Issue

Gordon Moore's 1965 observation that the number of transistors per square inch of silicon was doubling every year has, with modest variations, continued to characterize growth in the semiconductor industry.

The EU has set in place a Restriction of Hazardous Substances (RoHS) directive that states: "Member States shall ensure that from July 1, 2006, new electrical and electronic equipment put on the market does not contain lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers."

The electronics industry is making steady progress toward developing lead-free assembly processes to meet the EU's Restriction on Hazardous Substances (RoHS) directive, which calls for the elimination of lead and other hazardous substances from new electrical and electronic equipment by July 2006.

To serve a new seamless telecom and multimedia communications society, the smooth, fast, intelligent transmission and processing of large data files is necessary.

Have you ever been in a foot race?

Test methodology considerations

Solder bump and adhesive flip chip advantages

Materials and Processes

Blending engineering knowledge across IC/OSAT/OEM companies

New developments in board/package materials and processes