Table of Contents
Solid State Technology
Year 2004
Issue 8
 | DEPARTMENTS
News
In the News
Editorial Board
The Time Machine and Its Lessons
About 10 years ago, I held an aluminized silicon wafer in hand, curiously regarding a dull, non-reflective square covering most of the surface.
Industry Voices
Lead-Free Assembly: Greatest Shake-up is Yet to Come
For component producers to respond successfully to the challenges of the lead-free era, material suppliers must do more for customers than many have even considered or are able to deliver.
Packaging Trends
Subcontractor Update: Cooling Trend to Start in 2004
While the numbers were generally positive for the assembly and test subcontractors in the first quarter of 2004, the industry cooled off somewhat to start the year.
New Products
New Products
Editorial
What's up with Flip Chips?
On June 21 in Austin, Texas, I moderated a panel for the Global Business Council (GBC) of IMAPS covering the global flip chip business overview.
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FEATURES
The Back End Process
Stacked-die Packaging: Technology Toolbox, Step 8
Wireless applications such as cell phones and consumer products like pocket PCs require maximum functional integration in the smallest footprint, lowest profile and low-cost packaging.
Cover Story
Bond Test Fundamentals for Successful Advanced Applications
In today's technology press, you do not hear much about bond pull and shear testing.
Investigation Of Lead Fr
Investigation of Lead-free Package Reliability
A new, reliable material is essential
Technologies For Microde
Technologies for Microdevice Packaging
Packaging Requirements for MEMS and MOEMS
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