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Nanotech X-ray Systems: A Point of Focus

03/01/2007  The term “nanotechnology” is no longer new to most of us, thanks, in part, to the media. Developments recently made to open-type X-ray sources and X-ray imaging detectors may provide an end-user with the ability to image features in the nanometer range.

Satisfying the Appetite of Power-hungry Chips

03/01/2007  Increasing complexity of chips - more transistors operating faster at lower and varied voltages with more I/O - is a well-known phenomenon.

Wire Bond Technology: The Great Debate: Ball vs. Wedge

03/01/2007  Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball- or wedge-bond technologies.

Sockets Meet Future Technology Challenges: Part I

03/01/2007  Though the basic requirement of sockets remains unchanged - making a stable electrical contact from the device to the PCB - the future holds even more demands on this important electrical/mechanical device.

SST March 2007: Freescale's process and fab strategy puts a new spin on MRAM

03/01/2007  Freescale was recently honored with a product award for its magnetoresistive random access memory (MRAM) product, the Freescale MR2A16ATS35C 4-Mbit MRAM.

Nikon touts shipment of 45nm immersion tool

02/28/2007  February 28, 2007 - Nikon Corp. says it has shipped its newest ArF immersion lithography scanner, the NSR-S610C, to an unnamed IC manufacturer for 45nm production work and 32nm development. The selection came after a "one-year, head-to-head evaluation," according to Kazuo Ushida, president of Nikon Precision Equipment Co.

OSD Demand Outpaces ICs

02/28/2007  The optoelectronics, sensors and actuators, and discretes (OSD) market grew 10% in 2006, one percentage point higher than the IC market's 9% increase, says IC Insights' "O-S-D Report." Optoelectronics and discretes each represented 43% of the $38.2 billion OSD market revenue. Sensors and actuators hit $5.3 billion, with MEMS-based devices accounting for 80% of revenues.

SolVision Nabs IC Inspection Contract

02/28/2007  A major Korean semiconductor contract manufacturer (CM) selected AV6010 vision systems from SolVision Inc. for IC package inspection at its assembly and test house. The manufacturer will use multiple systems to inspect packages, including advanced flip chip devices.

Nanogen wins patents for diabetes and Alzheimers biomarkers

02/28/2007  Nanogen wins patents for diabetes and Alzheimers biomarkers

Project on Emerging Nanotech progress report

02/28/2007  In Washington, D.C., the Project on Emerging Nanotechnologies delivered a presentation titled Nanotechnology: A Progress Report on Understanding Occupational Safety and Health Issues. Dr. Paul A. Schulte of the National Institute for Occupational Safety and Health made the presentation.

Luminescent touts 45-32nm benefits of "ILT"

02/27/2007  February 27, 2007 - At this week's SPIE Advanced Lithography Symposium, Luminescent Technologies claims to have data showing customers using its inverse lithography technology (ILT) in 45nm and 32nm development efforts. The company is touting ILT as an alternative to optical proximity correction (OPC), offering better pattern fidelity and broader lithography process windows.

SPIE keynotes dismiss EUV

02/27/2007  The organizing committee of SPIE Advanced Lithography Symposium -- the conference formerly known as "Microlithography" -- probably didn't plan for the Monday (Feb. 26) keynote addresses to dismiss EUV lithography, but that's exactly what happened. Prior to three days of detailed EUV presentations, executives presented perspectives that do not include place for this next-generation lithography technology any time in the near future.

Farewell to industry peer

02/27/2007  Our condolences to family and friends of Dr. Doug Smeaton, president and CEO of Semiconductor Insights, who passed away on Feb. 18 after a diving accident. He served as president/CEO of the firm since 1992, led its management buyout in 1994, and oversaw its expansion from just over a dozen employees to over 155.

Innovation Society and TÜV SÜD develop "world's first" certifiable nanosafety label

02/27/2007  Innovation Society and TÜV SÜD develop "world's first" certifiable nanosafety label

Report: TSMC expanding Shanghai ops with NXP's used tools

02/27/2007  February 27, 2007 - Taiwan Semiconductor Manufacturing Co. (TSMC), recent beneficiary of relaxed government regulations regarding transfer of process technologies to mainland China, will likely utilize used equipment from NXP Semiconductor in order to triple the output from its 200mm, 30,000 WPM capacity site in Shanghai, according to the Taiwan Economic News.

Discera begins shipping MEMS oscillators

02/27/2007  In addition to announcing the shipment of long-anticipated silicon oscillators, Discera Inc. boasts an agreement to help push those MEMS into OEM products. Discera hopes the moves will shake up the $3.5 billion market for quartz crystal oscillators.

Americas Kitchen recalls "Wellsley Farms" Green Bean Casserole because of possible health risk

02/27/2007  February 22, 2007 -- /FDA News/ -- FOR IMMEDIATE RELEASE -- Alpharetta, GA -- Americas Kitchen of Alpharetta, GA, is recalling its 32-ounce packages of "Wellsley Farms" Green Bean Casserole sold from September 1, 2006 through February 22, 2007 because they have the potential to be contaminated with Listeria monocytogenes, an organism which can cause illness, mild, moderate or even severe.

Castle Produce announces the recall of cantaloupe melons due to Salmonella contamination

02/27/2007  February 23, 2007 -- /FDA News/ -- Los Angeles, CA -- Castle Produce, a subsidiary of Tropical Produce, Inc., a wholesale importer of fresh fruit and vegetables announced the recall of cantaloupes in California due to potential health concerns.

Air Products and Babcock Brown launch equipment remarketing venture

02/27/2007  February 26, 2007 -- /PRNewswire-FirstCall/ -- LEHIGH VALLEY, Pa. -- Air Products (NYSE:APD) and international investment and advisory firm Babcock & Brown today jointly announced the signing of an equipment refurbishment and remarketing agreement.

SATS Industry Grows 26%

02/27/2007  The global semiconductor assembly and test services (SATS) market grew 25.7% in 2006, the fifth consecutive year this sector has exhibited double-digit growth, according to preliminary reports from Gartner, Inc. The SATS industry, the outsourcing portion of back-end packaging, assembly, and test, is propelled by major transitions to advanced packaging, including wafer-level, chip-scale, flip chip, and system-in-package (SiP) methods, said Jim Walker.