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FlipChip to Expand DSD Fab to 3M Die/Wk Capacity

11/12/2007  FlipChip International LLC has completed the first phase of its expansion of its Die Sales Division (DSD) fab in Tempe, AZ. This DSD expansion adds next-generation high-speed tape & reel tools with in-line automatic vision systems capable of up to 16,000 die placements/hour. DSD is now capable of supplying 3 million KGD per week.

IMAPS Preview Update

11/12/2007  ; Two more companies have announced they will be presenting their latest technology at this week's IMAPS International Symposium. Antares Advanced Test Technologies, Vancouver, WA, will discuss the nuances of back-end signal integrity and showcase its latest BGA burn-in technology at Booth #1130. Dage Precision Industries, Fremont, CA, will showcase its newest bond test developments in Booth #608.

Cornell/BU technique speeds atomic microscopy 100X

11/12/2007  Cornell and Boston University scientists have found a way to make the scanning tunneling microscope (STM) at least 100 times faster. The adaptation could also enable new capabilities including the ability to sense temperatures in spots as small as a single atom, and to detect minute position changes.

Microbridge releases single passive chip for Wheatstone bridge calibration/compensation

11/12/2007  Microbridge Technologies Inc.'s new MBW-303 Wheatstone Bridge Offset Conditioning Network. The single-chip device comprises four Microbridge eTC Rejustors (re-adjustable resistors) -- which the company says is the world's first fully analog, passive electronic Temperature Compensation (eTC) dividers -- configured in a bridge.

TEL Joins SEMATECH's 3D Interconnect Program

11/09/2007  ; Tokyo Electron Ltd. (TEL) has become the first semiconductor supplier company to join SEMATECH's 3D Interconnect Program, teaming with several chipmakers who are the program's founding members. TEL's agreement with SEMATECH adds significant resources to the consortium's effort aimed at evolving the traditional copper/low-k interconnect technology to 3D chip stacking, including through-silicon vias as interconnects.

StratEdge Moves Facilities, Increases Offerings

11/09/2007  ; StratEdge, a designer and producer of semiconductor packages for microwave, millimeter wave, and high-speed digital devices, has moved its headquarters to new, state-of-the-art facilities. Still located in San Diego, the new site enables StratEdge to increase capabilities and space for package design, manufacturing, assembly, and test.

Nanomix, MysticMD partner on glucose detection

11/09/2007  Nanomix Inc., an electronic detection company commercializing high-value diagnostic and monitoring applications, has announced an exclusive licensing agreement with MysticMD Inc., a provider of proprietary nano-coatings.

Tegal announces 2Q profit, repeat order

11/09/2007  Tegal Corp., manufacturer of plasma etch and deposition systems, achieved net income of $693,000 in Q2 2007 compared to a net loss of $3.3 million in the same period last year. And, the company has sold a second 6500 cluster tool to Skyworks Solutions.

TEL first toolmaker in SEMATECH's 3D interconnect program

11/09/2007  November 8, 2007 - Tokyo Electron Ltd. (TEL) has joined SEMATECH's 3D Interconnect Program, the first supplier in the group launched in 2005 to evolve traditional copper/low-k interconnect technology to 3D chip stacking, including through-

SEMI adding solar event to SEMI West agenda

11/09/2007  November 8, 2007 - In an effort to deepen industry ties to perhaps the best high-growth application area for many equipment suppliers, SEMI is partnering with the organizers of global solar trade fair Intersolar to cohost "Intersolar North America," the largest event serving the solar energy technology supply chain in the US, at next year's SEMICON West (July 15-17, San Francisco's Moscone Center).

Hospitals adopt STERIS room sterilization technology to fight HAIs

11/08/2007  October 24, 2007 -- /PRNewswire/ -- MENTOR, OH -- STERIS Corporation announced today it has received the first orders for its VaproSure(TM) Room Sterilizer from several U.S. hospitals.

Nova's integrated metrology system chosen for largest memory fab in Taiwan

11/08/2007  October 24, 2007 -- /PRNewswire/ -- REHOVOT, ISRAEL -- Nova Measuring Instruments Ltd. announced a major integrated metrology win for its CMP process control products at a leading memory manufacturer in Taiwan.

Intel opens first high-volume 45 nm microprocessor manufacturing factory

11/08/2007  October 25, 2007 -- /BUSINESS WIRE/ -- CHANDLER, AZ -- Intel is opening its newest state-of-the-art microprocessor factory (called Fab 32) in Chandler, AZ, as it prepares to ship its first 45 nm processors on November 12.

LDPI's wet/damp fluorescent lights receive NSF certification

11/08/2007  October 26, 2007 -- EAU CLAIRE, WI -- LDPI Lighting's 376 Series wet/damp fluorescent light fixtures have recently been tested and certified by NSF (National Sanitation Foundation) International to NSF/ANSI Standard 2.

Air Products sells HP process chemicals line

11/08/2007  October 24, 2007 -- /PRNewswire/ -- LEHIGH VALLEY, PA -- Air Products has signed a definitive agreement to sell its high-purity process chemicals (HPPC) business to KMG Chemicals of Houston, TX.

ASHRAE expands certification to testing centers worldwide

11/08/2007  October 24, 2007 -- ATLANTA, GA -- ASHRAE's first certification program is now available in testing centers in 22 countries.

Hiden Analytical opens new applications laboratory

11/08/2007  October 24, 2007 -- WARRINGTON, UNITED KINGDOM -- Hiden Analytical, the U.K.-based analytical instrument manufacturer, announces the opening of the new application and demonstration facility at its corporate headquarters in Warrington, U.K.

SEMI: Wafer shipments slowing, as expected

11/08/2007  November 8, 2007 - Wafer shipments were down slightly in 3Q from the prior quarter, fulfilling expectations of slowing wafer demand that will result in 8% growth in 2007, slightly lower than previous expectations, according to data from SEMI's Silicon Manufacturers Group (SMG).

TI's new stereo codecs offer digital microphone support for portable consumer devices

11/08/2007  Texas Instruments Inc. (TI) has introduced three new audio codecs featuring low power consumption and noise filtering capabilities to maximize battery life and enhance performance in portable consumer applications such as wireless handsets. According to TI, these are the industry's first I2S codecs capable of interfacing directly to digital or analog microphones.

QuantumSphere wins key patent for nanomaterials manufacturing process

11/08/2007  QuantumSphere has been awarded a U.S. patent for its QSI-Nano Gas Phase Condensation (GPC) manufacturing method, which the company says is "the first in the industry at making ultrapure, highly uniform and narrow size distribution particles without the use or production of hazardous chemicals or gasses."