07/31/2007 July 17, 2007 -- /PRNewswire/ -- NEWPORT, U.K. -- Surface Technology Systems plc (STS) today announced that it has sold a VPX Pegasus system to Semefab, a Scottish-based semiconductor company that specializes in the design and manufacture of silicon IC and MEMS devices.
07/31/2007 July 18, 2007 -- /PRWEB/ -- MANSFIELD, MA -- Proven Process Medical Devices has relocated its U.S. headquarters to a new 43,000-square-foot facility in Mansfield, MA.
07/31/2007 July 19, 2007 -- MENLO, GA -- More than 200,000 gloves with the distinctive DuPont Kevlar(R) mark have rolled off the Best Manufacturing Company production line since the two companies teamed up earlier this year to provide cut-resistant hand and arm protection for the world's workforce.
07/31/2007 July 19, 2007 -- /PRWEB/ -- SAN JOSE, CA -- Gas detection equipment, a highly fragmented market, focuses mainly on enclosed and work environments where hazardous gas levels cause a serious concern for human health.
07/31/2007 July 19, 2007 -- SAN FRANCISCO, CA -- At SEMICON West 2007, Cymer, Inc. announced the company has been selected by ASML Holding NV (ASML) as the extreme ultraviolet (EUV) source supplier for its EUV scanners for high-volume manufacturing.
07/31/2007 July 16, 2007 -- /PRWEB/ -- SAN JOSE, CA -- The personal protective equipment industry is encountering new challenges as production processes are increasingly automated.
07/31/2007 July 16, 2007 -- IRVING, TX -- Carrington Laboratories, Inc. announced on July 13 that its wholly owned subsidiary DelSite Biotechnologies, Inc. took delivery of several thousand doses of the H5N1 influenza (bird flu) antigen from a secured source and is preparing to initiate America's first clinical program of a nasal powder bird flu vaccine, combining the H5N1 antigen with DelSite's novel GelVac(TM) dry powder delivery platform.
07/31/2007 In video interviews at SEMICON West, Dave Gross of AMD pleads AMD's case for collaboration to maximize the effectiveness of R&D dollars. Alain Diebold (U. at Albany) summarizes unresolved metrology issues at 45nm and discusses the future at 32nm. And John Allgair (ISMI assignee from AMD) outlines the group's current plans as it gears up for a larger presence in Albany and expand its metrology program -- look for intentional defect array wafers to be ready for mass production in 2-3 months.
07/31/2007 Promex Industries, Inc., will use Microbond's (Ontario, Canada) technologies and Mirror Semiconductor's (Irvine, CA) designs to develop advanced, complex packages. Introducing next-generation technologies requires engineering collaborations, said representatives of each company.
07/31/2007 The electronics group of Henkel marked the grand opening of its Yantai, China, solder sphere production facility, welcoming more than 300 guests and employees to the ceremony. This event follows the 2006 acquisition of Accurus Scientific Company Limited, a Taiwan-based solder sphere manufacturer.
07/31/2007 By Françoise von Trapp, managing editor
Following are announcements of expansion, integration, and partnerships made on the floor at SEMICON West this July. News comes from Palomar, Tessera and Alps Electronics, Besi, and Watlow.
07/31/2007 Burn-in material, a reusable thermal interface material (TIM), provides repeatable thermal performance over thousands of cycles, and offers an alternative to greases, phase change materials (PCMs), and gap pads in thermal module test applications.
07/31/2007 For use in flip chip packaging, EA-6800 and 6900 adhesives are designed for lead-free processing temperatures and fast cure times, respectively. Each adhesive reduces voiding from residual moisture within substrates.
07/31/2007 RoHS compliant, aluminum silicon carbide (AlSiC) metal-matrix composite lids target system-in-package (SiP) applications. The heat spreaders are said to reduce bowing and flexing with a low coefficient of thermal expansion (CTE) between die and packaging.
07/31/2007 A polymeric spin-on coating, WaferBOND HT-250, temporarily attaches device substrates to a carrier substrate, enabling wafer thinning and subsequent processing. It will reportedly permit advanced packaging processes such as the creation of through-silicon vias (TSVs), 3D stacking, and other etching, plating, and follow-on processes.
07/31/2007 A camera and detector combination, Impix, improves range, accuracy, repeatability, and feature recognition of the Revolution Nanotech X-ray inspection system. It also augments the system's computerized tomography (CT) inspection.
07/31/2007 The 20-2300 series of urethane potting compounds, targeting electronic assemblies exposed to extremely low temperatures or wet environments, reportedly maintains flexibility and softness at -40°C and above.
07/31/2007 The HPR-90 heated work holder suits photoresist, epoxy resin, and adhesives annealing; manual wire bonding; device heating; and other packaging processes. It offers a 90-mm heated area and 360° rotation. The heated area can be changed without moving the equipment.
Thermoelectric devices have been available for decades, and in that time the technology has not changed much. Thermoelectric modules based on thin-film thermoelectric materials have higher design flexibility, lower cost structure, and better performance than conventional thermoelectric solutions. Thin-film thermoelectric modules show significant promise to solve electronics and optoelectronics cooling.
