Issue

Riding on recent advances in nano-fabrication technology, thin-film thermoelectric coolers (TF-TEC) have been developed with active material as thin as 10-20 ??m.

ORLANDO, FL —Everything about the Freescale Technology Forum Americas conference, held June 16 & 17, at the JW Marriott and Ritz Carlton Conference Center in Orlando, provided the attendee an opportunity to interact with the Freescale community.

Electromechanical Coating Processes eG ViaCoat enables the metallization of TSVs, until now a process that was holding back adoption of 3D packaging.

What do you do when work doesn’t leave a moment to spare? You take a break to gain a new perspective.

In one of the most beautiful areas imaginable in the Pacific Northwest amidst flowers and greenery, two companies do leading-edge research and development work that affects how electronics work.

Challenges of high-end FCSiP include routability with acceptable signal and power integrity, package thermo-mechanical behaviors, and long term reliability performance.

Following the path of electronics evolution, many technological concepts such as system-in-package (SiP), system-on-chip (SoC), and stacked chip packaging have drawn exploration roadmaps for higher system integration.

Demands to reduce the dimensions of even the most highly miniaturized semiconductor packages are placing pressure on IC vendors and packaging specialists to develop faster and more productive package-assembly processes.