11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

11/07/2017  SEMI announced today that the Industry Strategy Symposium (ISS) 2018, will take place January 15-18 at Half Moon Bay's Ritz-Carlton Hotel, with the theme "Smart, Intuitive & Connected: Semiconductor Devices Transforming the World."

11/03/2017  MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

11/03/2017  NXP has partnered with the Chongqing Economic and Information Technology Commission and the Chongqing Laingian New Area Administrative Committee to drive more automotive industry growth with the new applications development center.

10/30/2017  FlexTech, a SEMI Strategic Association Partner announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker.

10/30/2017  The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 - 2022.

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

10/27/2017  Microsemi Corporation and Knowles Corporation jointly announced today that Microsemi has entered into a definitive agreement to acquire the high performance timing business of Vectron International, a Knowles company, for $130 million.

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

10/26/2017  New technology from IBM Research could be used to create an inexpensive sensor network that autonomously monitors for natural gas leaks.

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

10/25/2017  Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15.

10/24/2017  STMicroelectronics has taken underwater accuracy to new heights with its latest miniature pressure sensor, which is featured in the new Samsung Gear Fit 2 Pro.

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

10/16/2017  The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the formation of an Automotive Birds of a Feather (BoF) Group to solicit industry input from original equipment manufacturers (OEMs) and their suppliers to enhance existing or develop new interface specifications for automotive applications.

10/13/2017  ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.

10/12/2017  GLOBALFOUNDRIES today unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

10/05/2017  MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.