05/16/2006 123-38A/B-187 thermally conductive underfill epoxy is designed specifically for flip chip assembly. It is a nitride-filled, 2-component compound designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface.
05/16/2006 Singapore — Advanced Interconnect Technologies (AIT) is adding more than 30,000 sq ft. to its Batam, Indonesia, assembly and test factory, bringing the total to 400,000 sq ft. The expansion is slated for completion by September 2006 and will dedicate to final test, which will allow them to meet growing demand for full turnkey assembly and test services.
05/16/2006 AdVantis XS mixes semiconductor and standard surface mount assembly in one machine with proprietary VRM linear motors for accuracy and repeatability at ±9 µm at ±3 sigma. AdVantis XS provides a low-cost alternative for placing flip chips and other advanced packages with high accuracy.
05/16/2006 The AS13985 low-dropout, 150-mA voltage regulator is designed for use with low equivalent series resistance (ESR) output capacitors in mobile phones, PDAs, MP3 players, and other battery-powered devices. With guaranteed output of 1 to 22 µF, 5-Ω ESR ensures low output impedance at high frequencies.
05/16/2006 May 16, 2006 - Advanced Forecasting sees a 33% jump in sales of etch equipment in 1H06, leading to a plateau in 3Q and a potential decline in 4Q.
05/16/2006 May 16, 2006 - Worldwide silicon wafer area shipments increased 3% in 1Q06 vs. the prior quarter, and demand has increased nearly 29% from a year ago, but quarter-on-quarter it's slowed down over the past year, according to new data from SEMI.
05/16/2006 May 15, 2006 - SUMCO Corp., the wafermaking JV between Sumitomo Metal Industries Ltd. and Mitsubishi Materials Corp., plans to invest 110 billion yen (about US $1.0 billion) to build a new 300mm wafer production site in southern Japan.
05/16/2006 The Laboratoire d'Electronique de Technologie de l'Information (LETI) in France is one of the first European sites to install and begin using the FEI Titan 80-300. This scanning transmission electron (S/TEM) microscope yields atomic scale imaging and analysis capabilities. It is installed in LETI's new Center for Innovation in Micro and Nanotechology (MINATEC).
05/16/2006 Harris Group announced that it led a $14 million second round financing in D-Wave Systems. of Burnaby, British Columbia, Canada. The second round financing included investments from existing investors, Draper Fisher Jurvetson, BDC Venture Capital, Growthworks Capital Ltd. and British Columbia Investment Management Corporation.
05/16/2006 May 15, 2006 -- /FDA News/ -- On Thursday, May 11, 2006 a team from Bausch & Lomb met with Food & Drug Administration (FDA) officials to share information resulting from the company's internal investigation into cases of Fusarium keratitis associated with ReNu with MoistureLoc.
05/16/2006 May 11, 2006 -- /PRNewswire-FirstCall/ -- HILLSBORO, Ore. -- FEI Company (NASDAQ:FEIC) today announced that a global Japanese electronics manufacturer has selected FEI's DA 300 in-fab defect analyzer for its factory.
05/16/2006 May 11, 2006 -- /MasterControl/ -- SALT LAKE CITY, Utah -- For most organizations, personnel training is important to ensure effective business operations. For companies in FDA and ISO environments, it's also necessary for compliance.
05/16/2006 May 12, 2006 -- /Industrial Scientific/ -- PITTSBURGH -- Industrial Scientific Corporation, a leading designer and manufacturer of portable gas detectors and gas monitoring equipment, announced today it has acquired Oldham, S.A. of France from 3i Group PLC in an all-cash transaction. Further financial terms were not disclosed.
05/16/2006 May 12, 2006 -- /Pall/ -- East Hills, NY and Tobelbad, Austria -- Pall Corporation (NYSE: PLL) and zeta Holding GmbH announced today that they have entered into an agreement to collaborate in the use of specific automation software and development, supply and marketing of equipment packages for fermentation, recovery and purification of biotech products.
05/16/2006 May 12, 2006 -- /MARKET WIRE/ -- IRVINE, Calif. -- Sensor System Solutions, Inc. today announced the launch of a new look for the Company's website.
05/15/2006 Research Triangle Park, NC — The third annual "3D Architectures for Semiconductor Integration and Packaging" conference, held by RTI International, will convene in San Francisco, CA, on October 31–November 2, 2006.
