Issue



Table of Contents

Solid State Technology

Year 2004
Issue 10

DEPARTMENTS

Industry Voices


Meeting the Challenges of the SATS Industry

Toward the end of August, the investment community was speculating that another downturn or inventory adjustment was upon us.


Packaging Trends


Subcontractor Update: Caution Follows Solid Q2

The financial reports for the major assembly and test subcontractors were quite positive in the first quarter of 2004, but those numbers don't tell the whole story.


Notable Developments


Advances in Bioelectronics Lead to Retinal Prosthesis

Chronically implantable retinal prostheses currently are under development to restore useful vision to blind patients with degenerative retinal diseases such as age-related macular degeneration and retinitis pigmentosa.


New Products


New Products


Editorial Board


Technology Drivers Still Changing the Packaging Industry

Those involved in the packaging industry are quite familiar with two key technology drivers: Moore's Law (which dictates that the number of transistors will double in an IC every 24 months), and the increasing need to pack more capability (MIPs, Mbytes, GB/sec) into less space.


Editorial


Twists and Turns

It's difficult to tell from industry statistics just where the electronics industry is heading, but the shifts and changes in personnel and real estate are more telling than the numbers.


News


In the News


News


On the Move


FEATURES

The Back End Process


Step 10: Encapsulation Materials, Processes and Equipment

The electronic package might appear to be just a tiny black container for holding the chip, but it really is a sophisticated system when we consider the tasks to be accomplished, and under extreme conditions.


Novel Advanced Interconn


Novel Advanced Interconnects

ACHIEVING HIGH DENSITY PACKAGING AND INTERCONNECT


Cover Story


Flip Chip Bonding: Flexible Circuit Devices

Designed for Biomedical Applications


The Right Logic Package


The Right Logic Package: Benefits for Handheld Electronics

A PHYSICAL COMPARISON OF SINGLE- AND DUAL-GATE LOGIC


The Socket Response To C


The Socket Response to Current Packaging and Test Trends

ADVANCES IN SPRING PROBE TECHNOLOGY DECREASE COST OF TEST SOCKET DESIGN