11/26/2013  University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.

11/26/2013 

11/26/2013 

11/22/2013  CEA-Leti’s next-generation magnetometer technology was launched into space today on board the European Space Agency’s three Swarm satellites to collect unprecedented detail about the Earth’s magnetic field.

11/22/2013  Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.

11/21/2013  Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

11/21/2013  STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

11/21/2013  In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

11/15/2013  MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

11/11/2013  STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

11/11/2013  Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

11/05/2013  ‘Ecosystem for Nanotechnology, Entrepreneurship and Law’ (eNTEL) will provide unmatched student experience as launch pad for development of startup companies and attraction of business investment.

11/01/2013  Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

11/01/2013  InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the 6-axis MPU-6515 MEMS SoC .

10/28/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has delivered an EVG 6200 semi-automated mask alignment system to Micronit, a manufacturer of lab-on-a-chip products used in life sciences applications, such as molecular diagnostics and point-of-care, as well as micro-processed glass substrates for MEMS applications.

10/24/2013  Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad range of clinical tests.

10/23/2013  Research at six universities including MIT, University of Massachusetts at Amherst, Yale, Georgia Tech, Brigham Young and Washington

10/23/2013  CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

10/17/2013  MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”

10/08/2013  STMicroelectronics today announced that it has received the 2013 Excellence in Sustainability Award from Cisco.