Issue

The integrated circuit (IC) packaging industry currently seems to be concentrating on the development of non-leaded packages (such as chip scale ball grid arrays [CSBGAs] and QFNs), but leaded products

Because of deep sub-micron technology, chips now contain more functionality and are being driven to higher performance levels than ever before. At the same time, manufacturing technology is undergoing rapid change, and mixed analog/digital logic can now be placed on the same die

Optimizing production throughput by leveraging dual-lane dispensing

Each month, Advanced Packaging brings you information on the newest products and services in the semiconductor packaging arena, so that you can stay abreast of the myriad of solutions available to you. From coatings and encapsulants, from design software to custom packages, these pages are consistently filled with product specifications to help you learn of new products and services

Ian McEvoy, managing director of DEK, has been appointed to lead the IPC SMEMA Council for 2001. As chair of the council, McEvoy will be responsible for setting the tone and direction of SMEMA's activities and leading the council's steering committee.

It was hard not to miss the optoelectronic bandwagon rolling through the HD International Conference in Santa Clara in April. Many companies were clearly shifting their focus to optoelectronic applications and finding significant new markets.

Palomar Technologies Inc. (Vista, Calif.) has named Kevin Conlon chief operating officer

ast week a new family moved into our neighborhood. My daughter soon made friends with a girl, Susan, in that family. I should have known better, but I asked my daughter, "How old is your new friend?"

eople have talked about 3-D packaging for years, and there have been many demonstrations of stacked chip configurations, including high-volume production of SRAM/Flash memory stacks for mobile phones starting around 1999

Packaging no longer is an afterthought - it has moved into the mainstream, directly in the critical path of product design. Focusing on packaging at the last minute can cost a company up to 40 percent in performance, but fortunately software tools can help expedite package design

During the first week of November each year, Japanese whaling vessels leave the ports of Hiroshima and Yamaguchi in western Japan bound for the Antarctic to catch another haul of Minke whales

The most common modern use for lead is in solders for electronics manufacture because of lead's low melting point and corrosion resistance. Historically, lead has been used in a wide variety of ways for thousands of years

Historically, a rite of passage for a semiconductor packaging professional was the realization that packaging was an afterthought or seen as a necessary evil-or worse-in the IC world. Packaging added cost and leadtime, and more often than not it ruined some perfectly good chips