Category Archives: Manufacturing

A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Seoul National University lab researchers recently installed two Apex SLR systems with the well-proven inductively coupled plasma (ICP) source technology from Plasma-Therm. One system is configured for dry etching, and the second system is configured for high-density plasma chemical vapor deposition (HDPCVD).

Jong-Seung Park, Team Manager/Fab. Operations of Seoul National University, said the university’s cleanroom facility serves many users who are employing the Apex SLR® systems’ etch and deposition capabilities.

“We are pleased to provide a good reference for these systems and their support,” Park said. “Both systems operate as we expected and deliver reproducible results over the last more than 16 months. The systems are reliable and we are pleased to be a customer of Plasma-Therm.”

Park said the Apex SLR ICP system utilizes chlorine-based chemistries for etching various materials, with an emphasis on aluminum interconnects. The Apex SLR® HDPCVD system has been employed for a wide range of silicon oxide and silicon nitride deposition processes, such as trench or gap filling for device fabrication.

Dr. David Lishan, Director, Technical Marketing for Plasma-Therm, said that Apex SLR systems are ideally suited for corporate R&D and academic research settings. “The Apex SLR, with its very strong and successful processing history, excellent uniformity and reproducibility, has proven highly productive in research environments.” Dr. Lishan continued, “The ability for facilities like SNU’s to task Apex SLR systems and quickly achieve process specs for multiple users are big reasons for selection of Apex SLR over products that are less capable and more expensive.”

Advanced Vacuum Apex SLR systems are highly versatile, small-footprint, field-proven tools for all plasma processing applications. Apex SLR ICP is capable of etching a wide range of materials for semiconductor devices and other types of nanotechnology. Apex SLR HDPCVD performs deposition of high-quality thin films at relatively low temperatures for applications such as optical coatings, semiconductor device passivation layers, and other nano-electronic fabrication processes with limited thermal budgets.

By Yann Guillou, SEMI Europe

Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.  Over 200 attendees, including the industry’s most influential executives and decision makers, are expected to discuss challenges, solutions, and critical trends impacting the sector.  The full program line-up for SEMI’s MEMS flagship event is available online.  Have a look and register now.

The event’s keynote presentation will be delivered by Udo Gomez, CTO of Bosch Sensortec, headquartered just a few kilometers away from the conference venue.  During his talk titled, “Smart Connected MEMS Sensors – Enabler for the IoT,” with the perspective of a sensor systems integrator, Gomez will discuss how different application domains overlap, the key drivers of connectivity and digitalization, and what is missing with respect to bridging future technologies.

One of the MEMS “Titans,” Benedetto Vigna, EVP and GM of STMicroelectronics, will deliver a keynote about “MEMS Sensors and Actuators – Opportunities and Challenges” and review their implication on ST focus areas such as Smart Driving and the Internet of Things.  It will be exciting to see what Vigna will share with the audience and what details might support what Peter Clarke recently called the “ST resurgence”.

Representing one of the largest growing companies of 2015, Robert Aigner, senior director from Qorvo, will keynote and present the success story behind BAW filters in his talk called “BAW and the “Edge of Tomorrow” in Wireless Communication: Innovate, Ramp. Repeat.” BAW filters had been termed “niche play,” but are now identified as key enablers for smartphones with multibillions of units expected to ship in 2016.

Addressing a key aspect of the quadriptych “power, performance, area and cost” equation, Adrian Arcedera, VP, AMKOR, will in his keynote talk discuss “Sensor in Package – Standard Package Platform for Sensor Fusion and IoT”. To offer cost competitive solutions without compromising performance, he will explain what standardization efforts are needed in packaging, assembly, test, and detail the solution proposed by AMKOR. He may also take the opportunity to provide additional info about the brand new MEMS plant of AMKOR in China.

In addition to these keynote talks, a top notch speaker line-up will be presented to attendees. Market analysts will share the results of their latest reports featuring IHS, Yole Developpement, and Roland Berger. Foundries such as GLOBALFOUNDRIES and Teledyne DALSA will present their strategies. The hyper active company in M&A, ams AG, will talk about MEMS and optical sensor in consumer and wearable electronics.

Intel will join the stage, addressing wearables in addition to providing a review of the key enabling technologies impacting MEMS today. NXP and Bosch will discuss sensors for automotive.  MEMS and CMOS integration, from a process and design perspective, will be addressed by Fraunhofer IPMS and Coventor and Invensas will deliver a presentation from a technological aspect.  Last, but not least, we are very excited to introduce great and promising start-ups Innoluce, USound, Polight and Enerbee. Attendees can look forward to hearing their pitches and learning about their innovative ideas.

Exhibitor space has sold out, but you can visit our website to see who will be exhibiting at the European MEMS Summit in Stuttgart.  Connect to the leaders and industry professionals that will help “Make Every Market Smarter” in the MEMS and Sensor value chain.  Register now, and be part of this exciting event in Stuttgart!

Please follow: SEMI Europe LinkedIn and SEMI Europe Twitter; also Global SEMI LinkedIn and SEMI Twitter.

A major research institution has placed orders for two Advanced Vacuum plasma processing systems that will provide etch and deposition capabilities to be used in nanoelectronics research and development.

The order by imec, a Belgium-based, global nanoelectronics R&D center, is for two Advanced Vacuum Apex SLR systems. One will be configured with an inductively-coupled plasma (ICP) source, with the other configured for high-density plasma chemical vapor deposition (HDPCVD). Apex SLR® systems incorporate a field-proven, high-density plasma source that was developed by Plasma-Therm, parent company of Advanced Vacuum, for its widely used Shuttlelock® line of plasma tools.

Imec is an internationally renowned research institute that works with global partners on many types of nanoelectronics-based innovation. Imec is headquartered in Belgium and has offices in the Netherlands, Taiwan, USA, China, India, and Japan.

Dr. David Lishan, Director, Technical Marketing for Plasma-Therm, noted that “Plasma-Therm has a long history supporting R&D institutions, and this order continues that tradition. We are pleased that leading R&D organizations rely on Plasma-Therm technology for developing new processes and creating smaller, faster, and more efficient devices.”

“It’s gratifying that these Apex SLR systems were selected by imec’s scientists to help develop industry-relevant technology solutions,” Dr. Lishan said. Recent imec innovations include disposable photonics biosensors, flexible electronics, hyperspectral imaging devices, and 3D device integration (advanced packaging) processes.

Advanced Vacuum’s Apex SLR is a highly versatile, small-footprint plasma processing system. Apex SLR ICP is capable of etching a wide range of materials used in semiconductor devices and nanotechnology, while the Apex SLR HDPCVD enables relatively low-temperature plasma deposition of high-quality thin films. These films can include optical coatings, semiconductor device passivation layers, and other materials used in nanoelectronic fabrication and other applications with limited processing thermal budget.

Recognizing the massive growth potential of micro-electro-mechanical systems (MEMS) and sensors in Internet of Things (IoT) applications, MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016. Held in partnership with Shanghai Industrial Technology Research Institute (SITRI) and co-located with SENSOR CHINA, “The Internet of MEMS and Sensors Today and the Internet of TSensors Tomorrow” is a two-day conference focused on near- and long-term opportunities for MEMS and sensors in the IoT. MSIG and its members will also participate in a two-day exposition at SENSOR CHINA.

The IoT market is expanding rapidly, presenting huge market opportunities for MEMS and sensors. According to IHS Technology, the IoT market will grow from 15.4 billion devices in 2015 to 75.4 billion in 2025.

That growth has caught the attention of the global MEMS and sensors supply chain: “MEMS and sensors are critical to IoT devices,” said Karen Lightman, executive director, MEMS & Sensors Industry Group. “From smartphones that monitor air quality and agricultural sensors that manage irrigation to smart city applications that monitor structural health, adapt street lights to weather and light conditions, and enable smart roads, MEMS and sensors allow IoT devices to measure, monitor, sense and interact with our always-changing environment.”

Ms. Lightman added, “On September 13, attendees will gain actionable intelligence on the IoT devices of the near future — those applications that will reach commercialization within the next two to five years. On September 14, they will learn about the IoT devices that will come to market in ten to 20 years. Those speakers will address our TSensors vision — a transformational movement advocating the use of a trillion sensors to address major world problems — as they consider longer-term opportunities in the IoT.”

Conference Agenda
Featured presentations currently include:

Additional featured speakers include:

  • Masayuki Abe, manager, Corporate Production Technology, Asahi Kasei Corporation
  • Dr. Janusz Bryzek, CEO, eXo Systems, Inc., and founder, TSensors
  • Ahmed Busnaina, professor & director, NSF Center, Northeastern University
  • Susumu Kaminaga, executive senior advisor, SPP Technologies Co., Ltd.
  • Karen Lightman, executive director, MEMS & Sensors Industry Group
  • Ryoma Miyake, Process Development Group, Silicon Sensing Products, Ltd.
  • Keynote Speaker Tomy Runne, senior manager of planning and promotion department, Sensor Product Division, Murata Manufacturing Co., Ltd.
  • Keynote Speaker Dr. Jian Xu, executive general manager, Shanghai International Autocity Development Co., Ltd.

Panel
Context Computing — panel moderated by Leopold Beer, regional president AP, Bosch Sensortec, with panelists:

  • Xianfeng (Sean) Ding, director of sensing, Huawei Technologies
  • Ruizhen Liu, Shanghai Academy of Artificial Intelligence
  • Yang (Richard) Shi, industry strategy expert, Huawei Technologies

ON Semiconductor (Nasdaq: ON) this week announced that it is joining the Original Equipment Suppliers Association (OESA), which champions the business interests of more than 430 member automotive suppliers. All members also belong to the parent Motor and Equipment Manufacturers Association (MEMA), which represents more than 1,000 companies from both the original equipment and aftermarket segments of the light vehicle and commercial vehicle industries.

Joining these organizations enables ON Semiconductor to work more closely with its customers on the policy issues that matter to the automotive industry, such as the promotion of advanced driver assistance systems (ADAS). MEMA estimates that ADAS technologies alone have the potential to prevent 30 percent of all crashes, and ON Semiconductor is a supplier of the components that are used in these systems.

“As the #2 ranked non-microcontroller automotive semiconductor supplier, we have long recognized the importance of working closely with customers to promote the policies and technologies that will advance innovation in vital areas like safety and sustainability,” said Lance Williams, vice president of automotive strategy and OEM development at ON Semiconductor. “OESA and MEMA are two of the automotive industry’s most well respected trade associations, and we look forward to expanding our collaborations with their more than 1,000 member companies.”

Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

“With our new office conveniently located near Kuala Lumpur, we expect to better serve Malaysia’s research universities and manufacturers,” says Osamu Tsuji, Samco’s chairman, president and CEO. “Four company representatives will be assigned to this new location, where they will actively provide production-type systems and services, consisting of the three major technologies Samco specializes in.”

These technologies include: thin film deposition with PECVD and ALD systems; microfabrication with ICP etching, RIE and DRIE systems; and surface treatment with plasma cleaning and UV ozone cleaning systems.

“Samco has been continually enhancing its sales presence and service capability in Southeast Asia since the establishment of Samco’s Singapore office 20 years ago,” says Tsuji. “The region has seen an increased number of semiconductor and electronic component manufacturers in recent years, which initially led to the creation of the company’s former Vietnam service office in Ho Chi Minh during 2012.”

However, Tsuji adds, there was still a considerable physical distance between the Vietnam office and the Europe-based device manufacturers that have accumulated in Malaysia (mainly in Penang, Kuala Lumpur and Malacca), as well as the research institutions of some of Samco’s important customers.

“Bridging that distance was one reason Samco decided to replace its Vietnam office with our new location in Malaysia,” he says.

These efforts to strengthen the company’s presence in Southeast Asia include samco-ucp, which was established in Liechenstein after the acquisition of plasma cleaner systems maker UCP in May 2014, and now serves as Samco’s main European office.

“Some of samco-ucp’s chief customers are concentrated in Southeast Asia,” says Tsuji. “Our Malaysia office will also be used as a sales and service base for samco-ucp’s main product, production-type plasma cleaners that operate with a remote plasma source.”

Currently, the company’s annual sales in the region are nearly 2 million USD, which is expected to rise to 5 million USD after three years.

“With the combined sales revenue from both companies, we plan to increase Samco’s annual revenue in Malaysia to 10 million USD,” says Tsuji.

Samco’s Malaysia branch office is located at:

C-8-21, Block C, Centum at Oasis Corporate Park,
No. 2, Jalan PJU 1A/2, Ara Damansara, 47301
Petaling Jaya, Selangor Darul Ehsan, Malaysia

ams AG (SIX: AMS), a provider of high performance sensors and analog ICs, has launched the smallest ever optical sensor module that delivers a combination of colour (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

The TMD3700 footprint, at 4.00 x 1.75mm, is the smallest footprint available in the market, and with height of 1.00mm, its low-profile is ideal for next-generation mobile phones with extremely tight layout and mechanical design constraints. Its wide 45 degree field-of-view, ambient light sensing accuracy of +/-10% and operating range of 200mlux to 60Klux behind dark glass enable smartphones to measure the surrounding light environment and automatically adjust display colour and brightness for optimal viewing.

The TMD3700 colour sensor channels each have UV and IR blocking filters and a dedicated converter allowing simultaneous data capture necessary for accurate measurements. The combination of photopic colour and ambient light sensing enables smartphones to perform real-time adjustment of the display properties, such as white point, colour gamut and colour saturation, to achieve the best visual colour accuracy.

The TMD3700 features allow dynamic elimination of both electrical and optical crosstalk producing reliable proximity detection, a function used by smartphone manufacturers to disable the touchscreen display when it is held close to the user’s face. In addition, the module’s integrated IR LED is calibrated for maximum performance and consistent operation.

“Smartphone OEMs are continually condensing their product profiles while seeking ways to improve display performance for the best visual appeal. The availability of the TM3700 light sensing and proximity detection performance in a compact package enables innovative display management for today’s space-constrained smartphones,” said Darrell Benke, Strategic Program Director for Advanced Optical Solutions at ams.

By Marwan Boustany, senior analyst, MEMS and sensors, IHS Markit

With less potential for organic volume growth due to slowing end-product markets, market-share competition will dominate in 2016. MEMS suppliers will therefore focus more on sensor improvement (power and performance), portfolio expansion and innovation (new sensor categories), acquisitions (rapid capability integration), new business models (software services based on sensors) and expansion into new product categories (drones, smart homes, etc.).

Even as motion sensors and other traditional MEMS markets slow down, there are new and growing opportunities, including the following:

  • Virtual-reality headsets using motion sensors and microphones are a growing category in gaming, with HTC, Facebook and Sony all offering products.
  • Drones that use motion sensors began to take off in 2015. While this is a segment with a lot of potential, regulatory issues may have an as yet unclear impact on future sales volume, especially when the potential for delivery drones from Amazon are considered.
  • Home environmental monitoring, using gas, humidity and temperature sensors, show good opportunity for growth. This segment is led by smart home products from Nest and Honeywell, as well as carbon-monoxide detection regulations and growing consumer adoption of air-purifiers.
  • E-cigarettes, using flow sensors, are also on the rise.

Leading MEMS sensor manufacturer trends

Following is a top-line review of the three leading MEMS sensor manufacturers, based on 2015 revenue:

1. STMicroelectronics 

STMicroelectronics is still the revenue leader for consumer MEMS, thanks to its business across a wide range of sensor types. The company’s consumer MEMS revenue lead continued to erode at a fast rate last year, with competitors growing share, the company’s first-place revenue lead has narrowed from $100 million in 2014 to around $10 million in 2015. STMicroelectronic’s motion sensor revenue continued to decline in 2015, however it was helped by its growing success with 6-axis inertial measurement units (IMUs) used mainly by manufacturers in China.

STMicroelectronics was hit hard in the last two years, because Apple shifted its gyroscope business to InvenSense in 2014; however, STMicroelectronics won the Apple Watch business in 2015 with its 6-axis IMU and also increased its share of motion sensors used by Samsung in 2016.

2. Knowles

Knowles is still the dominant leader in MEMS microphones, leading the second-ranked suppler (Goertek) by a power of three in units and revenue. In addition to offering a wide range of analog and digital-output microphones, Knowles has also started shipping its VoiceIQ microphones with local processing in 2016, as it seeks to address both mobile and internet of things (IoT) applications.

While MEMS microphone price erosion has led to revenue decline for Knowles, it still ranks second after STMicroelectronics thanks to a favorable shift in Microphone adoption. The company has dramatically narrowed the lead enjoyed by STMicroelectronics — from more than $100 million in 2014 to just $10 million last year. Knowles provides a large share of MEMS sensors used in Apple’s products, as well as a share in most handsets, tablets and wearable products from other manufacturers.

3. InvenSense

InvenSense overtook Bosch and moved into third-ranked revenue position in the MEMS market last year. The company leads in consumer motion sensor revenue, thanks to dramatic volume growth for 6-axis IMUs as well as its dedicated optical-image stabilization (OIS) gyroscope. InvenSense is the standout MEMS supplier in terms of motion sensor revenue growth, with 26 percent year-over-year revenue growth, while the other sensor leaders suffer declining revenue.

Apple is the key and dominant source of this revenue for InvenSense, especially as it loses share in Samsung to STMicroelectronics in 2016. The company is increasingly pushing its MEMS microphone products against strong competition and hopes to release an ultrasonic fingerprint sensor in 2017 to capitalise on a rapidly growing segment.

top mems suppliers

Source: The IHS Markit MEMS & Sensors for Consumer & Mobile Intelligence Service provides comprehensive insight and analysis on MEMS sensors used in smartphones, wearables and consumer electronics. For information about purchasing this report, contact [email protected].

STMicroelectronics (NYSE:STM) has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry. The event took place in Shanghai on July 25-26, 2016.

The prestigious recognition from the advisory board members of the MEMS World Summit, which consists of leading research institutes, leading Equipment Manufacturers and MEMS Manufacturers, underlines ST’s position as an industry leader with 11 billion MEMS sensors shipped to date and the only company with the expertise to cover the full range of micro-machined silicon devices that include both sensors and micro-actuators. In naming ST, the jury highlighted the significant role of ST’s high-efficiency 6-axis MEMS sensor modules in driving the transformation of smartphones into intelligent personal assistants as one of the key winning factors. Other high-score criteria for ST included product development, revenue, and company culture.

“ST has always been a leader in MEMS and we want to recognize their continued presence at the top. The evaluating criteria for selecting this year’s winner were also based on factors such as revenue, product development, company culture, and company awareness,” said Salah Nasri, Advisory Board Chair of MEMS World Summit.

“The performance of 6-axis MEMS sensor modules, which have become a key building block of today’s consumer and IoT devices, has enabled new features in smartphones and more broadly new user experiences,” said Andrea Onetti, Group VP and General Manager, MEMS Sensors Division, STMicroelectronics. “ST is honored to receive this award as we strive to bring continuous innovation to the development and deployment of MEMS technologies for a variety of fields, including industrial and automotive.”

Andrea Onetti collected the Award on behalf of ST at the MEMS World Summit’s Gala Dinner.

STMicroelectronics (NYSE:STM) today announced that it has acquired ams’ (SIX: AMS) assets related to NFC1 and RFID2 reader business. ST has acquired intellectual property, technologies, products and business highly complementary to its secure microcontroller solutions serving mobile devices, wearables, banking, identification, industrial, automotive and IoT markets. Approximately 50 technical experts from ams have been transferred to ST.

The acquired assets, combined with ST’s secure microcontrollers, position ST for a significant growth opportunity, with a complete portfolio of technologies, products and competencies that comprehensively address the full range of the NFC and RFID markets for a wide customer base.

“Security and NFC connectivity are key prerequisites for the broad rollout of mobile and IoT devices anticipated in the coming years. This acquisition builds on our deep expertise in secure microcontrollers and gives ST all of the building blocks to create the next generation of highly-integrated secure NFC solutions for mobile and for a broad range of Internet of Things devices,” said Claude Dardanne, Executive Vice President and General Manager of STMicroelectronics’ Microcontroller and Digital ICs Group. “We welcome this highly competent team from ams into ST for the benefit of our customers.”

The first NFC controller, leveraging the acquired assets, is already sampling to lead customers, as well as a new high-performance, highly-integrated System-in-Package solution which combines this NFC controller with ST’s secure element.

ST acquired the ams assets in exchange for a (i) cash payment of $77.8 million (funded with available cash), and (ii) deferred earn-out contingent on future results for which ST currently estimates will be about $13 million but which in any case will not exceed $37 million.