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Lam Research announces 2017 Supplier Excellence Award recipients

09/14/2017  Lam Research Corp. today announced it has recognized seven companies with Supplier Excellence Awards.

Orbotech's SPTS Technologies' Sigma fxP PVD system chosen by Chipmore

09/14/2017  SPTS Technologies today announced that it has been selected by Chipmore Technology Corporation Limited.

Josh Shiode joins Semiconductor Industry Association as Government Affairs Director

09/13/2017  In this role, Shiode will help advance the U.S. semiconductor industryÂ’s key legislative and regulatory priorities related to semiconductor research and technology, product security, and high-skilled immigration, among others.

Soitec launches FD-SOI pilot line in Singapore

09/13/2017  This is the first stage in beginning FD-SOI production in Singapore and providing multi-site FD-SOI substrate sourcing to the global semiconductor market.

Cadence delivers design and analysis flow enhancements for TSMC InFO and CoWoS 3D packaging tech

09/13/2017  Cadence Design Systems, Inc. today announced new capabilities that complete its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

Entegris expands its Taiwan tech center to add new microcontamination analysis and tech development capacity

09/13/2017  Entegris Inc., a specialty materials provider, today announced the expansion of its Taiwan Technology Center for Research and Development (TTC) in Hsinchu, Taiwan.

Quantum sensors decipher magnetic ordering in a new semiconducting material

09/13/2017  For the first time, physicists have successfully imaged spiral magnetic ordering in a multiferroic material.

New manufacturing process for SiC power devices opens market to more competition

09/13/2017  Researchers from North Carolina State University are rolling out a new manufacturing process and chip design for silicon carbide (SiC) power devices, which can be used to more efficiently regulate power in technologies that use electronics.

SEMI reports second quarter 2017 worldwide semiconductor equipment figures

09/12/2017  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$14.1 billion for the second quarter of 2017.

More than 45,000 expected at SEMICON Taiwan 2017

09/12/2017  Upbeat about the growth prospects of Taiwan's electronics sector, more than 45,000 visitors are expected to attend SEMICON Taiwan 2017 which opens tomorrow at Taipei's Nangang Exhibition Center.

KLA-Tencor releases five patterning control systems for sub-7nm IC manufacturing

09/12/2017  KLA-Tencor Corporation today introduced five patterning control systems that help chipmakers achieve the strict process tolerances required for multi-patterning technologies and EUV lithography at the sub-7nm logic and leading-edge memory design nodes.

Medicine of the future: New microchip technology could be used to track 'smart pills'

09/12/2017  Caltech researchers have developed microscale devices that relay their location in the body.

eBeam Initiative surveys report increased optimism for EUV and new photomask trends

09/11/2017  Survey results to be presented at 2017 Photomask Technology Symposium.

New deionized water vapor delivery module from Brooks Instrument

09/11/2017  Brooks Instrument will be exhibiting at SEMICON Taiwan 2017 with a new vaporization product, mass flow controllers with high-speed EtherCAT, and a broad range of other mass flow meters, controllers and capacitance manometers for semiconductor manufacturing.

Rudolph Technologies launches new Truebump technology at SEMICON Taiwan 2017

09/11/2017  The Dragonfly System now features fast, accurate and repeatable 3D bump metrology.

EV Group receives multiple lithography and metrology system orders for wafer-level optics manufacturing

09/11/2017  Demand for manufacturing solutions driven by consumer electronics, mobile and other applications requiring advanced 3D / optical sensors.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.