01/25/2007 January 25, 2007 - SEMATECH and Tokyo Electron Limited (TEL) have entered into a multiyear joint development program to improve prospects for using 3D interconnect technology and high-mobility channel materials in advanced semiconductor manufacturing, both sides said today in a statement.
01/25/2007 January 25, 2007 - The semiconductor lithography market expanded at nearly twice the rate of the rest of the equipment industry in 2006 to top $6.7 billion, finally eclipsing the $6.0 billion mark achieved back in 2000, according to a report from The Information Network.
01/25/2007 OKI and ZyCube announced an agreement to cooperate in commercializing ZyCSP™ an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP). The companies' state that compared to current CMOS and CCD sensor packages, the ZyCSP™ achieves thinner, smaller, lighter and highly reliable characteristics.
01/25/2007 A team of UCLA and Caltech chemists reported the successful demonstration of a large-scale, "ultra-dense" memory device that stores information using reconfigurable molecular switches. This research represents an important step toward the creation of molecular computers.
01/24/2007 Synova appointed Notker Kling as general manager, overseeing operations in the company's North American micromachining centers (MMCs) in Boston and Silicon Valley.
01/24/2007 Surface Technology Systems plc (STS) won a European Union (EU) tender from the Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Munich, Germany) for an MPX Pegasus system. The advanced silicon etch (ASE) system has a single process chamber with manually loaded vacuum loadlock and a carousel wafer handler for 2-4 wafers. Fraunhofer IZM will use the system in industrial R&D for packaging applications.
01/24/2007 Bosch Sensortec announced the release of its new small digital SMB380 acceleration sensor, suited for human machine interfaces (HMI), free-fall detection, as well as mobile and ultra-low-power applications. Measuring only 3 mm x 3 mm x 0.9 mm, the SMB380 fits into the smallest mobile devices.
01/24/2007 Tokyo Ohka and Hitachi have demonstrated patterns with 28nm half-pitch resolution, with EUV resist made using small molecules that eliminate much line-edge roughness.
01/24/2007 Advanced Diamond Technologies, Inc., providing diamond films for industrial, electronic, mechanical, and medical applications, received a $500,000 Phase IIB Small Business Innovation Research (SBIR) grant from the National Science Foundation (NSF) for the continued development of diamond-enhanced mechanical seals for pumping applications.
01/24/2007 Plextronics, a developer of active layer technology for printed electronic devices, announced it has received $750,000 in funding from the Sustainable Energy Fund (SEF) of Central Eastern Pennsylvania to further development of technology for organic solar cells.
01/24/2007 The future of MEMS and 3-D packages relies on similar factors — consumer drivers and increased integration — according to industry analysts. 3-D integration will affect MEMS and IC packaging industries, says Yole Développement's "3-D ICs." Advanced packages require acceptance from the consumer market to reach targets for technological advancement, commercialization, and sector revenues.
01/23/2007 Nextreme Thermal Solutions named Phil Deane, Ph.D., senior technology fellow, appointed to address thermal management and thermoelectric packaging issues, and to define product and packaging strategies for customers with the company's thermoelectric coolers. Thin-film thermoelectric technology represents an advancement in in-package cooling, said Deane.
01/23/2007 The growing consumer appetite for large-area flat-panel displays (FPDs) -- particularly for TVs, but also for notebook computers and PC monitors -- presents enormous opportunities for FPD makers. But to meet demand they must first overcome some major technological and manufacturing hurdles, according to Jyh Chau Wang, VP of Taiwanese LCD supplier Chi Mei Optoelectronics, speaking at the recent Industry Strategy Symposium (ISS) at Half Moon Bay, CA.
01/23/2007 Consumers' continuous thist for more capacity and lots more memory will drive a powerful upgrade cycle for already popular portable products like the iPod. Beyond these follow-ons to existing products, look for the emergence of a dazzling array of clever chip-based gadgets, including virtual objects, brain fingers, bird song sleuths, and a "health buddy" for the chronically ill, all described at the Industry Strategy Symposium (ISS) at Half Moon Bay, CA.
01/23/2007 January 23, 2006 - Seeking a more robust path toward leading-edge chip technology R&D, Freescale Semiconductor is aligning with longtime partner IBM and its chipmaking alliance including Chartered, Samsung, and Infineon -- at the expense of programs currently done through its participation in the Crolles chipmaking partnership.
01/23/2007 January 23, 2007 - In its conference call announcing 4Q06 financial results, Texas Instruments Inc. execs revealed plans to increase the company's use of foundries and reduce spending and internal process development, in an effort to manage demand and investments based on lessons learned from a similar market environment two years ago.
01/23/2007 January 22, 2007 -- /PRNewswire/ -- ENGLEWOOD, Colo. -- Baxa Corporation has published the 2007 dates for training at its STAR (Skills Training, Academics and Resources) Center.
01/23/2007 January 22, 2007 -- /BUSINESS WIRE/ --BANGKOK, Thailand -- Fabrinet, a leading global manufacturing services provider of complex optical components, announced that its latest factory, completed in Nov 2005, is near capacity and that a foundation-stone laying ceremony for a new factory in its Pinehurst campus manufacturing complex near Bangkok, Thailand, will occur today.
01/23/2007 January 22, 2007 -- /PRNewswire-FirstCall/ -- VIENNA, Va. -- CEL-SCI Corporation (AMEX:CVM) has signed a letter of intent with BioProperties, Inc., a privately held real estate firm specialized in the biomedical sector, to acquire and build out to CEL-SCI's specifications a turn-key CGMP drug manufacturing facility for CEL-SCI's cancer product Multikine(R).
01/23/2007 Vistec Semiconductor Systems received orders for infrared inspection equipment from a Japanese sensor manufacturer and an European MEMS manufacturer.
Bosch Sensortec announced the release of its new small digital SMB380 acceleration sensor, suited for human machine interfaces (HMI), free-fall detection, as well as mobile and ultra-low-power applications. Measuring only 3 mm x 3 mm x 0.9 mm, the SMB380 fits into the smallest mobile devices.