Category Archives: FPDs and TFTs

Notch design of smartphone displays is estimated to raise manufacturing cost of display panels by more than 20 percent, according to IHS Markit.

According to the OLED Display Cost Model by IHS Markit, manufacturing cost of the 5.9-inch organic light-emitting diode (OLED) panel with notch design, as in the Apple iPhone X, is estimated to be $29. It is found to be 25 percent higher than manufacturing cost of full-display OLED panel without the notch design used in the 5.8-inch display for the Samsung Galaxy S9. Similar cost gap is also found in the thin-film transistor liquid crystal display (TFT-LCD). Manufacturing cost of a 6-inch notch TFT-LCD panel is estimated to be $19, 20 percent higher than similar-sized non-notch, full-display LCD panel.

“Notch cutting should accompany yield loss, resulting in increases in manufacturing cost. In case of TFT-LCD, a notch design may push up the manufacturing cost even to the level of rigid, full-screen OLED’s,” said Jimmy Kim, Ph.D. and senior principal analyst for display materials at IHS Markit. “For OLED panels, cost increase caused by notch design seems to be even higher.”

Quarterly shipments of the iPhone X, Apple’s first smartphone model using OLED panels, have reportedly been smaller than previous iPhone models’ so far, mainly due to higher selling price, caused by expensive OLED panels. “Apple seems to be in the middle of manufacturing optimization,” Kim said.

“Eventually, manufacturing cost for notch OLED will fall more rapidly than that for notch TFT-LCD. The plastic substrate for OLED is not as brittle as glass used in TFT-LCD, so it should be easier to cut the notch, theoretically.”

The OLED Display Cost Model by IHS Markit includes manufacturing cost analysis and forecasts of OLED display panels in mass production for smartwatch, smartphone, tablet PC and TV.

Technology trends in backplane technology are driving higher gas demand in display manufacturing. Specific gas requirements of process blocks are discussed, and various supply modes are reviewed.

BY EDDIE LEE, Linde Electronics, Hsinchu, Taiwan

Since its initial communalization in the 1990s, active matrix thin-film-transistor (TFT) displays have become an essential and indispensable part of modern living. They are much more than just televisions and smartphones; they are the primary communication and information portals for our day-to- day life: watches (wearables), appliances, advertising, signage, automobiles and more.

There are many similarities in the display TFT manufacturing and semiconductor device manufacturing such as the process steps (deposition, etch, cleaning, and doping), the type of gases used in these steps, and the fact that both display and semiconductor manufacturing both heavily use gases.

However, there are technology drivers and manufacturing challenges that differentiate the two. For semiconductor device manufacturing, there are technology limitations in making the device increasingly smaller. For display manufacturing, the challenge is primarily maintaining the uniformity of glass as consumers drive the demand for larger and thinner displays.

While semiconductor wafer size has maxed because of the challenges of making smaller features uniformly across the surface of the wafer, the size of the display mother glass has grown from 0.1m x 0.1m with 1.1mm thickness to 3m x 3m with 0.5mm thickness over the past 20 years due to consumer demands for larger, lighter, and more cost-effective devices.

As the display mother glass area gets bigger and bigger,so does the equipment used in the display manufacturing process and the volume of gases required. In addition, the consumer’s desire for a better viewing experience such as more vivid color, higher resolution, and lower power consumption has also driven display manufacturers to develop and commercialize active matrix organic light emitting displays (AMOLED).

Technology

Layers of display device

In general, there are two types of displays in the market today: active matrix liquid crystal display (AMLCD) and AMOLED. In its simplicity, the fundamental components required to make up the display are the same for AMLCD and AMOLED. There are four layers of a display device (FIGURE 1): a light source, switches that are the thin-film-transistor and where the gases are mainly used, a shutter to control the color selection, and the RGB (red, green, blue) color filter.

About backplane/TFT

The thin-film-transistors used for display are 2D transitional transistors, which are similar to bulk CMOS before FinFET. For the active matrix display, there is one transistor for each pixel to drive the individual RGB within the pixel. As the resolution of the display grows, the transistor size also reduces, but not to the sub-micron scale of semiconductor devices. For the 325 PPI density, the transistor size is approximately 0.0001 mm2 and for the 4K TV with 80 PPI density, the transistor size is approximately 0.001 mm2.

Technology trends TFT-LCD (thin-film-transistor liquid-crystal display) is the baseline technology. MO / White OLED (organic light emitting diode) is used for larger screens. LTPS / AMOLED is used for small / medium screens. The challenges for OLED are the effect of < 1 micron particles on yield, much higher cost compared to a-Si due to increased mask steps, and moisture impact to yield for the OLED step.

Mobility limitation (FIGURE 2) is one of the key reasons for the shift to MO and LTPS to enable better viewing experience from higher resolution, etc.

The challenge to MO is the oxidation after IGZO metalization / moisture prevention after OLED step, which decreases yield. A large volume of N2O (nitrous oxide) is required for manufacturing, which means a shift in the traditional supply mode might need to be considered.

Although AMLCD displays are still dominant in the market today, AMOLED displays are growing quickly. Currently about 25% of smartphones are made with AMOLED displays and this is expected to grow to ~40% by 2021. OLED televisions are also growing rapidly, enjoying double digit growth rate year over year. Based on IHS data, the revenue for display panels with AMOLED technol- ogies is expected to have a CAGR of 18.9% in the next five years while the AMLCD display revenue will have a -2.8% CAGR for the same period with the total display panel revenue CAGR of 2.5%. With the rapid growth of AMOLED display panels, the panel makers have accel- erated their investment in the equipment to produce AMOLED panels.

Types of backplanes

There are three types of thin-film-transistor devices for display: amorphous silicon (a-Si), low temperature polysilicon (LTPS), and metal oxide (MO), also known as transparent amorphous oxide semiconductor (TAOS). AMLCD panels typically use a-Si for lower-resolution displays and TVs while high-resolution displays use LTPS transistors, but this use is mainly limited to small and medium displays due to its higher costs and scalability limitations. AMOLED panels use LTPS and MO transistors where MO devices are typically used for TV and large displays (FIGURE 3).

How gases are used

This shift in technology also requires a change in the gases used in production of AMOLED panels as compared with the AMLCD panels. As shown in FIGURE 4, display manufacturing today uses a wide variety of gases.

These gases can be categorized into two types: Electronic Specialty gases (ESGs) and Electronic Bulk gases (EBGs) (FIGURE 5). Electronic Specialty gases such as silane, nitrogen trifluoride, fluorine (on-site generation), sulfur hexafluoride, ammonia, and phosphine mixtures make up 52% of the gases used in the manufacture of the displays while the Electronic Bulk gases–nitrogen, hydrogen, helium, oxygen, carbon dioxide, and argon – make up the remaining 48% of the gases used in the display manufacturing.

Key usage drivers

The key ga susage driver in the manufacturing of displays is PECVD (plasma-enhanced chemical vapor deposition), which accounts for 75% of the ESG spending, while dry etch is driving helium usage. LTPS and MO transistor production is driving nitrous oxide usage. The ESG usage for MO transistor production differs from what is shown in FIGURE 4: nitrous oxide makes up 63% of gas spend, nitrogen trifluoride 26%, silane 7%, and sulfur hexafluoride and ammonia together around 4%. Laser gases are used not only for lithography, but also for excimer laser annealing application in LTPS.

Silane: SiH4 is one of the most critical molecules in display manufacturing. It is used in conjunction with ammonia (NH3) to create the silicon nitride layer for a-Si transistor, with nitrogen (N2) to form the pre excimer laser anneal a-Si for the LTPS transistor, or with nitrous oxide (N2O) to form the silicon oxide layer of MO transistor.

Nitrogen trifluoride: NF3 is the single largest electronic material from spend and volume standpoint for a-Si and LTPS display production while being surpassed by N2O for MO production. NF3 is used for cleaning the PECVD chambers. This gas requires scalability to get the cost advantage necessary for the highly competitive market.

Nitrous oxide: Used in both LTPS and MO display production, N2O has surpassed NF3 to become the largest electronic material from spend and volume standpoint for MO production. N2O is a regional and localized product due to its low cost, making long supply chains with high logistic costs unfeasible. Averaging approximately 2 kg per 5.5 m2 of mother glass area, it requires around 240 tons per month for a typical 120K per month capacity generation 8.5 MO display production. The largest N2O compressed gas trailer can only deliver six tons of N2O each time and thus it becomes both costly and risky
for MO production.

Nitrogen: For a typical large display fab, N2 demand can be as high as 50,000 Nm3/hour, so an on-site generator, such as the Linde SPECTRA-N® 50,000, is a cost-effective solution that has the added benefit of an 8% reduction in CO2 (carbon dioxide) footprint over conventional nitrogen plants.

Helium: H2 is used for cooling the glass during and after processing. Manufacturers are looking at ways to decrease the usage of helium because of cost and availability issues due it being a non-renewable gas.

Gas distribution at the fab

N2 On-site generators: Nitrogen is the largest consumed gas at the fab, and is required to be available before the first tools are brought to the fab. Like major semiconductor fabs, large display fabs require very large amounts of nitrogen, which can only be economically supplied by on-site plants.

Cryogenic liquid truck trailers: Oxygen, argon, and carbon dioxide are produced at off-site plants and trucked short distances as cryogenic liquids in specialty vacuum-insulated tankers.
Compressed gas truck trailers: Other large volume gases like hydrogen and helium are supplied over longer distances in truck or ISO-sized tanks as compressed gases.

Individual packages: Specialty gases are supplied in individual packages. For higher volume materials like silane and nitrogen trifluoride, these can be supplied in large ISO packages holding up to 10 tons. Materials with smaller requirements are packaged in standard gas cylinders.

Blended gases: Laser gases and dopants are supplied as blends of several different gases. Both the accuracy and precision of the blended products are important to maintain the display device fabrication operating within acceptable parameters.

In-fab distribution: Gas supply does not end with the delivery or production of the material of the fab. Rather, the materials are further regulated with additional filtration, purification, and on-line analysis before delivery to individual production tools.

Conclusion

The consumer demand for displays that offer increas- ingly vivid color, higher resolution, and lower power consumption will challenge display makers to step up the technologies they employ and to develop newer displays such as flexible and transparent displays. The transistors to support these new displays will either be LTPS and / or MO, which means the gases currently being used in these processes will continue to grow. Considering the current a-Si display production, the gas consumption per area of the glass will increase by 25% for LTPS and ~ 50% for MO productions.

To facilitate these increasing demands, display manufacturers must partner with gas suppliers to identify which can meet their technology needs, globally source electronic materials to provide customers with stable and cost- effective gas solutions, develop local sources of electronic materials, improve productivity, reduce carbon footprint, and increase energy efficiency through on-site gas plants. This is particularly true for the burgeoning China display manufacturing market, which will benefit from investing in on-site bulk gas plants and collaboration with global materials suppliers with local production facilities for high-purity gas and chemical manufacturing.

By Walt Custer, Custer Consulting Group

Broad global & U.S. electronic supply chain growth

The first quarter of this year was very strong globally, with growth across the entire electronics supply chain. Although Chart 1 is based on preliminary data, every electronics sector expanded –  with many in double digits. The U.S. dollar-denominated growth estimates in Chart 1 have effectively been amplified by about 5 percent by exchange rates (as stronger non-dollar currencies were consolidated to weaker U.S. dollars), but the first quarter global rates are very impressive nonetheless.

Walt Custer Chart 1

U.S. growth was also good (Chart 2) with Quarter 1 2018 total electronics equipment shipments up 7.2 percent over the same period last year. Since all the Chart 2 values are based on domestic (US$) sales, there is no growth amplification due to exchange rates.

Walt Custer Chart 2

We expect continued growth in Quarter 2 but not at the robust pace as the first quarter.

Chip foundry growth resumes

Taiwan-listed companies report their monthly revenues on a timely basis – about 10 days after month end. We track a composite of 14 Taiwan Stock Exchange listed chip foundries to maintain a “pulse” of this industry (Chart 3).

Walt Custer Chart 3

Chip foundry sales have been a leading indicator for global semiconductor and semiconductor capital equipment shipments. After dropping to near zero in mid-2017, foundry growth is now rebounding.

Chart 4 compares 3/12 (3-month) growth rates of global semiconductor and semiconductor equipment sales to chip foundry sales. The foundry 3/12 has historically led semiconductors and SEMI equipment and is pointing to a coming cyclical upturn. It will be interesting to see how China’s semiconductor industry buildup impacts this historical foundry leading indicator’s performance.

Walt Custer Chart 4

Passive Component Shortages and Price Increases

Passive component availability and pricing are currently major issues. Per Chart 5, Quarter 1 2018 passive component revenues increased almost 25 percent over the same period last year. Inadequate component supplies are hampering many board assemblers with no short-term relief in sight.

Walt Custer Chart 5

Peeking into the Future

Looking forward, the global purchasing managers index (a broad leading indicator) has moderated but is still well in growth territory.

Walt Custer Chart 6

The world business outlook remains positive but requires continuous watching!

Walt Custer of Custer Consulting Group is an  analyst focused on the global electronics industry.

Originally published on the SEMI blog.

Despite the low seasonality factor and brands turning their focus away from volume growth, the demand for large display panels showed better-than-expected results in the first quarter of 2018, albeit still weak, according to IHS Markit (Nasdaq: INFO).

First quarter of each year is typically a slow season for the display market as set brands try to clear out carried inventories before they launch new models in a new year. In addition, particularly this year, top-tier brands were expected to stop focusing on volume growth, which lowered market expectation on the panel demand.

However, shipments of large display panels posted better-than-expected results in the first quarter of 2018, according to Large Area Display Market Tracker by IHS Markit. Compared to a year ago, shipments of large displays — larger than 9 inches — increased by 6 percent in unit and by 10 percent in area.

LG Display retained its lead in the large display panel market in terms of area shipments with a stake of 22 percent, followed by Samsung Display with 17 percent, while, in terms of unit shipments, BOE led the market with a 22 percent share.

“In area shipments, South Korean panel makers keep their leading position in the large display market as they are strong in the TV display market,” said Robin Wu, principal analyst at IHS Markit.

Shipments of TV displays increased by 12 percent in unit and by 11 percent in area in the first quarter of 2018 compared to a year ago, leading to the better-than-expected trend. In particular, unit shipments of 55-inch and larger TV panels jumped 20 percent year on year in the first quarter. 4K TV display unit shipment also increased by 19 percent during the same period to 24.6 million units, and OLED TV display shipments reached some 600,000 units with 110 percent year-on-year growth.

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“Increases in large display panel production capacity, particularly in China, helped the year-on-year shipment growth, which was somewhat expected,” Wu said. “But, if you look at the shipment growth in a quarter-on-quarter term, it is quite interesting.”

For the past three years from 2015 to 2017, on average, unit shipments of large display declined 10 percent in the first quarters compared to the previous quarter, and area shipments were down 8 percent.

“This year also shows declines in the first quarter with a 4 percent drop in unit shipments and 7 percent down in area shipments, but the contraction is narrower than the previous years,” Wu said. “This indicates the shipment trend in first quarter 2018 was better than expected.”

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Wu noted, however, that shipments dropped 10 percent in value due to continued erosion in panel price, which began in mid- 2017.

“The major concerns to the panel makers is how to achieve a turnaround in panel prices and when,” Wu said. “Trends in TV display panels that are shifting to larger sizes and heading to higher-end products can be the key to overcome the challenge.”Wu noted, however, that shipments dropped 10 percent in value due to continued erosion in panel price, which began in mid- 2017.

The Large Area Display Market Tracker by IHS Markit provides information about the entire range of large display panels shipped worldwide and regionally, including monthly and quarterly revenues and shipments by display area, application, size and aspect ratio for each supplier.

An international research team from Russia, France, and Germany has proposed a new method for orienting liquid crystals. It could be used to increase the viewing angle of liquid-crystal displays. The paper was published in the journal ACS Macro Letters.

“This is first and foremost a fundamental study exploring the mechanisms of liquid crystal orientation,” says Dimitri Ivanov, the head of the Laboratory of Functional Organic and Hybrid Materials at MIPT. “That said, we expect that these mechanisms might have applications in new LCD technology.”

Subpixel structure in a twisted nematic LCD. Credit: Lion_on_helium/MIPT Press Office

Subpixel structure in a twisted nematic LCD. Credit: Lion_on_helium/MIPT Press Office

Liquid crystals

Most solids are crystals. In a crystal, molecules or atoms form an ordered three-dimensional structure. Unlike solids, liquids lack this internal long-range order, but they can flow. Matter in a liquid-crystal state has properties that are intermediate between those of liquids and crystals: It possesses both the molecular order and the ability to flow. A liquid crystal can thus be viewed as an “ordered” liquid.

Not all materials can exhibit a liquid crystalline state, and the phase transition mechanisms may vary. Among other things, the molecules of an LC material have to be anisometric — that is, rod- or disk-shaped. Some compounds become LCs in a certain temperature range. These are called thermotropic. By contrast, lyotropic LCs adopt the liquid crystalline state when a solvent is added.

The properties of an LC material vary depending on the direction. For example, polarized light propagates in a liquid crystal at different speeds along different directions. Also, in an electric or magnetic field, the orientation of LCs can rapidly change. This phenomenon is known as the Fréedericksz transition. Thanks to the optical properties of LCs and their ability to be easily realigned, they are widely used in the electronic displays of TVs, computers, phones, and other devices.

Liquid-crystal displays

In an LCD, the image is generated by changing the intensity of light in each pixel via an electric field, which realigns liquid crystals. There are several LCD configurations, but the one most commonly used is based on twisted nematic LCs. These are rod-shaped thermotropic liquid crystals that can adopt a twisted configuration by using special aligning substrates. Applying an electric field to these LCs can untwist them. This reproducible and predictable response can be used to control light intensity.

Each pixel in a color LCD consists of three subpixels: red, green, and blue. By varying their intensities, any color can be displayed. A subpixel in a twisted nematic-based LCD (figure 1) consists of a light source, a color filter, two polarizers, and an LC cell between two glass plates with electrodes. If the liquid crystals were not there, no light would pass through the cell, because whatever light is let through by the vertical polarizer would be blocked by the horizontal polarizer before reaching the color filter. However, special substrates with groovy surfaces can be used to twist LCs in a spiral between two polarizers so as to turn the light precisely by the amount needed to pass through the second polarizer. The fully illuminated state of the subpixel is actually its “off” state. When voltage is applied, the liquid crystals untwist, changing the light polarization to a lesser degree. As a result, some of the light is blocked. Eventually, as some voltage no light can reach the color filter, and the subpixel goes dark.

One of the limitations of this technology is the viewing angle of a display: From a sideways perspective, the LCD will not render the colors accurately. This is due to the co-alignment of liquid crystals. The issue can be solved using multidomain displays, in which pixels belong to a number of domains, whose LC orientations are different. This means that at least some of the domains are always oriented in the right way. The international team of researchers led by Professor Dimitri Ivanov, who heads MIPT’s Laboratory of Functional Organic and Hybrid Materials, has proposed a brand new solution for multidomain display design.

Going orthogonal

The authors of the paper reported in this story worked with liquid-crystal polymers. These are substances composed of long molecules with chainlike repetitive structure. It turned out that a slight variation in the structure of polymers can drastically alter their orientation on the substrate. The polymers used in the study are poly(di-n-alkylsiloxanes), or PDAS. Each molecule is a chain containing alternating silicon and oxygen atoms. The silicon atoms in PDAS bear two symmetric hydrocarbon side chains (figure 2). The n in the name of the compound stands for the length of the side chains, which was varied between 2 and 6.

In the experiment, polymers from the PDAS family were deposited on a Teflon-rubbed aligning surface with a regular pattern of grooves. Generally, crystalline polymers are known to align on such substrates, but only when the lattice parameters of the substrate match those of the deposited polymer. The researchers examined the orientation of the liquid-crystal polymer chains relative to the direction of the grooves on the aligning surface. The side chain length n was increased in steps of just one methylene group (CH?) at a time.

It was found that, contrary to expectations, the liquid-crystal orientation varied depending on side-chain length. At n equal to 2, the needlelike polymer superstructures known as lamellae co-aligned with the Teflon grooves. Because lamellae are known to be perpendicular to the polymer chains, the researchers concluded that the polymer chains are perpendicular to the grooves on the substrate (figure 3, left). When n was increased to 3, the orientation of the lamellae changed by 90 degrees, making them perpendicular to the grooves. As a result, the LC polymer chains were now oriented parallel to the grooves (figure 3, right). At n equal to 4, no further change in orientation was observed. However, when the side-chain length was further increased to 5 and 6, the lamellae again co-aligned with the Teflon grooves.

The researchers have thus found that by merely adding one methylene group to the side chain of the polymer, they could switch the LC orientation, which is crucial for most applications of liquid crystals, including LCDs. According to the authors, the effect they discovered could be used to design LCDs with improved viewing angles. This could be achieved using a multidomain technology that works by orienting subpixels of one color in different directions. As a result, the pixels compensate one another when the display is viewed at an angle, improving color rendition. The researchers expect this technology to be considerably simpler and cheaper than other multidomain approaches that are currently used.

Engineering and physics researchers at North Carolina State University have developed a new technology for steering light that allows for more light input and greater efficiency – a development that holds promise for creating more immersive augmented-reality display systems.

At issue are diffraction gratings, which are used to manipulate light in everything from electronic displays to fiber-optic communication technologies.

“Until now, state-of-the-art diffraction gratings configured to steer visible light to large angles have had an angular acceptance range, or bandwidth, of about 20 degrees, meaning that the light source has to be directed into the grating within an arc of 20 degrees,” says Michael Escuti, a professor of electrical and computer engineering at NC State and corresponding author of a paper on the work. “We’ve developed a new grating that expands that window to 40 degrees, allowing light to enter the grating from a wider range of input angles.

“The practical effect of this – in augmented-reality displays, for example – would be that users would have a greater field of view; the experience would be more immersive,” says Escuti, who is also the chief science officer of ImagineOptix Corp., which funded the work and has licensed the technology.

The new grating is also significantly more efficient.

“In previous gratings in a comparable configuration, an average of 30 percent of the light input is being diffracted in the desired direction,” says Xiao Xiang, a Ph.D. student at NC State and lead author of the paper. “Our new grating diffracts about 75 percent of the light in the desired direction.”

This advance could also make fiber-optic networks more energy efficient, the researchers say.

The new grating achieves the advance in angular bandwidth by integrating two layers, which are superimposed in a way that allows their optical responses to work together. One layer contains molecules that are arranged at a “slant” that allows it to capture 20 degrees of angular bandwidth. The second layer is arranged at a different slant, which captures an adjacent 20 degrees of angular bandwidth.

The higher efficiency stems from a smoothly varying pattern in the orientation of the liquid crystal molecules in the grating. The pattern affects the phase of the light, which is the mechanism responsible for redirecting the light.

“The next step for this work is to take the advantages of these gratings and make a new generation of augmented-reality hardware,” Escuti says.

The paper, “Bragg polarization gratings for wide angular bandwidth and high efficiency at steep deflection angles,” is published in the journal Scientific Reports. The paper was co-authored by Jihwan Kim, a research assistant professor of electrical and computer engineering at NC State.

With demand growing for active matrix organic light-emitting diode (AMOLED) TV panels, shipments of overall AMOLED panels by area is forecast to more than quadruple to 22.4 million square meters by 2024 from 5.0 million square meters in 2017, according to IHS Markit (Nasdaq: INFO), a world leader in critical information, analytics and solutions.

Shipments of AMOLED TV panels had doubled to 1.6 million square meters in 2017 from about 800,000 square meters in 2016, resulting in total AMOLED panel shipments to grow more than 30 percent to 5.0 million square meters in 2017 from 3.8 million square meters in 2016. Share of TV panels in the total AMOLED panel shipments increased to 32 percent from 21 percent in 2016.

“Demand growth in AMOLED TV panels has accelerated since 2016 due to the increasing demand for wide color gamut TV,” said Jerry Kang, senior principal analyst of display research at IHS Markit. “Most TV brands have been promoting AMOLED TV as their super premium product, which has differentiated optical performance from LCD TV.”

While 10 global TV brands shipped OLED TVs in 2017, 15 are planning to launch them in 2018. TV brands are trying to expand share of OLED TVs in their portfolio to rebound their total TV revenues.

“In terms of unit shipments, the TV market has seen declines for three consecutive years since 2015,” Kang said. “Now, major TV brands are prioritizing their focus on revenues rather than just the growth in unit shipments, with the added value that AMOLED TV offering higher-resolution and wide color-gamut display.”

According to the AMOLED & Flexible Display Intelligence Service by IHS Markit, shipments of AMOLED TV panels will reach 12.5 million units by 2024. “Many panel makers are trying to develop various technology to manufacture OLED TV panels — not only with white OLED but also with ink-jet process or quantum-dot materials,” Kang said.

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The AMOLED & Flexible Display Intelligence Service covers the latest market trend and forecast of AMOLED display industries (including shadow mask and  polyimide substrate), technology and capacity analysis, and panel suppliers’ business strategies by region.

Demand for panels – both thin-film transistor liquid crystal display (TFT LCD) and active-matrix organic light-emitting diode (AMOLED) – using oxide backplane technology doubled in 2017, in terms of area, compared to a year ago, according to a latest report from business information provider IHS Markit (Nasdaq: INFO). The market is forecast to grow 30 percent in 2018 to 5.3 billion square meters from 2017.

Oxide backplane technology offers the benefit of higher resolution while consuming lower power, which are better suited to IT consumer products that require high mobility. With Apple’s increasing adoption of oxide TFT LCD panels for its tablet and notebook products in 2017, the demand surged 98 percent in 2017 year on year. Area demand for OLED TV panels using the oxide backplane technology also increased by 106 percent during the same period, according to the latest Display long term demand forecast tracker by IHS Markit.

“Demand for oxide panels will continue to grow in 2018 as demand particularly for OLED TV, with 55 inch or larger screens, increases,” said Linda Lin, principal analyst of display research at IHS Markit. “Increasing demand from IT products and rising penetration of OLED panels to major applications will help growing demand for LCD and OLED panels using oxide backplane technology in 2018, respectively.”

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Panels using oxide backplane technology are mainly supplied by Sharp and LG Display. While Sharp is focusing on the oxide backplane for TFT LCD for IT applications, LG Display is more targeting the oxide backplane for OLED panels for TVs. Both are planning to expand their oxide capacity in 2018.

Sharp’s Gen 6 fab in Kameyama, Japan, is solely dedicated to producing low temperature polysilicon (LTPS) panels. To grab more orders for the Apple iPad, the company is going to change 40 percent of its LTPS capacity to oxide at the end of 2018.

Its Gen 8 fab in Kameyama is also planning to gradually increase the oxide capacity beginning the first quarter of 2018, from 50 percent of its all capacity in the last quarter of 2017 to 75 percent by the end of 2018. On the other hand, oxide panel price would be a key point to increase Oxide panel’s market share and decide that Sharp can enlarge Oxide capacity continuously or not in the future.

LG Display also plans to increase oxide panel capacity to prepare for the OLED TV panel business in future. Its Gen 8.5 OLED fab in Guangzhou, China, plans to start mass production of oxide backplane using OLED panels in the second half of 2019, with a capacity of 60,000 units per month. In Paju of South Korea, the company is also working to build Gen 10.5 fabs for both a-Si and oxide backplane panels.

Flexible televisions, tablets and phones as well as ‘truly wearable’ smart tech are a step closer thanks to a nanoscale transistor created by researchers at The University of Manchester and Shandong University in China.

The international team has developed an ultrafast, nanoscale transistor – known as a thin film transistor, or TFT, – made out of an oxide semiconductor. The TFT is the first oxide-semiconductor based transistor that is capable of operating at a benchmark speed of 1 GHz. This could make the next generation electronic gadgets even faster, brighter and more flexible than ever before.

A TFT is a type of transistor usually used in a liquid crystal display (LCD). These can be found in most modern gadgets with LCD screens such as smart phones, tablets and high-definition televisions.

How do they work? LCD features a TFT behind each individual pixel and they act as individual switches that allow the pixels to change state rapidly, making them turn on and off much more quickly.

But most current TFTs are silicon-based which are opaque, rigid and expensive in comparison to the oxide semiconductor family of transistors which the team from the UK and China are developing. Whilst oxide TFTs will improve picture on LCD displays, it is their flexibility that is even more impressive.

Aimin Song, Professor of Nanoelectronics in the School of Electrical & Electronic Engineering, The University of Manchester, explains: “TVs can already be made extremely thin and bright. Our work may help make TV more mechanically flexible and even cheaper to produce.

“But, perhaps even more importantly, our GHz transistors may enable medium or even high performance flexible electronic circuits, such as truly wearable electronics. Wearable electronics requires flexibility and in many cases transparency, too. This would be the perfect application for our research.

“Plus, there is a trend in developing smart homes, smart hospitals and smart cities – in all of which oxide semiconductor TFTs will play a key role.”

Oxide-based technology has seen rapid development when compared to its silicon counterpart which is increasingly close to some fundamental limitations. Prof Song says there has been fast progress in oxide-semiconductors in recent years and extensive efforts have been made in order to improve the speed of oxide-semiconductor-based TFTs.

So much so some oxide-based technology has already started replacing amorphous silicon in some gadgets. Prof Song thinks these latest developments have brought commercialisation much closer.

He added: “To commercialise oxide-based electronics there is still a range of research and development that has to be carried out on materials, lithography, device design, testing, and last but not the least, large-area manufacturing. It took many decades for silicon technology to get this far, and oxides are progressing at a much faster pace.

“Making a high performance device, like our GHz IGZO transistor, is challenging because not only do materials need to be optimised, a range of issues regarding device design, fabrication and tests also have to be investigated. In 2015, we were able to demonstrate the fastest flexible diodes using oxide semiconductors, reaching 6.3 GHz, and it is still the world record to date. So we’re confident in oxide-semiconductor based technologies. ”

 

By Jamie Girard, Sr. Director, Public Policy, SEMI

Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year. Congressional spending has been allocated in fits and starts since the end of FY 2017 last September, with patchwork deals keeping things running amid pervasive uncertainty. While this clearly isn’t an ideal way to fund the federal government, the end result will make many in the business of research and development pleased with the addition of more resources for science and innovation.

There was grave concern over the future of federal spending with the release of the president’s FY 2018 budget, which would have cut the National Science Foundation (NSF) budget by 11 percent and National Institutes of Standards & Technology (NIST) spending by 30 percent. Relief came with early drafts from Congress that whittled those cuts down to between 2-9 percent. But the real boost was a February bipartisan Congressional agreement that lifted self-imposed spending caps and introduced a generous dose of non-defense discretionary spending, increasing NSF spending 3.9 percent over the previous year and the NIST budget an astounding 25.9 percent over FY 2017 levels.

SEMI applauds this much-needed support for basic research and development (R&D) at these agencies after their budgets were cut or flat-funded for multiple cycles. It is well understood that federal R&D funding is critical to U.S. competitiveness and future economic prosperity. With the stakes that high, full funding of R&D programs at the NSF and NIST should be a bipartisan national priority backed by a strong and united community of stakeholders and advocates in the business, professional, research, and education communities.

With the work for FY 2018 completed, Congress will now turn to FY 2019 spending – already behind schedule due to the belated completion of the previous year’s budget. With 2018 an election year, Congress will likely begin work on the FY 2019 budget in short order, but probably won’t complete its work prior to the November elections.  SEMI will continue to work with lawmakers to support the R&D budgets at the agencies and their important basic science research. If you’d like to know how you can be more involved with SEMI’s public policy work, please contact Jamie Girard, Sr. Director, Public Policy at [email protected].