completed a Series B financing totaling $3.8 million.
02/29/2008 Nano-Terra, Inc. has announced two collaboration agreements with Nestec Ltd. The companies will together use new techniques to develop and bring to market nanotechnology-enhanced packaging for pet products, as well as manufacturing processes.
02/28/2008 Amkor Technology, Inc. introduced FusionQuad, a novel package technology designed for applications that call for high electrical and thermal performance at low cost. Broad application of this package includes consumer electronics, Ethernet, and a variety of applications across all semiconductor markets.
02/28/2008 February 28, 2008 -- /BELLEVUE, WA/ -- Pharmacy OneSource, creator of the Simplifi 797 quality assurance web application, is pleased to announce that industry expert Eric S. Kastango, MBA, RPh, FASHP, CEO of Clinical IQ, has updated the included policies and procedures reference section in Simplifi 797 to match USP's revised chapteron pharmaceutical compounding, "Sterile Preparations."
02/28/2008 February 28, 2008 -- /ARLINGTON HEIGHTS, IL/ -- The Institute of Environmental Sciences and Technology will hold its annual technical meeting and exposition, ESTECH 2008, May 4-7, 2008 at the Hilton Chicago/Indian Lakes Resort in Bloomingdale, IL.
