Issue

Table of Contents Solid State Technology Year 2006 Issue 8	DEPARTMENTS Editorial Board A New Hierarchy for Electronic Interconnections The hierarchy of electronic interconnections has undergone some significant changes over the last several years. Advanced Packaging Award Advanced Packaging Celebrates the APAs in Style On July 12, 2006, Advanced Packaging celebrated the 6th Annual APA Awards ceremony with style and panache. Advanced Packaging Award Advanced Packaging Awards 2006 Editorial SEMICON West Still Hits the High Notes There’s always a sense of anticipation when planning for SEMICON West. San Francisco’s weather can be unusually cool, and the industry fluctuates unpredictably as well. Advanced Packaging Road Advanced Packaging: On the Move This Roadshow thing is taking on a life of its own. Our latest trip literally took us from coast-to-coast and back again. News In the News Notable Developments The First Intra-molecular IC on a Single Carbon Nanotube Current technology uses field-effect transistors (FETs) with feature sizes smaller than 100 nanometers that start to show some device degradation due to short channel effects.

FEATURES Cover Story Lights-out MEMS Manufacturing It is well-known in semiconductor manufacturing that fast process feedback leads to better process control, which results in higher yield. The Back End Process X-ray Inspection Technology: Finding Hidden Defects Not all packaging and interconnect defects can be detected through in-circuit and functional test. Sip And 3 D Interconnect SiP and 3-D Interconnects Integration schemes for Through-wafer Via Devices Chip Package Co Optimiza Chip-package Co-optimization The packaging engineer’s long-time lament is the challenge of an over-designed or too large chip. Socket Adapter Systems A Socket-adapter Systems: A Practical Test Alternative An Innovative, Space-Saving Approach Substrate Handling For H Substrate Handling for High-accuracy Packaging Processes Today’s packaging specialists are driving demand for processes and technologies that are both fast and flexible.

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