Applications

APPLICATIONS ARTICLES



Perovskites: Materials of the future in optical communication

10/16/2018  High performance and stable all? Inorganic metal halide perovskite-based photodetectors for optical communication applications.

Gartner identifies the Top 10 strategic technology trends for 2019

10/15/2018  Analysts explore top industry trends at Gartner Symposium/ITxpo 2018, October 14-18 in Orlando.

Micron Foundation announces $1M grant to advance curiosity in artificial intelligence

10/11/2018  The grant was announced at the inaugural Micron Insight 2018 conference where the technology industry's top minds gathered in San Francisco to discuss the future of AI, machine learning and data science, and how memory technology is essential in bringing intelligence to life.

Study opens route to flexible electronics made from exotic materials

10/10/2018  Cost-effective method produces semiconducting films from materials that outperform silicon.

Intel collaborates on new AI research center at Technion, Israel’s Technological Institute

10/09/2018  Technion, Israel’s technological institute, announced this week that Intel is collaborating with the institute on its new artificial intelligence (AI) research center.

CMOS image sensors: Yole Développement is increasing its forecasts again

10/04/2018  2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.

Boron nitride separation process could facilitate higher efficiency solar cells

10/04/2018  A team of semiconductor researchers based in France has used a boron nitride separation layer to grow indium gallium nitride (InGaN) solar cells that were then lifted off their original sapphire substrate and placed onto a glass substrate.

MSEC Tech Showcase to highlight MEMS & sensors innovations

10/04/2018  MEMS & Sensors Industry Group announces Technology Showcase finalists for MEMS & Sensors Executive Congress.

Smart devices could soon tap their owners as a battery source

09/28/2018  The world is edging closer to a reality where smart devices are able to use their owners as an energy resource, say experts from the University of Surrey.

Photonic chips harness sound waves to speed up local networks

09/27/2018  Acoustic noise in chips used to be a nuisance. Now scientists at the University of Sydney Nano Institute have developed a technique to put it to use in receivers of information in fibre-optic networks.

STMicroelectronics unveils highly integrated mobile-security chip

09/27/2018  STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM.

Smaller, faster and more efficient modulator sets to revolutionize optoelectronic industry

09/24/2018  A research team comprising members from City University of Hong Kong (CityU), Harvard University and renowned information technologies laboratory has successfully fabricated a tiny on-chip lithium niobate modulator, an essential component for the optoelectronic industry.

STMicroelectronics and Leti develop GaN-on-silicon technology for power conversion applications

09/24/2018  STMicroelectronics and Leti, a research institute of CEA Tech, today announced their cooperation to industrialize GaN (Gallium Nitride)-on-Silicon technologies for power switching devices.

Leti announces EU project to develop powerful, inexpensive sensors with photonic integrated circuits

09/19/2018  Leti, a research institute of CEA Tech, today announced the launch of the REDFINCH consortium to develop the next generation of miniaturized, portable optical sensors for chemical detection in both gases and liquids.

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

09/18/2018  Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

The role of autonomous mobility in driving MEMS & sensors to $100B market

09/13/2018  MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

Sensors: From red hot chillies to patients

09/13/2018  SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.

Wearable ultrasound patch monitors blood pressure deep inside body

09/12/2018  A new wearable ultrasound patch that non-invasively monitors blood pressure in arteries deep beneath the skin could help people detect cardiovascular problems earlier on and with greater precision.

More than mobility: Smart automotive innovations go beyond technology

09/10/2018  Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a "mobility service provider"?




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts