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Leti announces FED4SAE project to accelerate European cyber-physical system solutions to market

11/14/2017  Leti, a research institute of CEA Tech and coordinator of the pan-European consortium FED4SAE, today announced that the 14 project partners have launched a three-year European Commission program to facilitate the acceleration of European cyber-physical-system (CPS) solutions to market.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

GLOBALFOUNDRIES, Fudan team to deliver next generation dual interface smart card

11/14/2017  GF's 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China's most advanced CPU bank card.

Ben-Gurion University researchers achieve breakthrough in camouflaging an optical chip rendering it invisible

11/14/2017  Ben-Gurion University of the Negev (BGU) researchers have achieved a breakthrough in manipulating light to render an object, such as an optical chip, invisible.

Magnetic sensor industry is moving into a consolidation phase

11/13/2017  With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Improving sensor accuracy to prevent electrical grid overload

11/13/2017  Engineers take note -- new current sensors need fine-tuning to accurately inform monitors of the electrical grid about incoming surges.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

Micron advances persistent memory with 32GB NVDIMM

11/13/2017  Micron Technology, Inc., today announced a new 32GB NVDIMM-N offering twice the capacity of existing NVDIMMs, providing system designers and original equipment manufacturers with new flexibility to work with larger data sets in fast persistent memory.

Leti demonstrates world's first 300mm wafer-to-wafer direct hybrid bonding with 1-micron pitch

11/13/2017  New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications.

U.S. semiconductor chemical suppliers lost market share over past decade

11/10/2017  U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to a new report from The Information Network.

An interview with Bosch Sensortec CEO: IoT, environmental sensing and value chain

11/10/2017  SEMI interviewed one of the four keynotes presenting on November 14 during the Opening Ceremony, Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, about topics about developments and trends in IoT, Environmental Sensing, and Value Chain as well as the role of Europe.

The next generation of power electronics? Gallium nitride doped with beryllium

11/10/2017  How to cut down energy loss in power electronics? The right kind of doping.

2017 Global Semiconductor Alliance Award nominees announced

11/09/2017  The Global Semiconductor Alliance (GSA) today announced the 2017 award nominees for the GSA Awards Dinner Celebration.

Leti joins DARPA-funded consortium to develop implantable device for restoring vision

11/09/2017  Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Alpha and Omega Semiconductor announces shield gate technology generation 2 100V 3.6mOhm MOSFET

11/09/2017  Alpha and Omega Semiconductor Limited today announced the release of AONS66916 production utilizing the latest Alpha Shield Gate Technology Generation 2 (AlphaSGT2).

Advanced wireless-charging chip from STMicroelectronics enables faster charging of smartphones and tablets

11/09/2017  STMicroelectronics is powering up wireless charging for mobile devices by introducing one of the world's first chips to support the latest industry standard for faster charging.

Automotive electronic systems growth strongest through 2021

11/09/2017  IC Market Drivers 2018 report ranks major end-use applications and their impact on IC market growth.

A*STAR IME's new multi-chip FOWLP development line to drive innovation and growth in semiconductor industry

11/08/2017  A*STARÂ’s Institute of Microelectronics (IME) has established a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.