Applications

APPLICATIONS ARTICLES



Qualcomm MEMS Technologies reports 2 e-reader design wins in China

01/12/2012 

Qualcomm MEMS Technologies Inc.'s mirasol display technology is used in 2 new e-readers for the Chinese market, the Hanvon C18 and the Bambook Sunflower from Shanda Networking.

WiSpry RF MEMS enables major handset

01/11/2012 

WiSpry Inc. confirmed that its technology is used in the first mass-produced RF-MEMS-enabled handset. WiSpry's antenna tuner extends usable bandwidth for small form-factor antennas, dynamically compensates for user interference, and lowers energy usage.

RF MEMS tuned for growth, shows smartphone win

01/09/2012 

The new Samsung Focus Flash Windows smartphone includes a WiSpry RF MEMS device, starting off a 200x expansion of the RF MEMS industry through 2015, the analyst firm predicts.

Advantest to expand beyond semiconductor test

01/05/2012 

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.

Fraunhofer fabs optoelectronic LDPD on CMOS image sensors for low light

01/04/2012 

Fraunhofer Institute for Microelectronic Circuits and Systems IMS researchers developed a new optoelectronic component for low-light CMOS image sensor applications.

Bosch fabs 2B MEMS sensors

12/28/2011 

After taking 13 years to fab its first 1 billion MEMS sensors, Bosch has added another billion in just 3 years. The company's MEMS sensor production is nearing half a billion a year.

MEMS die size grows, test evolves, and other trends

12/26/2011 

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.

Color displays could boost e-reader sales in coming years

12/20/2011 

Displays for pure-play e-book readers will see 108% higher shipments in 2011, but slower growth ahead. In the future, e-reader makers will turn to color display technologies, predicts IHS iSuppli.

Microfluidics: $4B in 2016, thanks to life sciences

12/19/2011 

In its new report, Emerging Markets For Microfluidic Applications, Yole Développement asserts that microfluidics are a "key technology" for the life sciences market, which will prop up microfluidics growth to $4 billion in 2016.

STM: Semiconductor maker, MEMS specialist, venture capitalist?

12/16/2011 

STMicroelectronics (NYSE: STM), a global semiconductor company, launched ST New Ventures, its corporate venture capital fund currently under incorporation.

ST's Taiwan iNEMO contest lauds smart hula hoop

12/16/2011 

STMicroelectronics has hosted 3 2011 iNEMO Campus Design Contests, for the US, China and Taiwan. This week, Taiwan's first place went to students from the National Yunlin University of Science and Technology for a smart hula hoop design.

MEMS combo sensors bring price, size advantages to auto and consumer sectors

12/15/2011 

Combo sensors, comprising MEMS accelerometers, gyroscopes, or electronic compasses, are filling a need in consumer and automotive applications. Combined revenue from these sectors will grow by a factor of 50 over 5 years, shows IHS iSuppli.

MEMS-aligned optical devices ship to Linkstar customer

12/14/2011 

Linkstar customers have qualified the pilot shipment of silicon optic devices fabricated with Singapore's A*STAR Institute of Microelectronics MEMS technology. The IME silicon MEMS technology enables accurate alignment of optical devices to the optical fiber arrays.

MEMS: The year past and the year ahead

12/13/2011 

Jean-Christophe Eloy, president & CEO, Yole Développement, shares an analyst's view of the micro electro mechanical system (MEMS) industry, calling 2011 a year of transition and changes.

NASA Curiosity Rover takes Teledyne-DALSA sensors to Mars

12/12/2011 

Teledyne DALSA manufactured the CCD sensors -- designed by NASA -- on the NASA mission to Mars. The sensors will help the Rover navigate the surface of the planet.

MEMS at CES: MEMS Industry Group events

12/12/2011 

MEMS Industry Group (MIG) shares the MEMS-related exhibits and discusses at the 2012 International CES, which covers consumer electronics, January 10-13 in Las Vegas.

imec presents MEMS energy harvester at IEDM

12/08/2011 

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.

ST chooses China's winning iNEMO student designs

12/01/2011 

STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.

Semiconductor magnetic sensors rev up in auto sector

12/01/2011 

IHS shares the growth map for semiconductor magnetic sensors in automotive applications, where the sensors are used in vehicles, and technology trends. Top suppliers are also listed.

Nanomedical collaboration improves drug delivery system

11/29/2011 

Drug delivery companies Leonardo Biosystems Inc. and NanoMedical Systems Inc. (NMS) will collaborate, with NMS developing and establishing a commercial process to manufacture nanoporous silicon particles for Leonardo's multi-stage drug delivery system.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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