09/04/2007 STMicroelectronics SAS (Tours, France), a division of STMicroelectronics NV Group, ordered the AMS 4200 DRIE production tool from Alcatel Micro Machining Systems. STMicro will use the tool for deeper advanced etching to realize 3D semiconductors and integrated MEMS packages.
09/04/2007 A low-viscosity transparent epoxy, Master Bond EP30-4 cures to components and various substrates without external heat. It forms a 0.025" or thicker film for conformal coating, potting, adhesive, and sealant uses. The two-component product can be spray or flow dispensed.
09/04/2007 Wireless test access port (Wi-TAP) technology tests semiconductors and systems-in-package (SiPs) using a micro-scale radio frequency (RF) method rather than physical connection. The wireless probes interface to automated test equipment (ATE); all antennae structures and electronic components are CMOS compliant.
09/04/2007 An MPC Technology product, VIGON RC 101 cleans accumulated flux residues from ovens and general solder waste from wave soldering machines. The chemistry has no flash point, and removes eutectic and lead-free flux residues.
09/04/2007 Performing quality assurance (QA), characterization, and small-lot production, the V5000ep builds on the V5000e platform with increased automation, testing and characterizing all memory types from wafer sort through final test. When testing multi-chip packages (MCPs), the system uses proprietary Matrix technology to automatically shift resources from one die to another without manual reinsertion of the device under test (DUT).
09/04/2007 The Wyko SP9900 surface-profiling optical metrology tool monitors height, yield, roughness, and other parameters of multilayer organic panels for pin grid array (FC-PGA) and ball grid array (FC-BGA) flip chip packaging. It offers faster measurement, increased sample access, and up to 600 × 600 mm panel measurement within the SP equipment footprint.
09/04/2007 T-series TF-60C compound, a proprietary blend of PEEK polymer, Celazole polybenzimidazole (PBI), and carbon-fiber reinforcement, can replace polyimides and metals in semiconductor and electronics assembly. TF-60C is a melt-processable thermoplastic that tolerates harsh environments up to 300°C.
09/04/2007 The C3430 frequency controlled crystal oscillator (FCXO) suits wireline and wireless infrastructure, test-and-measurement, and military applications. The component line converts one input frequency to up to four independent output frequencies.
09/04/2007 Cohu Inc. named Jeffrey D. Jones as VP of finance and chief financial officer (CFO), succeeding John H. Allen. Allen will retire in November. Jones previously served with Delta Design, Inc., wholly owned subsidiary of Cohu.
09/01/2007 The Japanese market, with its focus on consumer electronics and telecommunications, has embraced chip/package co-design and optimization for wire-bonded and system-in-package (SiP) devices.
09/01/2007 Tin-lead solder was pressed into service as means of making reliable permanent interconnections between electronic elements in the early years of the electronics industry.
09/01/2007 Compounding sterile preparations (CSPs) are made utilizing aseptic technique. Aseptic technique is a microbiological term referring to the prevention of microorganism contamination.
09/01/2007 In the semiconductor industry challenges appear to be directly related to Moore’s Law. In reality the culprit is consumer demand for more functionality, faster speeds, and smaller features. Technically, the integrated circuit (IC) industry is progressing at a rate that’s unmatched by any other industry. Yet, moving forward, it faces technical hurdles that slow progress, and must create advanced solutions without increasing costs.
09/01/2007 Integral to the packaging process for over three decades, epoxy molding compounds have undergone significant advancements due to revolutions in semiconductor package geometries, and legislative requirements surrounding lead-free and “green” material adoption.
