Category Archives: Displays

LG is showcasing a handful of futuristic concepts at CES 2016 this week, including an 18 inch prototype of an OLED display that can roll up like a newspaper.

Source: LG

Source: LG

The display has a high-definition resolution of 1200×810 with almost one million mega-pixels and can be rolled up to a radius of 3cm without affecting the function.

OLED screens are composed of LEDs that emit their own light from the lit pixels, conversely to older LCD technology which relies on a backlight to illuminate the display. Many phones such as those produced by Samsung already use OLED panels, but they have so far been entirely inflexible.

LG’s new technology paves the way for smaller electronic devices that can bend – like phones – but LG claims it can be scaled up to the size of a 50 inch television.

The company said the new screens were mounted on a “high molecular substance-based polyimide film” that served as the back plate for the rollable panel. The polyimide film reduces the thickness of the panel which helps to “significantly improve” its flexibility.

The screen is currently just a prototype and can only be rolled up in one direction. It is also quite delicate and can be damaged easily resulting in dead pixels appearing on the display.

LG Display’s KJ Kim said that in the future consumers will be able to roll up their television sets when not in use, although he gave no release date for the new technology.

The display was shown at the Consumer Electronics Show (CES) in Las Vegas along with a number of other exhibitors such as Samsung who have demonstrated a smart fridge and a television that can act as a wireless hub for the Internet of Things.

Gary Shapiro, one of the organizers of CES, said: “We are in the middle of a revolutionary wave of innovation where game-changing ideas are springing up from small companies and entrepreneurs all over the world.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.9 billion for the month of November 2015, 0.3 percent lower than the previous month’s total of $29.0 billion and 3.0 percent down from the November 2014 total of $29.8 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Softening demand and lingering macroeconomic challenges continued to limit global semiconductor sales in November,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Despite these headwinds, the industry may narrowly surpass total annual sales from 2014 and is projected to post modest sales increases in 2016 and beyond.”

Regionally, month-to-month sales increased in China (1.0 percent), Europe (1.0 percent), and the Americas (0.3 percent), but decreased in Japan (-0.6 percent), and Asia Pacific/All Other (-2.4 percent). Compared to November 2014, sales were up in China (5.3 percent), but down in Asia Pacific/All Other (-4.1 percent), the Americas (-7.1 percent), Europe (-8.0 percent), and Japan (-8.6 percent).

November 2015

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

6.05

6.07

0.3%

Europe

2.91

2.93

1.0%

Japan

2.70

2.68

-0.6%

China

8.59

8.68

1.0%

Asia Pacific/All Other

8.73

8.52

-2.4%

Total

28.97

28.88

-0.3%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

6.53

6.07

-7.1%

Europe

3.19

2.93

-8.0%

Japan

2.93

2.68

-8.6%

China

8.24

8.68

5.3%

Asia Pacific/All Other

8.88

8.52

-4.1%

Total

29.77

28.88

-3.0%

Three-Month-Moving Average Sales

Market

Jun/Jul/Aug

Sept/Oct/Nov

% Change

Americas

5.60

6.07

8.3%

Europe

2.81

2.93

4.5%

Japan

2.67

2.68

0.3%

China

8.23

8.68

5.4%

Asia Pacific/All Other

8.57

8.52

-0.6%

Total

27.88

28.88

3.6%

The SEMI Foundation today announced that Belle W. Y. Wei, Ph.D., was elected as a new director to the SEMI Foundation Board of Trustees in accordance with the association’s by-laws. Her appointment to the Board is immediately effective.

The SEMI Foundation is known for its flagship program, SEMI High Tech U, which serves high school students interested in pursuing careers in science, technology, engineering and math (STEM).  Since 2001, the Foundation has delivered 190 programs to over 6,000 students and teachers worldwide. Companies and organizations join the SEMI Foundation’s existing High Tech U program, by generously offering financial support, in-kind donations and volunteering at High Tech U events.

Belle Wei has held a range of leadership positions at California State University, Chico, and San Jose State University’s College of Engineering. Wei has promoted student success and bolstered STEM education, expanded educational access for historically underrepresented groups, and helped improve students’ timely graduation. She also led the Engineering Pathway Initiative that brought the Project Lead the Way engineering curricula to middle and high schools in the San Francisco/Silicon Valley region to prepare young students for colleges and careers in STEM fields. Wei presented before U.S. Congress in 2006 and contributed to the America COMPETES Act of 2007. In 2012, she participated in the “10,000 Engineers Initiative” of the President’s Council on Jobs and Competitiveness. Wei has a Ph.D. in Electrical Engineering and Computer Sciences from the University of California, Berkeley and Master of Science degree in Engineering from Harvard University. Her undergraduate degree is in Biophysics from the University of California, Berkeley.

“We are inspired by Belle’s deep engagement in higher education and her drive to help students pursue STEM careers,” said Denny McGuirk, president and CEO of SEMI. “We welcome her to the Board and look forward to utilizing her knowledge and experience as we expand the SEMI Foundation’s contributions to STEM education and workforce development.”

“I’m impressed with the SEMI Foundation’s High Tech U program, which helps students understand the connection of STEM skills to future career opportunities in high tech. At a more strategic level, the Foundation’s track record of engaging industry sponsors is remarkable,” said Belle Wei. “I’m looking forward to working with the Board and helping to develop new opportunities for the SEMI Foundation to strengthen its role in STEM education and career exploration for young people.”

Other members of the SEMI Foundation Board are: Denny McGuirk, chairman of the SEMI Foundation and president and CEO of SEMI; Richard Salsman, CFO and treasurer of the SEMI Foundation and CFO and executive vice president of Global Alliances at SEMI; Leslie Tugman, secretary of the SEMI Foundation and executive director of the SEMI Foundation; Arthur Zafiropoulo, chairman and CEO of Ultratech; Yong Han Lee, chairman of Wonik; Stanley Myers, president of ST Myers and Associates; Dana Ditmore, Oak Valley Consulting; and John Biera, principal of Central High School in Phoenix, Ariz.

The SEMI Foundation’s Board of Trustees represent companies from Asia and the United States, reflecting the global scope of the association’s activities. For more information about the SEMI Foundation, visit www.semi.org/en/About/SEMIFoundation.

Driven by continued innovation in vehicle connectivity and safety technologies, global revenue from automotive display systems will grow at a compound annual growth rate (CAGR) of more than 11 percent to $18.6 billion by the end of 2021. This will add nearly $9 billion in annual revenue compared to 2015, according to IHS Inc., a source of critical information and insight to the global automotive industry.

Data from the Automotive Display Systems Forecasts from IHS represents production of instrument cluster systems, head-up display systems and center stack display systems as full automotive modules, not just display panels. Center stack display systems are expected to account for half of the overall revenue growth, while head-up display (HUD) systems will boast the strongest revenue CAGR at nearly 21 percent from 2015.

“The automotive displays supply chain will see some amazing growth and innovation through the end of the decade, as more vehicles debut new displays or standardize larger ones in the instrument cluster, center stack and head-up display systems,” said Mark Boyadjis, senior analyst and manager for Infotainment and HMI at IHS Automotive. “There is additional growth opportunity in lower volume display applications for rear seat entertainment, HVAC control panels, and new applications such as smart mirrors with full displays entering the market now.”

Global production volumes for factory-installed center stack and instrument cluster display systems are each estimated to grow by more than 40 percent over the forecast period, each surpassing 60 million units by 2021. IHS forecasts an even higher growth rate for the production of head-up display systems, which will exceed 65 percent, surpassing 6 million units annually in that same timeframe.

The forecasted global growth in display systems is based on multiple factors. In China, for example, overall volume is boosted, because original equipment manufacturers (OEMs) are beginning to add smaller displays into the instrument cluster and center stack, while regional vehicle sales also grow. Meanwhile, head-up display systems are growing globally, as prices for these new and innovative display technologies fall and they become increasingly relevant to reduce driver distraction.

Displays grow in both volume and size

Automotive displays are increasing in volume and in size. IHS forecasts global shipments for automobile display components overall to grow at a CAGR of more than 6 percent to 170.6 million units by the end of 2021. According to the Automotive Display Market Tracker H2 2015 from IHS, at least two TFT-LCD or AMOLED displays will be in all new cars produced in 2021.

By 2021 automotive displays 7.0-inches and larger are forecasted to reach 33.5 million units, growing at a CAGR of nearly 10 percent, largely driven by the 8.0-inch size class. “Automotive display sizes are growing quickly to help support multiple infotainment, safety and vehicle system functions that require more screen real estate to inform drivers and passengers,” said Hiroshi Hayase, director for small medium display at IHS Technology. “Vehicles are designed with displays in mind, combining digital clusters, HUDs and center stack displays for a truly immersive experience for the driver.”

Increasing demand for infotainment functions, safety systems and vehicle electrification have persuaded OEMs to consider larger, more complex displays in the center stack, instrument cluster and other applications. Global shipments for instrument cluster displays are shifting from 3.0-inch and 4.0-inch to more than 5.0-inches, and center stack displays are shifting to 7.0-inches and larger. Center stack displays between 8.0-inches and 10.0-inches are already common among high-end vehicles and luxury brands, and they are even being introduced in high-volume vehicles, like D-segment sedans and crossovers.

Aftermarket applications for automotive displays also continue to grow, with high demand for aftermarket navigation systems and radios in China, Russia, and Brazil. These numbers also impact global automotive display shipments.

By Shannon Davis, Web Editor 

2015 was a year of unprecedented consolidation in the semiconductor industry, as well as a technological crossroads in Moore’s Law. Below is a round-up, based on reader popularity, of the most read stories on Solid State Technology from 2015.

1) 2015 outlook: Tech trends and drivers

Leading industry experts provided their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

2) Reframing the Roadmap: ITRS 2.0

The International Technology Roadmap for Semiconductor (ITRS) is being reframed to focus more on end applications, such as smartphones and micro-servers. Labeled ITRS 2.0, the new roadmap is a departure from a strong focus maintaining the path defined by Moore’s Law.

3) Freescale and NXP agree to $40B merger

Chipmaker NXP Semiconductors NV announced that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations. The combined enterprise values at just over $40 billion and will create a new leader in the auto and industrial semiconductor markets.

4) Samsung’s FinFETs are in the Galaxy S6!

The much-anticipated Samsung Galaxy S6 made an early appearance in Chipworks’ teardown labs last week, thanks to the diligent skills of their trusted logistics guru.

5) Moore’s Law to keep on 28nm

Scaling is now bifurcating – some scaling on with 28/22nm, while other push below 14nm.

6) More change for the chip industry

As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

7) EUV: Unlike anything else in the fab

Imagine EUV lithography in high volume production. ASML has been working for years to make it happen. Earlier this year, ASML said that one of its major chip-manufacturing customers has placed an order for 15 EUV systems, including two that are set to be delivered before the end of this year. ASML did not name the customer, but it is almost certainly Intel (according to research firm IHS).

8) Apple Watch and ASE start new era in SiP

Back in April the Apple watch appeared in the Chipworks’ labs, and of course they pulled it apart to see its contents.

9) New AMS fab going to Marcy, NY

Austria-based ams AG, formerly known as Austriamicrosystem, announced plans to locate a new 360,000 ft2 fab in upstate New York at the Nano Utica site in Marcy, NY. The fab will be used to manufacture analog devices on 200/300mm wafers.

10) Historic era of consolidation for chipmakers

We are in a historic era for consolidation among semiconductor manufacturers. Solid State Technology compiled the latest consolidation news, as well as analysis on the implications for the industry.

11) Lithography alternatives: Why are they essential?

The availability of patterning alternatives in the lithography landscape represents a big opportunity to properly address the coming needs generated by the IoT.

12) A look ahead at IEDM 2015

In the second week of December, the good and the great of the electron device world made their usual pilgrimage to Washington D.C. for the 2015 IEEE International Electron Devices Meeting.

Bonus: Top Webcasts of 2015 – Available On Demand Now!  

How the IoT is Driving Semiconductor Technology

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the Internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will be rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology. 

Sensor Fusion and the Role of MEMS in the IoT

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion and the important role that MEMS will play in the Internet of Things (IoT). Marcellino Gemelli, Head of Business Development at Bosch Sensortec will discuss how smart systems are enabled through sensor fusion. Karen Lightman, Executive Director of MEMS Industry Group (MIG), provided a “debrief” from the recent MEMS Technical Congress and a preview of a SEMICON West workshop focused on back-end challenges.

3D NAND Challenges and Opportunities

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation discusses this (r)evolution as well as its major scaling limitations.

Resolve to stay up-to-date on industry news in 2016! Here’s how.

Full high-definition (FHD) panels reached a record 21 percent of the smartphone display market in the third quarter (Q3) of 2015, due in large part to increases in active-matrix organic light-emitting diode (AMOLED) panel adoption by Samsung and others. Increasing demand from the Chinese smartphone market, and the popularity of the Apple iPhone 6S Plus, also added to growth in unit shipments of FHD panels that are able to show 1080p images, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight. AMOLED displays comprised 18 percent of all smartphone display unit shipments in Q3 2015, up from 10 percent in Q3 2014.

The Samsung group has relied on AMOLED as an important differentiating feature in its proprietary Galaxy smartphones for six years, as it helps the company achieve better color performance, on-cell touch, and slimmer and lighter form factors. To expand market adoption, Samsung Display recently changed its smartphone display strategy to begin selling AMOLED panels to external customers.

Beginning in the second half of 2015, OPPO, Gionee, vivo, Meizu, Lenovo, Huawei and other smartphone brands, installed AMOLED in their devices. Meanwhile, products like the Google Nexus 6P, the Microsoft Lumia 950XL, the Meizhu Pro 5, and the recently announced BlackBerry Priv now have AMOLED displays.

“2015 will be a banner year for AMOLED as the technology will soon be included in high-end smartphones from many other companies,” said David Hsieh, senior analyst for IHS Technology. “The simpler structure and better picture performance of AMOLED screens may even encourage Apple to consider adopting the technology in the future.”

The plus-sizing of smartphones continues

Led by the rising popularity of the iPhone 6S Plus and other large smartphones, unit shipments of 5.0-inch-and-larger displays surpassed those of smaller displays for the first time in Q3 2015. While quarter-over-quarter unit shipments of 5.0-inch-and-larger displays grew 21 percent to reach 247 million units in Q3, smartphone displays smaller than 5.0 inches fell 6 percent to 156 million units.

Unit shipments of 5.0-inch smartphone panels experienced the largest growth of any size, jumping from 93 million in Q2 2015 to 104 million in Q3, which is the first time 5.0-inch shipments exceeded 100 million units in a single quarter. Thanks to the iPhone 6S Plus and other new models manufactured in China, 5.5-inch smartphone panels grew from 65.6 million in Q2 2015 to 79.8 million in Q3. Screen sizes of 6 inches and larger have not been as popular with smartphone buyers, so growth in that size range has been marginal.

Apple’s use of Force Touch technology in the Apple Watch and 3D Touch in the iPhone 6S line is leading to growth in force sensing and other touch-panel enhancements in mobile devices. Other brands and integrated-circuit (IC) makers are now responding by preparing their own force sensing solutions, mainly for high-end and mid-range smartphones due to the high cost. In 2016, force sensing module shipments are expected to grow 317 percent to reach 461 million units in 2016. Nearly one quarter (24 percent) of new smartphones shipped will include the technology, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

“Aside from force sensing solutions, touch controller IC makers are aggressively expanding production of in-cell and on-cell touch displays to further improve touch interfaces for smartphone users,” said Calvin Hsieh, director of touch and user interface research for IHS Technology. According to the latest IHS Touch User Interface Report, in-cell and on-cell touch panel shipments will reach 40 percent of all mobile phone touch-panel shipments in 2015, rising to 50 percent in 2018. “Smartphone touch controller IC makers are focused on developing new features to spur growth in the maturing touch panel market.”

The ongoing evolution in the touch-panel industry is also changing the supply chain and affecting competition. Touch controller IC makers, primarily in Taiwan and China, accounted for more than 45 percent of the market for major information technology and consumer electronics products in the first half of 2015.

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.  In 2016, nominal positive growth is expected, resulting in a global market increase of 1.4 percent.

The SEMI Year-end Forecast predicts that wafer processing equipment, the largest product segment by dollar value, is anticipated to increase 0.7 percent in 2015 to total $29.5 billion. The “Other Front End” category (fab facilities, mask/reticle, and wafer manufacturing equipment) is expected to increase 20.6 percent in 2015. The forecast predicts that the market for assembly and packaging equipment will decrease by 16.4 percent to $2.6 billion in 2015 and that the market for semiconductor test equipment is forecast to decrease by 7.4 percent, totaling $3.3 billion this year.

For 2015, Taiwan, South Korea, North America, remain the largest spending regions, with investments in Japan approaching North American levels.  SEMI forecasts that in 2016, equipment sales in Europe will climb to $3.4 billion (63.1 percent increase over 2015). After a 13 percent contraction for Europe in 2015, GLOBALFOUNDRIES, Infineon, Intel, and STMicroelectronics are all expected to significantly accelerate fab equipment spending in 2016, resulting in strong growth in the region in 2016.  In Rest of World, essentially Southeast Asia, sales will reach $2.5 billion (25.7 percent increase), the China market will total $5.3 billion (9.1 percent increase), and North America equipment spending will reach $5.9 billion (6.1 percent increase). The equipment markets in Japan, Korea, and Taiwan are expected to contract in 2016.

The following results are given in terms of market size in billions of U.S. dollars:

Year_End_image_600px

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Year-end Forecast, which provides an outlook for the semiconductor equipment market.

CEA-Leti, an applied-research institute for microelectronics, will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely high-speed wireless data transmission between mobile devices, and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.

The three demonstrations at Eureka Park in the Sands hotel mark Leti’s first formal participation at CES, and reflect the institute’s growing focus on applied technologies for consumer market solutions.

The demonstrators include:

  • DiamonDisplay,the world’s brightest augmented-reality display with the first demonstrator of a high-density micro-LED array that is scalable to a standard microelectronic large-scale fabrication process. This micro-LED display provides brightness that is 100 to 1,000 times higher than current micro displays, enables very high definition, very sharp contrast in daylight and is ideal for compact, lighter products that consume less power.
  • G-Link, a low-power, wireless connection that enables ultra-high-speed transfer of gigabits of data between two devices a few centimeters apart. For consumers it provides a wireless connection between two mobile devices to share, for example, HD videos, between a movie camera and a video display, or between a kiosk and a tablet to download HD videos, etc. G-Link uses a very compact and low-cost package, integrating the entire system, including antennas.  The second generation will be available in 2016 and will provide increased data rate (5Gbps) at lower power consumption (50mW).
  • TV White Space modem, the world’s first wide-area, wireless technology based on the IEEE 1900.7 standard, providinghigh-speed Internet service over long-distances from just one access point. Leti’s demonstration shows a new wireless-network solution that uses adjacent spectrum bands to provide broad coverage indoors and out: up to 64km range in open spaces. The technology can help reduce the digital divide by providing broadband access in underserved rural areas.

“Leti is well known in the industry as a strategic partner for companies that come to us to help them apply tomorrow’s microelectronic technologies in their products, ranging from consumer markets to biotech, security, transportation and the Internet of Things,” said Leti CEO Marie Semeria. “But we also encourage our teams to imagine how our expertise can enhance consumers’ quality of like. This focus on innovation is a pillar of Leti’s successful startup program, and these demonstrators provide a sample of the results.”

Three recent Leti startups also will demonstrate technologies at Eureka Park:

  • Aryballe Technologies will show the diversity of its biochemical sensors in a universal detector able to identify several thousand odors listed in olfactory-signature databases. Its first product is a portable odor-detection device, Neosmia, for people with smell disorders. Booth # 81234.
  • eLichens develops services and miniaturized sensors for consumers and professionals to detect, monitor and predict air quality. The sensors continuously measure the CO, CO2 or CH4 values in local ambient air. Booth # 81233.
  • The AirBoard is an Arduino-compatible, wireless, open-source computer for rapidly prototyping smart connected objects for the Internet of Things. Booth # 81232.

Leti has launched more than 50 startups over the years. These include Movea, the motion-sensing company that was acquired by InvenSense; iskn, a digitized sketching-tool provider, and BeSpoon, whose tracking chips use cell phones to locate within a few centimeters common items such as keys, even from hundreds of meters away.

BeSpoon and EnerBee, a Leti startup that specializes in motion-based energy harvesting, also will exhibit in Eureka Park.

Leti will be part of the French Tech delegation at CES and will be one of 34 participants in Minalogic’s first joint collective mission of the new region Auvergne Rhône-Alpes.

Leti’s team will be available to discuss the demonstrators and provide more information on the institute and its startup program at booth # 81333 in Eureka Park.

SEMICON Japan 2015, an exhibition in Asia for semiconductor manufacturing and related processing technology, opens tomorrow at Tokyo Big Sight. The exposition and conference offers the latest in technology and innovations for the microelectronics industry, including emerging opportunities in the new World of IoT (Internet of Things). SEMICON Japan (December 16-18) registration is now open for both the exhibition and conference programs.

Japan is uniquely positioned to support the IoT revolution with its large 200mm fab capacity, diverse product mix and leadership in markets such as MCUs, automotive, power devices, sensors and LEDs. SEMICON Japan 2015 connects the players and companies enabling the world of IoT by facilitating communications and partnerships across the microelectronics industry.

Highlights at SEMICON Japan include:

  • The SuperTHEATER at Tokyo Big Sight will offer the Opening Ceremony at 9:40 a.m. Wednesday, and nine forums in three days featuring speakers from: Amazon, Cisco Systems, Fujitsu, Google,Hitachi, IBM, Intel, KLA-Tencor, Micron Technology, Microsoft, Nissan Motors, Rakuten, Renesas Electronics, Sony, Tata Consultancy Services, Toshiba, TSMC, and more.
  • Held in conjunction with SEMICON Japan, WORLD OF IOT, a “show-within-a-show”, offers a platform where semiconductor manufacturing technology intersects with IoT applications. The 65 exhibitors include Amazon Web Services, Dassault Systems, Fujitsu, Hitachi, IBM Research-Tokyo, Intel, Siemens, Tesla Motors, Toshiba Healthcare, Toyota Motors, and more.
  • Two theme pavilions – Sustainable Manufacturing Pavilion, providing solutions focused on sustainability for 200mm technologies, and Manufacturing Innovation Pavilion, showcasing innovations for developing higher performing, faster and lower-cost semiconductor devices – are adjacent in East Hall 1.
  • Showcasing startup pitch presentations and exhibits from early-stage companies, the INNOVATION VILLAGE connects 13 emerging companies with investors and prospective technology partners.

Osamu Nakamura, president of SEMI Japan, said “With the building momentum from the IoT revolution, the Japan semiconductor industry is poised to take advantage of growth within the Japan supply chain. I welcome all of you from the global semiconductor industry to learn about the innovations that will support this growth as you visit the exhibition and participate in the conferences at SEMICON Japan.”

For more information on SEMICON Japan, visit www.semiconjapan.org/en/.