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Taming 'wild' electrons in graphene

10/23/2017  Discovery could lead to novel electronic devices.

NRL clarifies valley polarization for electronic and optoelectronic technologies

10/20/2017  Many of today's technologies, such as, solid-state lighting, transistors in computer chips, and batteries in cell phones rely simply on the charge of the electron and how it moves through the material. In certain materials, such as the monolayer transition metal dichalcogenides (TMDs), electrons can be selectively placed into a chosen electronic valley using optical excitation.

Leti coordinating European project to improve drivetrains for electric vehicles

10/20/2017  CEA Tech's contribution includes Liten's knowhow in magnetic materials and simulation and Leti's expertise in wide-bandgap semiconductors.

North American semiconductor equipment industry posts September 2017 billings 

10/20/2017  Global semiconductor equipment billings of North American headquartered suppliers for September were $2.0 billion, down 12 percent from the peak level set in June of this year.

Microsemi launches Mi-V ecosystem to accelerate adoption of RISC-V

10/19/2017  The announcement comes as the company also introduces Mi-V RV32IMA and additional field programmable gate array (FPGA)-based soft CPU solutions ideally suited for designs utilizing RISC-V open instruction set architectures (ISAs).

IBM Technology influencer to deliver keynote address at The ConFab 2018

10/19/2017  The ConFab, to be held May 20-23 at The Cosmopolitan of Las Vegas, is excited to announce IBM's Dr. Rama Divakaruni will be the opening keynote for the 2018 conference.

New material for digital memories of the future

10/19/2017  Ferroelectric self-assembled molecular materials

IC Insights raises 2017 IC market forecast to +22%

10/19/2017  Strong growth to be driven by a 74% surge in the DRAM market and 44% jump in the NAND flash market.

ASE, Amkor and JCET expected to top TrendForce's revenue ranking of OSAT providers for 2017

10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

Strong solar and semiconductor demand but still a sizeable oversupply of polysilicon

10/18/2017  An oversupply of polysilicon will double in 2018 despite strong demand in solar and semiconductor markets, according to a report recently published by The Information Network.

Praxair signs long-term agreement to supply nitrogen to GLOBALFOUNDRIES

10/18/2017  Praxair will build, own and operate a plant to support GLOBALFOUNDRIESÂ’ advanced manufacturing processes at its Malta fabrication facility.

Samsung completes qualification of 8nm LPP process

10/18/2017  Samsung Electronics Co., Ltd. announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

Long nanotubes make strong fibers

10/17/2017  Rice University researchers advance characterization, purification of nanotube wires and films.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

Wafer shipments forecast to increase in 2017, 2018 and 2019

10/17/2017  Total wafer shipments this year are expected to exceed the market high set in 2016 and are forecast to continue shipping at record levels in 2018 and 2019.

SEMICON Europa 2017: Keynotes announced

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

Dr. Haijun Zhao, Dr. Liang Mong Song appointed as SMIC co-CEO and Executive Director

10/16/2017  Semiconductor Manufacturing International Corporation today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.

sureCore joins GLOBALFOUNDRIES FDXcelerator Partner Program

10/16/2017  sureCore to make its Low Power SRAMs available in 22FDX.

New MIPI Alliance Group collaborates with automotive industry experts to address interface specifications for automotive applications

10/16/2017  The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the formation of an Automotive Birds of a Feather (BoF) Group to solicit industry input from original equipment manufacturers (OEMs) and their suppliers to enhance existing or develop new interface specifications for automotive applications.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.