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SiFive and Rambus to provide IP to the 'DesignShare' economy

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

Silego announces shipping more than 3 billion configurable mixed-signal ICs

08/22/2017  Silego Technology today announced shipping three billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In addition, Silego announced it shipped more than one hundred million units in the month of July.

LTX-Credence ships the 600th PAx test system for testing RF front end devices

08/22/2017  LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customersÂ’ high volume manufacturing requirements.

OLED encapsulation materials market to grow 16% CAGR to $233M by 2021

08/21/2017  The popularity of organic light-emitting diode (OLED) TVs and smartphones has boosted not only the OLED display market but also the OLED encapsulation materials market.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

Global GaAs wafers market to grow at a CAGR of 11.9% by 2021

08/21/2017  The global gallium arsenide wafer market to decline at a CAGR of 11.9% during the period 2017-2021.

'Electronic skin' takes wearable health monitors to the next level

08/21/2017  A soft, stick-on patch collects, analyzes and wirelessly transmits a variety of health metrics from the body to a smartphone.

Atomically thin layers bring spintronics closer to applications

08/21/2017  University of Groningen scientists led by physics professor Bart van Wees have created a graphene-based device, in which electron spins can be injected and detected with unprecedented efficiency.

PC DRAM contract price rose by over 10% sequentially and global DRAM revenue increase by 16.9% sequentially Q2

08/18/2017  Global DRAM revenue reached a new historical high in the second quarter of 2017, according to DRAMeXchange.

Lam Research takes uniformity control to the edge

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

Rice University materials scientists create 2-faced 2-D material

08/16/2017  The Rice laboratory of materials scientist Jun Lou has made a semiconducting transition-metal dichalcogenide (TMD) that starts as a monolayer of molybdenum diselenide. They then strip the top layer of the lattice and replace precisely half the selenium atoms with sulfur.

New ultrathin semiconductor materials exceed some of silicon's "secret" powers

08/16/2017  Electrical engineers at Stanford have identified two semiconductors that share or even exceed some of siliconÂ’s desirable traits, starting with the fact that all three materials can "rust."

SIA statement regarding Trump Administration action to protect U.S. intellectual property in foreign markets

08/16/2017  The Semiconductor Industry Association (SIA) released a statement in response to the Trump Administration's decision to set in motion a process led by the United States Trade Representative to investigate China's unfair trade practices.

DRAM, NAND flash, automotive analog/logic among bestgrowing ICs

08/15/2017  Topping the chart of fastest-growing products is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment throughout the first half of 2017.

Ultrathin Layers with Large Contact Area on Carbon Fibers as High-Performance Electrode

08/15/2017  To meet the novel functions of next-generation electronics, including foldable displays, flexible power sources are needed.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Vacuum subsystems: largest and fastest growing market segment

08/14/2017  The increase in vacuum process intensity of the semiconductor industry means that by 2022, the market for vacuum subsystems could be up to 62 percent higher than todayÂ’s value of $1.9 billion.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.