Issue



Table of Contents

Solid State Technology

Year 2004
Issue 2

DEPARTMENTS

Data Bank


Data Bank


News


In the News


New Products


Product Preview


Industry Voices


From Cave Painting to Digital Dispensing

The accurate transfer of fluid materials has been a human endeavor since the beginning of time.


Packaging Trends


MCP for Memory Components

As 2.5G and 3G smartphones shrink in size, yet offer increased functionality and a PC-like graphical user interface (GUI), original equipment manufacturers (OEMS) are reducing the number and size of onboard components.


Notable Developments


Electronics Interconnections for Extreme Environments

In January 2004, NASA landed two rovers named Spirit and Opportunity on Mars to explore the surface and gather geologic information to beam back to Earth.


Editorial


You Said It

In the period of time between the end of winter holidays and the buildup to spring activities, readers become a little more social.


FEATURES

The Back End Process


Wafer Bumping

An Industry Perspective


Wafer Bumping Solder Pas


Wafer Bumping Solder Paste Selection

Getting it Right


Flip Chip Cleaning With


Flip Chip Cleaning with Vapor Phase Solvents

Active Solvent Concentration is Essential Driver for Cleaning


Ltcc Integration Of Pass


LTCC Integration of Passives

Performance Results of a K80 Dielectric Paste


Global Trends In Lead Fr


Global Trends in Lead-free Soldering

PART II OF A II-PART SERIES ON LEAD-FREE


Cover Story


Endoscopic Inspection of Area Array Packages

Meeting Miniaturization Requirements For Defect Detection