Featured Content




SiTime announces sampling of MEMS oscillators

04/10/2006  By his own admission, MEMS industry veteran Kurt Petersen didn't think MEMS resonators were a viable commercial product. For starters, moisture would eventually creep into the packaging, undermining performance. And to make matters worse, the packaging itself would make it difficult if not impossible to compete in a price-driven market.

IC Packaging Market Hits $23.1B in '05

04/07/2006  San Jose, CA — In 2005, a reported 116 billion ICs were produced worldwide in 2005, bringing the IC packaging market's value to $23.1 billion, claims Electronic Trend Publications (ETP) in its latest report, The Worldwide IC Packaging Market — 2006 Edition. ETP reports that out of the 116 billion ICs, 37 billion were assembled by contract packaging companies, totaling $9 billion.

E-beam litho firm adds NA presence

04/07/2006  April 7, 2006 - Elionix Co. Ltd., a Japanese manufacturer of electron-beam lithography equipment, has signed a deal with SEMTech Solutions to sell its sub-10nm 3-beam systems in the North American market.

Gartner: Capex outlook improving, if memory holds up

04/07/2006  April 7, 2006 - Worldwide semiconductor equipment spending will return to double-digit growth in 2006, but concerns linger about a possible oversupply in the memory segment, according to preliminary market data from Gartner Dataquest.

EU-backed metrology R&D group expands

04/07/2006  April 7, 2006 - The "Metrology Using X-Ray Technology" (MUXT) consortium, a project funded by the European Commission and carried out by Crolles2 partners ST Microelectronics, Philips Semiconductors, and CEA-LETI to evaluate and assess prototype equipment for next-generation semiconductor technologies, has added Jordan Valley Semiconductors Inc. to its roster.

Report: Japan leads modest EDA growth in 2005

04/06/2006  April 6, 2006 - Revenues for companies offering IC physical design and verification totaled $1.21 billion in 2005, a 4% increase over 2004, according to data from the EDA Consortium.

Seiko, JSR developing inkjet-applied silicon film

04/06/2006  April 6, 2006 - Researchers at Seiko Epson and JSR Corp. have created a high-quality silicon film formed with a spin coat method and inkjet patterning processes, with performance comparable with films developed through conventional CVD methods.

Entegris fires back vs. Pall filter suit

04/06/2006  April 6, 2006 - Materials systems supplier Entegris Inc. has filed a lawsuit against Pall Corp. alleging known misuse of patented technology in certain filtration separation products.

Elpida contracts ATDF for memory research

04/06/2006  April 6, 2006 - Sematech's Advanced Technology Development Facility (ATDF) R&D subsidiary has agreed to produce wafers with nonclassical CMOS transistors using implants and FinFET designs for Japan's Elpida Memory.

Analyst hikes semi forecast, citing DRAM improvements

04/06/2006  April 6, 2006 - Improving conditions in the DRAM segment will translate to a better performance for the semiconductor industry in 2006, according to iSuppli Corp.

DuPont, Fraunhofer Join Forces in Applications Development

04/06/2006  Research Triangle Park, NC — DuPont Semiconductor Packaging & Circuit Materials and the Fraunhofer Institute for Reliability and Microintegration IZM recently joined together in an applications development agreement, in which Fraunhofer will help to refine and optimize the processes of DuPont's expanding wafer-level and chip scale packaging (CSP) materials portfolio.

DFM Strategy for Yield Closure

04/06/2006  Looking to improve your bottom line and maximize yield for your next design? This seminar covers the latest causes of yield problems and how the new Calibre DFM tools from Mentor Graphics can help you identify, analyze and modify your designs to increase yield. This seminar also includes a rundown on what Calibre is doing to address random, systematic and parametric yield problems.

SUSS expands wafer bonder line

04/06/2006  SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced it is extending its existing wafer bonder range to include a new platform designed specifically for research, development and other low volume bonding applications. Currently the bonder carries the project name of "Elan".

BEHR Paints unveils nano-enabled products

04/06/2006  BEHR Paints of Santa Ana, Calif., introduced its new Premium Plus Interior Sateen Kitchen and Bath Enamel, paints that use nanomaterials for better physical and aesthetic qualities. The paint doubles as a safeguard against mildew and stains in kitchens and bathrooms.

AOI unveils scatterometry add-on

04/05/2006  April 5, 2006 - Accent Optical Technologies has developed a new scatterometry acceleration tool to provide advanced critical dimension (CD) metrology for 65nm device manufacturing.

Toshiba, SanDisk lay out 300mm NAND fab plans

04/05/2006  April 5, 2006 - After months of speculation, Toshiba Corp. and SanDisk have announced plans to build another 300mm NAND flash fab at Toshiba's operations in Yokkaichi, Japan.

ASAT Names Board of Directors Member

04/05/2006  Hong Kong and Pleasanton, CA — ASAT Holdings Ltd. and ASAT Inc. recently named Kevin Kit Tong Kwan to ASAT Holdings Ltd.'s Board of Directors, succeeding Bella Chhoa. Kwan's appointment to the Board is said to be a "valuable asset" due to his business experience in dealing with companies in Hong Kong and China as ASAT finishes its manufacturing move from Hong Kong to China, according to a statement.