10/10/2006 October 10, 2006 - Nikon Corp. and Brion Technologies Inc. are partnering to combine Brion's high-performance computational lithography technology with Nikon's high-NA immersion equipment, to deliver "lithography-enabled DFM applications."
10/10/2006 Silicon Microstructures Inc. (SMI) of Milpitas, Calif., announced production levels of more than 40,000 pressure sensors per day on its recently installed six-inch wafer MEMS manufacturing line.
10/10/2006 October 10, 2006 - STMicroelectronics and Hynix Semiconductor have officially opened their $2 billion joint frontend memory manufacturing facility in Wuxi City, China, which will manufacture both NAND flash and DRAM memories on 200mm and 300mm lines by the middle of next year.
10/10/2006 October 10, 2006 - X-Fab Silicon Foundries is rolling out a new two-part program offering 0.35-micron and 0.18-micron RF-CMOS processes, for communications end-markets.
10/10/2006 Optoelectronic materials supplier Braggone of Oulu, Finland, announced a new product line intended to enable end-user manufacturers of flat panel displays to cost effectively tune their newest product models to significantly better levels of quality and performance.
10/10/2006 Bio-nano company pSivida Ltd. of Perth, Australia, announced that the first patient has been implanted with BrachySil for the treatment of inoperable pancreatic cancer at Guys and St Thomas' NHS Foundation Trust Hospital in London, a major center for cancer therapy in the United Kingdom.
10/09/2006 sp3 Diamond Technologies, Inc., and Ceramics Process Systems formed a strategic partnership geared towards electronics packages with enhanced thermal dissipation. The companies will provide aluminum silicon carbide (AlSiC) packages incorporating diamond pins.
10/09/2006 October 9, 2006 - Silicon-on-insulator (SOI) wafer manufacturer Soitec, Bernin, France, says it expects to achieve its previous guidance of about 400 million Euros (?1 = US$1.25) in sales during its 2006-2007 fiscal year, representing about 50% annual growth. The company noted the anticipated sales growth is the result of regular updates to existing customer contracts, and also denied rumors concerning the loss of an American customer.
10/09/2006 October 9, 2006 - Just a month after upgrading its outlook for the DRAM market, analyst firm iSuppli Corp. says the storm clouds are gathering again -- and the NAND flash outlook isn't looking great either. The firm has recast its outlook for the DRAM segment to "neutral" from "positive," while the NAND flash memory is back down to "negative" from "neutral," according to Nam Hyung Kim, director and principal analyst.
10/09/2006 Ted Vucurevich, senior vice president for advanced R&D and chief technology officer of Cadence Design Systems, will keynote the In-Stat Fall Microprocessor Forum 2006, on October 10th in San Jose, CA. Vucurevich will speak on performance, power, and function considerations for next-generation chip design.
10/09/2006 GlobalTRONICS, October 10 – 13 in Singapore, will emphasize the effect of the RoHS Directive on electronics manufacturing. Pooling design service, technology, and manufacturing service providers, the show will allow all aspects of SMT assembly to be represented and educated on environmentally friendly electronics manufacturing.
10/09/2006 October 9, 2006 - Participants at the recent 3rd Annual International Symposium on Advanced Gate Stack Technology have narrowed their consensus about their strategies for implementing high-k/metal gate stacks in 32nm- and beyond process technologies.
10/09/2006 October 9, 2006 - Taiwan's top two foundries, TSMC and UMC, said sales slipped slightly in September but showed mid-single-digit growth from a year ago. Meanwhile, one analyst thinks TSMC is poised to bump up FY07 capex by as much as 25% to prep for its 65nm ramp.
10/09/2006 The U.S. Food and Drug Administration (FDA) will be holding a public meeting on nanotechnology as it relates to FDA-regulated products on Tuesday in Bethesda, Md.
10/09/2006 Alcatel Micro Machining Systems, an Annecy, France, supplier of deep silicon etching equipment (DRIE) for MEMS and 3D Semiconductors, announced that it has received a multi-million dollar order from Xintec Inc. in Taiwan for its new AMS 200 "I-Productivity" production tool for advanced Wafer Level Chip Size Packaging (WLCSP) technology.
10/09/2006 U.S. Department of Energy Secretary Samuel W. Bodman announced that Sandia National Laboratories is the new home of the National Laboratory Center for Solid-State Lighting Research and Development.
10/09/2006 Boston University announced that Thomas Bifano, a professor in its College of Engineering, has been named director of the Boston University Photonics Center. Bifano has served as the center's interim director since January, when founding director Donald Fraser retired.
10/06/2006 Apache Design Solutions and NEC Electronics collaborated to address power integrity challenges common to system-in-package (SiP) designs. The companies developed a methodology based on system-on-chip (SoC) solutions from Apache, with NEC Electronics providing adaptations for SiP technologies and design.
10/06/2006 STMicroelectronics, a leading supplier of MEMS devices, introduced the first two devices in its new family of low-g linear accelerometers, distinguished by small form factor and low power consumption. The LIS302 sensors are intended to meet the growing demand for smart functionality, such as hard-disk drive protection and motion-controlled operation, in mobile phones, digital audio players, and laptops.
