Issue

3D packaging has a bright future. It simply makes a lot of sense.

ATTLEBORO, MA ??? Hideyuki Takahashi, Japan engineering manager, and Hide Furukawa, U.S. engineering manager at Sensata Technologies have developed a latch system for delicate IC packages.

Leadframe-based packages accounted for over 70% of the 147 billion IC packages produced in 2007.

You would think that because I’m a National Public Radio junkie, news would be of vital importance to me – any type of news.

The Advanced Packaging editors covered a lot of ground this spring as co-sponsors of the Burn-in and Test Socket (BiTS) Workshop in Mesa, AZ, attending SEMICON China in Shanghai, and the IMAPS Device Packaging Symposium in Scottsdale, AZ.

Flip chip interconnect offers the advantages of smaller footprint on the PCB, improved electrical performance, reduced manufacturing steps at assembly, and excellent long-term reliability.

Flash memory has become a fundamental building block in modern electronic systems.

Flux residues must be be removed from flip chip components prior to subsequent processes to prevent malfunctions in high-power electronics.

While CMOS SoC works well in low power applications, it doesn't meet requirements for future wireless products.