12/06/2006 Integrated Sensing Systems (ISSYS), Ypsilanti, MI, purchased and installed an AML Bonder from OAI, along with a mask aligner system. ISSYS purchased the stand-alone wafer bonder and complementary mask system to increase production of MEMS devices.
12/05/2006 Yole Développement's market research report, "Status of the MEMS Industry," examines markets, fiscal forecasts, and geographical considerations for MEMS through 2010. Yole studies various business models in the sector as well as emerging MEMS activities in India and China. Analysis of the packaging and test business linked to MEMS manufacturing is also supplied. Yole expects MEMS to reach $10B by 2010, and defines reasons for growth.
12/05/2006 Andy Mackie joined Indium Corporation as product manager for semiconductor packaging materials. Mackie, based at global headquarters in Clinton, will manage marketing of packaging products and report to the director of solder products.
12/05/2006 Do roadmaps make a difference? According to Bill Bottoms, Ph.D. — keynote speaker at MEPTEC's recent "IC Packaging and Test Roadmaps" symposium — the answer is yes. The first industry roadmap for semiconductors, Moore's Law, has been driving innovation for over three decades, but we have reached a point where packaging is the limiting element.
12/05/2006 Momentive Performance Materials, Inc., created by the sale of GE's Advanced Materials business, will operate as a global entity focused on silicone, quartz, and ceramic technology. The acquisition is valued at $3.8B.
12/05/2006 Celebrating its 30th anniversary, SEMICON Japan drew exhibitors showcasing products and processes alongside symposia, seminars, and standards meetings December 6 – 8 in Chiba, Japan. Vanguard topics of MEMS and nanotechnology demonstrated the show's motto "sharing expertise, making innovation." The SEMI Technology Symposium (STS), seminars, and a 30th anniversary gala provide a range of opportunities for networking.
12/05/2006 The IBIS-lab solder bump inspection equipment complements the IBIS in laboratory development or small-scale prototyping. Manually operated, the system offers process control software targeting solder bump metrology, true white light interferometry, and massively parallel digital signal processing.
12/05/2006 Measuring 120 × 100 × 30 mm, the RTE870/C Light Emulator comprises a 60-Kbyte emulation memory, interfaces for an MCU probe and host-connection, and other functions.
12/05/2006 A motorized take-up option gathers the protective liner from dicing tape operating on wafer mounters. The system gathers the liner into a disposable core.
12/05/2006 Nanogen Inc., a San Diego developer of advanced diagnostic products, announced it has been awarded a $4.5 million contract from the U.S. Centers for Disease Control and Prevention (CDC) to develop a unique multi-analyte Point-Of-Care (POC) diagnostic assay for influenza in support of the U.S. Government's efforts to strengthen its readiness for a potential influenza pandemic.
12/05/2006 Developers of MEMS and flat panel displays now have a powerful new development and productivity tool from GenISys GmbH, a leading-edge provider of software solutions for efficient processing optimization of microstructure fabrication.
12/05/2006 Five Star Technologies of Cleveland has closed an investment round of $7.1 million dollars led by Morgenthaler Ventures. Other investors include CTTV Investments (ChevronTexaco), Early Stage Partners, Industrial Technology Ventures, and Reservoir Venture Partners.
12/04/2006 Cookson Electronics Assembly Materials (CEAM) will reorganize its manufacturing operations in the North America region, incorporating a new manufacturing plant and shifting some production out of the U.S. Implementation will occur over the next six to 12 months.
12/04/2006 The electronics group of Henkel acquired Accurus Scientific Co. Ltd., based in Taiwan. The manufacturer produces solder spheres and type 1 – 7 solder powders for advanced packaging and PCB assembly. By acquiring a company headquartered in Tainan, Taiwan, Henkel gains technical and market support in that region, establishing a Taiwan base.
12/04/2006 The University of Alberta's NanoFab chose SUSS MicroTec's ELAN CB6L wafer-bonding equipment for its research and production activities. The NanoFab is an open access micro- and nano-fabrication facility used by more than 130 research groups from the University of Alberta, other Canadian universities, and industry. The manual bonder will be used in nanotechnology research, RF MEMS switches for wireless applications, and other research activities.
12/04/2006 NL Nanosemiconductor GmBH acquired Zia Laser, Inc., to advance quantum dot technology for IC and optoelectronics manufacture. The transaction closed with each company securing board and investor approval; financial terms were not disclosed.
12/04/2006 J. P. Sercel Associates (JPSA) announced a new integrated Z-theta motorized stage that it says offers high precision operation for wafer processing and positioning.
12/04/2006 Dec. 4, 2006 -- ICF International of Fairfax, Va., released an analysis of the U.S. Federal Government's efforts to research the human health and environmental consequences of nanotechnology.
12/04/2006 Dec. 4, 2006 -- XCOM Wireless Inc., a Signal Hill, Calif., developer of radio frequency products, announced it selected Innovative Micro Technology, a Santa Barbara, Calif., MEMS contract manufacturer, to manufacture die for its RF MEMS relay product.
Dec. 4, 2006 -- XCOM Wireless Inc., a Signal Hill, Calif., developer of radio frequency products, announced it selected Innovative Micro Technology, a Santa Barbara, Calif., MEMS contract manufacturer, to manufacture die for its RF MEMS relay product.