Issue

Table of Contents Solid State Technology Year 2002 Issue 3	DEPARTMENTS Editorial Antidote for supply chain woes When talking with industry contacts, I often ask people what they see happening to help the poor "visibility" up and down the supply chain. The answers are not very encouraging. New Products New Products System A45 is an automatic pick-and-place system designed to handle wafers up to 8-inches with low pick-up force and features an improved ink dot and wafer mapping capability News APEX focuses on test and inspection Test and inspection equipment of all kinds could be found all over the show floor at the IPC's APEX conference and exhibition in January News MEPTEC MEETING REPORT Intel's Packaging Plans Discussed News Newport to acquire MRSI Newport Corp. announced during APEX and Photonics West that it will be acquiring Micro Robotics Systems Inc. (MRSI), a privately held company based in North Billerica, Mass. Think Tank Think Tank Farmer Giles had an equilateral-triangle-shaped lawn with a side of 42 yards. Being too lazy to mow such a large area, he bought a goat to eat the grass

FEATURES Flip Chip Defect Detecti Flip chip defect detection Acoustic micro imaging and destructive correlation The Back End Process Ste The back-end process: Step 3 - Wafer backgrinding With the proliferation of smaller and thinner packages for portable and hand-held products, there is an increased need for thinner semiconductor devices New Reflowable Underfill New reflowable underfill materials Processing parameters and reliability performance Liquid Crystal Polymers. Liquid crystal polymers A flex circuit substrate option 10th Anniversary Insight 10th Anniversary Insights As semiconductor packaging and board assembly converge Throughout the electronics industry, new packaging technologies are driving changes in manufacturing

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