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Oxonica acquiring Nanoplex Technologies

12/21/2005  Combining the two companies is intended to spur the development of new detection technologies and the creation of new diagnostic tools for a variety of purposes, the companies said.

AMIS, Mentor Graphics Team Up in Mixed-signal TDK

12/19/2005  Pocatello, ID — AMI Semiconductor (AMIS) and Mentor Graphics are partnering with the development of an analog/mixed-signal technology design kit (TDK) containing comprehensive and proven building blocks at the device level. This kit enables semiconductor companies and electronic systems manufacturers to kick off their design cycles on AMIS's foundry process using Mentor's analog/mixed-signal IC flow.

Hitachi, Renesas unveil low-power phase-change memory cells

12/19/2005  December 19, 2005 - Hitachi Ltd. and Renesas Technology Corp. say they have successfully prototyped low-power phase-change memory cells programmed at a power supply voltage of 1.5V and current of 100mA, consuming about 50% less power consumption/cell than the companies' previous technology.

Dell cuts monitor-panel orders

12/19/2005  December 19, 2005 - Dell Computer Corp. has cut orders for 600,000 thin film transistor-liquid crystal display (TFT-LCD) monitor panels in the past two months, with suppliers in both Taiwan and South Korea are expected to suffer the impact, according to industry sources, reports the Taiwan Economic News.

IEEE Approves Standard for System-level Chip Design

12/16/2005  Piscataway, NJ — The IEEE has approved a new electronic design standard for the SystemC 2.1 language, titled "Standard SystemC Language Reference Manual." The standard addresses the increasing complexity of system-on-chip (SoC) design at the systems level.

Semitool Installs Third Single-wafer System at LETI

12/15/2005  Kalispell, MT — Wafer processing equipment supplier Semitool, Inc. has installed its third Raider platform at the CEA Leti Nanotec (LETI) in Grenoble, France. This latest version of the Raider single-wafer system will allow LETI to develop and deploy 45- and 32-nm processes for copper-interconnect-related applications on 300-mm wafers using Semitool's latest ElectroChemical Deposition (ECD) system.

Nanopowder for white LEDs yields brighter light

12/15/2005  December 15, 2005 - A research group from Idemitsu Kosan Co. and Keio University has developed a way of producing YAG (yttrium aluminum garnet) phosphor in the form of a powder with particles measuring just 10nm dia., reports the Nikkei English News.

Hitachi's new cellphone display to suit TV watching

12/15/2005  December 15, 2005 - Hitachi Displays Ltd. said yesterday it has developed a high-resolution liquid crystal display for cellphones, expecting strong demand for handset screens suitable for new digital television services for mobile users, reports the Jiji Press. The company, wholly owned by Hitachi Ltd. , plans to start sample shipments of the new LCD in January and mass production in June.