10/13/2017 ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.
10/13/2017 A new method that precisely measures the mysterious behavior and magnetic properties of electrons flowing across the surface of quantum materials could open a path to next-generation electronics.
10/13/2017 Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.
10/13/2017 ClassOne Group, provider of semiconductor processing systems, today announced a special new financing program that seeks to give more attractive options to equipment purchasers.
10/12/2017 Sun Chemical has entered into a license agreement to introduce a new family of molecular inks for the printed electronics market with Groupe Graham International (GGI).
10/12/2017 Next week, as part of the IEEE S3S 2017 program, MonolithIC 3D Inc. will present a paper (18.3) titled “A 1,000x Improvement in Computer Systems by Bridging the Processor Memory Gap”.
10/12/2017 GLOBALFOUNDRIES today unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.
10/11/2017 TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.
10/11/2017 Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices.
10/10/2017 ON Semiconductor agrees to purchase 30 percent incremental share of FujitsuÂ’s 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting in 40 percent ownership with plans to increase to 60 percent by the second half of 2018 and full ownership in the first half of 2020.
10/10/2017 The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to TechnavioÂ’s latest market research.
10/10/2017 A team led by Cory Dean, assistant professor of physics at Columbia University, and James Hone, Wang Fong-Jen Professor of Mechanical Engineering at Columbia Engineering, has definitively observed an intensely studied anomaly in condensed matter physics -- the even-denominator fractional quantum Hall (FQH) state -- via transport measurement in bilayer graphene.
10/10/2017 Using a simple layer-by-layer coating technique, researchers from the U.S. and Korea have developed a paper-based flexible supercapacitor that could be used to help power wearable devices.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
