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IDE sells wafer picker/sorter lines to Ricmar

06/07/2007  June 7, 2007 - Integrated Dynamics Engineering Inc. (IDE), headquartered in the US and Germany, says it has sold its line of wafer packers and wafer sorters to Austrian firm Ricmar Technology GmbH for an unidentified amount.

Analyst: Photomask market rebounding in 2007

06/07/2007  June 7, 2007 - The market for lithography photomasks continued to slow in 2006, reaching $2.2 billion (5.4% growth), but should pick up again in 2007 thanks to increased demand from the logic segment which uses more and higher-priced masks, according to a report from The Information Market.

Tronics and Alcatel partner on advanced MEMS DRIE

06/07/2007  Tronics Microsystems SA and Alcatel Micro Machining Systems have announced a joint development project on DRIE for extreme-performance MEMS. The partners hope to establish a new performance benchmark for the MEMS industry.

SEMICON West Preview

06/07/2007  SEMICON West will take place July 16–20 in San Francisco, bringing together equipment suppliers, SATS providers, R&D institutes, and related companies in the semiconductor packaging industry to highlight new processes, systems, and packages.

Webinar Spotlights Printing Flip Chip Bumps

06/07/2007  Speedline Technologies will host a webinar July 19, 2007, at 11am EST, focused on the parameters and challenges of stencil printing solder paste to form bumps in flip chip applications. The Webinar will provide process optimization advice and defect examples.

New InvenSense gyroscope improves position accuracy

06/07/2007  InvenSense, Inc. has released what it calls "the world's smallest and lowest cost dual-axis gyroscope"-- which also enables dead reckoning for GPS portable navigation devices.

Sony spending ~$500M for image sensor expansion

06/06/2007  June 6, 2007 - Identifying image sensors as a key focus area for its semiconductor business, Sony Corp. says it will invest approximately 60 billion yen (US $493.3 million) to expand its Kumamoto Technology Center (TEC) in Kyushu over the next three years.

Reports: DRAM spot prices climbing, outlook improving

06/06/2007  June 6, 2007 - Spot prices for DRAM memory have risen for a second straight week according to data from DRAMeXchange and Gartner, suggesting that prices may have finally fallen below costs and could be poised for a rebound.

Nanomanufacturing supply chain reaches beyond R&D

06/06/2007  The nascent nano supply-chain and production infrastructure shows signs of moving beyond R&D, says Small Times' Tom Cheyney, in our third report of findings from NSTI Nanotech 2007. He quotes keynoter John Hofmeister of Shell Oil (right).

PI's new motion controller enables picometer positioning

06/06/2007  Physik Instrumente, manufacturer of nanopositioning and piezo-based precision motion-control equipment for bionanotechnology, photonics, and semiconductor applications, says its new Nexline motion controller provides picometer-level resolution.

Feynman Nanotech Prize winner joins Nanoexa as CTO

06/06/2007  Nanoexa, a provider of high-performance clean energy storage solutions, has hired Dr. Deepak Srivastava as Chief Technology Officer.

MicroFluidic Systems begins Phase III contract to prepare BAND system for manufacturing

06/05/2007  May 23, 2007 -- /PRNewswire/ -- FREMONT, CA -- MicroFluidic Systems, a privately held company, announced today that it will begin its Phase III effort of the Bioagent Autonomous Networked Detector (BAND) development contract from the Department of Homeland Security's (DHS) Science and Technology Directorate.

Pharmaceutical Chemistry Outsourcing Conference unveils 2007 Speaker Faculty and Agenda

06/05/2007  May 17, 2007 -- /PRNewswire/ -- EAST RUTHERFORD, NJ -- The organizers of the annual Pharma ChemOutsourcing Conference and Exhibition are pleased to announce the 2007 event featuring 80 industry speakers from a diverse group of pharmaceutical and biotech companies for the September 10-11 show in New Jersey.

Despatch Industries sells custom nitrogen ovens to semi manufacturing company

06/05/2007  May 18, 2007 -- /PRWeb/ -- MINNEAPOLIS, MN -- Despatch Industries announced today the immediate sale of multiple custom nitrogen atmosphere ovens to an international semiconductor manufacturer.

Grandis, Inc. announces MTJ fab in Silicon Valley for STT-RAM technology

06/05/2007  May 18, 2007 -- /PRNewswire/ -- MILPITAS, CA -- Grandis Inc. announced the first magnetic tunnel junction (MTJ) fabrication facility in the United States dedicated to STT-RAM memory technology.

International Marine expands Eco-Safe ozone water disinfection system to more seafood processing plants

06/05/2007  May 21, 2007 -- /MARKET WIRE/ -- LOS ANGELES, CA -- Eco-Safe Systems USA, Inc. is pleased to announce that International Marine Products, Inc. has completed the purchase of additional Eco-Safe units for its Las Vegas and San Francisco plants.

CECO Environmental announces six new orders totaling approximately $12.7M

06/05/2007  May 22, 2007 -- /PRNewswire-FirstCall/ -- NEW YORK, NY -- CECO Environmental Corp., a leading provider of air pollution control and industrial ventilation systems, announced today that it has received six new orders totaling approximately $12.7 million.

Jacobs receives engineering and construction services contract from Genentech

06/05/2007  May 22, 2007 -- /PRNewswire-FirstCall/ -- PASADENA, CA -- Jacobs Engineering Group Inc. announced today that it is providing engineering and construction services for Genentech Inc.'s new manufacturing facility to be located in Tuas, Singapore.

Relsys International and Intrasphere Technologies announce strategic alliance

06/05/2007  May 22, 2007 -- /PRNewswire/ -- IRVINE, CA and NEW YORK, NY -- Relsys International and Intrasphere Technologies have announced a strategic partnership to offer joint solutions to the pharmaceutical and biotechnology industries.

Untangling CNT Interconnect Issues

06/05/2007  Since carbon nanotubes (CNTs) tend to grow with erratic kinks and bends in the tube structure, a group of engineers from Stanford University has devised circuit-simulation algorithms that eliminate bad connections caused by errant CNTs. The work, which involves fine grids rather that direct interconnects, is being presented at the Design Automation Conference (DAC), June 4–8 in San Diego.