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SenGenuity Announces Latest Sensor Advancement

11/06/2007  ; SenGenuity, the Sensors and Advanced Packaging Division of Vectron International, a leader in the design, manufacture and marketing of frequency control, sensor, and hybrid product solutions, has announced the general availability of its starter kit product to enable customers to test and validate the ViSmart viscosity sensor for their specific applications.

MEMSCAP transducers key for cabin pressure control in Airbus Airlifter

11/06/2007  Diehl Aerospace has selected MEMSCAP to supply its MEMS technology for the Airbus Military A400M Airlifter. MEMSCAP will supply its Digital Pressure Transducers -- a key element of the Doors Control and Monitoring System (DCMS) developed by Diehl onboard the A400M military transport aircraft.

NanoInk awarded three new patents for Dip Pen Nanolithography

11/06/2007  The U.S. Patent and Trademark Office has helped to solidify NanoInk's position in nanoscale manufacturing by awarding three new patents related to its DPN technique. Further, the PTO has narrowed the scope of claims by rival BioForce Nanosciences.

Productronica 2007 Preview

11/05/2007  Things just keep getting smaller. Two years ago at Productronica 2005, MicroNanoWorld was launched to address the increasing importance of micro-electronics production. It was continued at Electronica 2006, which alternates bi-annually with Productronica. This year, micro-electronics production is set to take center stage, as "Productronica 2007: Micro-Production in the Limelight" gets under way from November 13-16, 2007 at New Munich Trade Fair Center, Munich, Germany.

Analyst: Notebook demand to be still hot in '08

11/05/2007  November 5, 2007 - Notebook unit sales are on track for a better-than-expected 40% growth this year, and that growth will more than likely keep going through 2008 -- which would be great news for several chipmakers, according to an industry analyst.

Tackling systematic/random variations while matching process chambers

11/05/2007  Few fab management practices are more "in the trenches" than using mathematics and statistics to investigate and solve real-life problems. One such technique highlighted at the recent ISMI Symposium on Manufacturing Effectiveness was "multivariate analysis" -- specifically, comparing two ashing chambers that were supposed to be matched, but whose output showed differences.

RoHS X-ray Fluorescence System

11/05/2007  The LeadTracer-RoHS XRF system, with new sample preparation stand, is reportedly the only XRF system designed specifically for the electronics industry to provide fast, accurate, and portable screening capability to meet Reduction of Hazardous Substances (RoHS) directives.

Low Voiding Lead-Free Solder Paste

11/05/2007  The new SAC-XM5S SAC3 low voiding lead-free solder paste, with its special flux formulation, can control the size of voids to keep them within acceptable limits.

Ultra-low-voiding Solder Paste

11/05/2007  The Indium5.1AT lead-free solder paste is a no-clean paste that delivers enhanced finished goods reliability by featuring low voiding at via-in-pad, good printability and good wetting, and a robust reflow profile window.

Halogen-Free and No-Clean Solder Paste

11/05/2007  The EnviroMark 919G (EM919G) lead-free solder paste is 100% halide- and halogen-free, representing a critical innovation in soldering materials chemistry.

Automatic Defluxing System

11/05/2007  The Trident fourth-generation automatic de-fluxing system is lead-free compatible and reportedly the fastest batch-format de-fluxing system available.

STMicro starts building China backend site

11/05/2007  November 5, 2007 - STMicroelectronics has begun construction at a new packaging/text facility in Longgang, Guangdong Province, China. Plans call for 20,000 sq. m of manufacturing space to be ready by Sept. 2008, followed by equipment move-in during 4Q08; eventually that size will double to 40,000 sq. m.

Countdown to IMAPS 2007

11/05/2007  IMAPS is set to kick off its 40th Anniversary International Symposium where it first began in San Jose, CA, in just four days, from November 11–15, 2007. This year's program will put the spotlight on international themes with translated sessions, collaboration with delegations from Chinese societies, and keynote addresses discussing global concerns.

Teneo, GA Tech Combine on Precision Microtools for MEMS

11/05/2007  ; Teneo Micro Instruments LLC, an IP2Biz company, has launched the Teneo TM70xx line of mechanically actuated microtools. The tool set, created by researchers at the Georgia Institute of Technology, offers a diversity of tool materials, requires no electrical or thermal power to operate, and seamlessly integrates and augments standard microprobe and micromanipulator stations.

NanoDynamics forms IP, energy partnerships

11/05/2007  NanoDynamics Inc. has recently announced new partnerships in the company's attempt to explore new business opportunities -- one with an intellectual property firm and another with an oil and gas venture.

Ambios introduces next-gen surface profilometers

11/05/2007  Ambios Technology, Inc. has introduced the XP-Plus Series surface profilometers. The series consists of three different profilers, each designed to meet the needs of a specific set of research and manufacturing criteria.

Nanosphere prices initial public offering

11/02/2007  Nanosphere Inc., a nanotechnology-based molecular diagnostics company, has announced the pricing of its initial public offering of 7 million shares of its common stock at $14 per share.

Viewpoint
3D Integration: Preparing a Brilliant Future


11/02/2007  By Rudi Cartuyvels, IMEC

3D integration explores the possibilities to interconnect active devices in different 2D planes. These interconnects can be considered at different levels of the wiring hierarchy, from the package, over global, to local interconnect levels. The future looks bright for 3D integration, as it promises to become a Holy Grail for system integration with uses in electronics, consumer, automotive, medical, office, and networking applications.

Yale U. Dedicates New Nanodevice Fab

11/02/2007  ; Yale U. has dedicated a new $8 million, 2,600-sq.-ft cleanroom facility for its Center for Microelectronics Materials and Structures for fabricating micro- and nano-scale devices for engineering research. The Center serves over a dozen research groups, nearly 40 students in engineering, and an increasing number of collaborators.

NeoPhotonics #2 in "Technology Fast 50"

11/02/2007  NeoPhotonics Corp. has been named the second ranked firm in Deloitte's "Technology Fast 50" for Silicon Valley, a ranking of the 50 fastest growing technology, media, telecommunications, and life sciences companies in the region by Deloitte & Touche USA LLP, a professional services organization.