10/23/2006 By Stefan Wurm, SEMATECH, Austin, Texas
Extreme ultraviolet (EUV) technology maturity must be demonstrated by the performance of the first EUV lithography (EUVL) alpha tools, by the readiness of EUVL infrastructure to support beta-level EUVL lithographic performance in the near future, and by the overall cost of ownership (CoO) of EUVL. ...
10/23/2006 October 23, 2006 - STMicroelectronics has licensed One NAND flash memory technology from Samsung Electronics Co. Ltd., with support starting in early 2007, the companies announced. The technology will be used in various applications including mobile devices and handsets.
10/23/2006 October 23, 2006 - A division between large and smaller cluster-tool suppliers has developed along open architecture adhering to industry standards, and growth is slow for companies that are actively seeking to make their tools compatible, according to a report from The Information Network.
10/23/2006 ATE standards group widens scope to entire test process
October 23, 2006 - The Semiconductor Test Consortium (STC), main proponent of the Openstar test interface, says it is expanding its scope with a new initiative to enable development of automatic test equipment (ATE) peripheral interface standards.
10/23/2006 October 23, 2006 - Memory chipmakers' conversion to copper damascene interconnect materials will drive 26% growth in demand for copper slurry for CMP, according to new data from market research firm The Information Network.
10/23/2006 EV Group and Datacon Technology GmbH installed an EVG540C2W system at Datacon's application laboratory, for advanced chip-to-wafer (AC2W) development work.
10/23/2006 Benchmark Technologies of Lynnfield, Mass., and Holographix LLC of Hudson, Mass., announced they have entered into an exclusive manufacture and resale agreement for the fabrication and distribution of custom nano-imprint templates.
10/23/2006 EV Group, a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets and Datacon Technology GmbH, a leading supplier of flip-chip and die bonding equipment, announced the installation of an EVG540C2W System at Datacon.
10/23/2006 Industrial Nanotech Inc. of Naples, Fla., announced that Kolorgen Ltd., an international distributor, has reached an agreement with one of the largest dyehouses in Turkey for the application of the company's Nansulate coatings on all extreme temperature equipment.
10/23/2006 The Pellissippi Research Center, a new 45-acre park in the Knoxville-Oak Ridge Innovation Valley region, announced that its first tenant will be Molecular Pathology Laboratory Network (MPLN). The Maryville- based molecular diagnostic company will build a new 70,000-square-foot, state- of-the-art laboratory on a promontory in the new park.
10/23/2006 Infineon Technologies introduced its SP35 Tire Pressure Sensor, the first device to incorporate all the major active functions of a wheel-mounted Tire Pressure Monitoring System (TPMS) module into a single package.
10/20/2006 IMEC transferred its copper-top interconnect process technology to production at National Semiconductor's Malacca, Malaysia, facility. Copper-top interconnect — a low-resistance, post-passivation interconnect module— was designed to provide efficiency and smaller chip size for analog and mixed signal ICs.
10/20/2006 BioForce Nanosciences Inc, a nanotechnology tools and applications company and a wholly owned subsidiary of BioForce Nanosciences Holdings Inc (OTC Bulletin Board: BFNH.OB), reported that it has completed the first Canadian installation under the pilot placement program of the Nano eNabler system, at the Institute for Optical Sciences in Toronto.
10/20/2006 The UK government has published a progress report which provides an update on the government's direction and details of progress made on research into possible risks posed by engineered nanoparticles to human health and the environment.
10/19/2006 October 19, 2006 - Among several announcements made prior to IMEC's annual meeting next week, IMEC and ASML claim they've proven that double-patterning 193nm immersion lithography (NA=1.2) can be a viable interim solution -- at least technically -- for flash and logic manufacturing at the 32nm node, until extreme-ultraviolet (EUV) lithography achieves production-ready levels.
10/19/2006 For the second month in a row, the North American-based manufacturers of semiconductor equipment posted equivalent amounts in bookings and billings, creating a September book-to-bill ratio of 1.00, according to SEMI's monthly report.
10/19/2006 Diodes, Inc. ranked among the "200 Best Small Companies," listed yearly by Forbes Magazine, scoring 37th overall. The company made the list three years consecutively.
10/19/2006 October 19, 2006 - Samsung Electronics Co. Ltd. says it has developed a 50nm DDR2 DRAM chip utilizing 3D design and multilayered dielectrics, a process that enhances performance and data storage capabilities.
10/19/2006 Flip chip and wafer-level packaging (WLP) usage is expanding into a broader range of devices, according to TechSearch International's report, "Flip Chip and WLP: 2006 Market Update and Technology Developments." The study finds flip chip and WLP growing by 24% from 2005 to 2010, and predicts that flip chip substrate limitations will be resolved by 2007.
10/19/2006 October 19, 2006 - Aviza Technology Inc., Scotts Valley, CA, has received a GBP 1.2 million (US $2.2 million) multiyear grant from the Welsh Assembly Government's Regional Selective Assistance program, to help with Aviza's planned GBP 6.4 million (~$12.0 million) expansion of R&D capabilities at its site in Newport.
