Category Archives: Materials and Equipment

Subject to the terms and conditions of the syndicated loan agreement, the facility may be drawn by ASE Inc. on or prior to June 3, 2008 to finance a portion of the consideration for the proposed acquisition by ASE Inc. of the outstanding ordinary shares of ASE Test Ltd., a majority-owned subsidiary of ASE Inc., held by ASE Test shareholders other than ASE Inc. and its subsidiaries, by way of a scheme of arrangement under Singapore law (the “Scheme”).

(March 3, 2008) Atsugi, Japan — Fujitsu Laboratories Ltd. today announced the successful formation of a new nano-scale carbon composite featuring a self-organizing structure by combining carbon nanotubes and graphene, which are both nano-scale carbon structures. The newly-discovered composite structure is synthesized at a temperature of 510°C.


Schematic of Fujitsu’s nanoscale composite shows graphene multilayers atop multiwalled carbon nanotubes. (Image: Fujitsu)

March 3, 2008 — Fujitsu Laboratories Ltd. has formed a new nanoscale carbon composite featuring a self-organizing structure by combining carbon nanotubes and graphene, the company says.

The new composite is synthesized at a temperature of 510 °C, cooler than for conventional graphene formed at temperatures too high for electronic device applications, paving the way for the feasible use of graphene in electronic devices.

Carbon nanotubes have properties including high thermal conductivity and high current-density tolerance, while graphene is known for its high electron mobility. Carbon nanostructures combining these two materials hold the promise of creating new potential for material research and applications.

Details of this technology will be presented at the 34th Fullerene Nanotubes General Symposium March 3-5 in Nagoya, Japan.

Brown Bag Engineers


March 1, 2008

Although most of the semiconductor industries’ greatest discoveries and inventions are the results of years of research and development at prestigious universities and research institutes, some of the best solutions out there were developed in the trenches, on the manufacturing floor. Out of these ideas, entire companies have emerged, and have become successful purely by trial and error. In this Roadshow, we visited two companies who took a grass roots approach to success.

Jeff Fugere, president, DL Technologies, describes his company’s approach to product development as brown-bag engineering; they draw their ideas, bring them to the lab, and try them out. The company builds dispense pumps and tips for semiconductor equipment manufacturers. Fugere’s vision: “If we could manufacture the right pump, we would be able to sell to all the (equipment) manufacturers,” he explained. And that’s pretty much what he’s done.

HCD sprung up from a seed idea at Cornell University in 2000 with the intention of serving the land grid array (LGA) package market. Charlie Stevenson, chief operating officer (COO), and his team had a clear idea of the product they wanted to create: a high-connection-density chip- or package-level interconnect device. If existing tools weren’t good enough, they designed and built their own. Today, HCD makes test and production sockets, solderless PCB-to-PCB interconnects for medical and ATE markets, and LGA sockets.


Business is all in the family at DL Technologies. Gail Flower, editor-in-chief, Advanced Packaging, (far left) and Françoise von Trapp (far right), managing editor, share a photo opportunity with Jeff Fugere, president, Donna Fugere, office manager, and Corey Fugere, V.P. of sales and applications specialist.
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Braided copper wire spools into a coating system, where the process of SuperButton production begins. Charlie Stevenson, COO, HCD, hands Meredith Courtemanche, contributing editor, Advanced Packaging, a finished SuperButton, while Chris Platt, group publisher, looks on.
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DL Technologies, Haverhill, MA

 


This dispense tip can be made to the customer’s gauge of choice, beginning at 27. They are machined rather than rolled, for a smooth interior.
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Inventory is cataloged and stored with military precision. Because parts don’t occupy much storage space, a large inventory can be maintained. This allows for quick turn around on shipping orders.
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Rick Massero demonstrates how auger pump housings are machined.
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Each machine has 20 tools that are interchanged automatically. All the housings are run through each step concurrently.
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Fully assembled housings are ready to ship to a customer.
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Fugere displays the completed auger dispense pump, designed to customer specifications.
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In the lab, a test pattern is run with a cross needle dispensing conductive epoxy to determine which gauge needle would be best suited to handle the viscosity of the material.
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Get the full story at www.apmag.com

HCD, Sunnyvale, CA

 


A long, narrow oven is used to cure the jacket material which is coating the braided wire SuperButton cable.
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HCD designed and patented their own cutting stations, replacing a larger system that was not accurate enough to meet the company’s needs. Here, the machine cuts SuperButtons at a specified length.
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Springs and Buttons are inserted into an FR4 carrier substrate and laminated into place.
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Courtemanche performs some optical inspection, checking out a SuperSpring version interposer in detail.
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Final electrical test station for finished interposers before shipping.
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This Instron is used for various validation and mechanical life testing of the SuperButton and SuperSpring interposers.
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The nanotechnology standards-development race is on, as participants recognize their ability to affect the nascent industry’s future.

By Sarah Fister Gale

The rush to develop a set of standards for nanotechnology that the world will embrace is in full throttle. Standards organizations across the globe are working together to define critical components of nanotechnology. From finding a common language, to defining material dimensions and quality, to building a road map for future development, standards will give nanotech the foundation upon which commercialization can proceed.

The American National Standards Institute (ANSI—www.ansi.org), the Institute for Electrical and Electronics Engineers (IEEE—www.ieee.org), the British Standards Institute (BSI—www.bsi-global.com), and the International Organization for Standardization (ISO—www.iso.org) are just a few of the groups currently engaged in standards development, with some documents already released to the public.

While it remains unclear which standards will take hold, this is an important time for the industry. How the standards are defined—and who defines them—will shape the future of nano-related industries, and clever industry professionals are investing their time and expertise to make sure these documents best define the language and goals for their futures.

IEEE addresses CNTs and road mapping

One of the first and best-known standards documents for nano was developed by a group through the non-profit professional association IEEE. The standard, IEEE 1650-2005 (http://grouper.ieee.org/groups/1650/), defines test methods for measurement of electrical properties of carbon nanotubes (CNTs). It was approved by IEEE on December 8, 2005, after months of development, writing, peer reviews, and edits, and was one of the first formal industry efforts to document the minimal amount of information required for reporting lab results for nano-tech materials.

IEEE chose CNTs for its initial foray into standards for nanotech because there is so much hype around the commercial applications for CNTs in displays, integrated circuits, sensors, and other nanoelectronics components, says Dan Gamota, director of printed electronics at Motorola in Schaumberg, IL, and chair of the working group that developed the standard. “There is so much talk about carbon nanotubes, but we needed a way to reproduce and prove lab results on a large scale,” he says. “IEEE 1650 establishes a common metrics and a minimum requirement for reporting.”

Standards for measurement of CNTs are a key concern because significant measurement errors can be introduced if the electrical characterization design-of-experiment is not properly addressed. IEEE 1650 outlines common sources of measurement errors and recommended practices to minimize and/or characterize the effect of measurement artifacts and other sources of error encountered while measuring CNTs. “It’s fundamental and precompetitive information, but it provides a level of assurance that is necessary for commercial scale up,” says Gamota. “It will give suppliers a way to prove their materials meet certain quality requirements, and buyers a way to verify the quality of what they are purchasing.”

More recently, in April 2007, IEEE released its Nanoelectronics Standards Roadmap (NESR—download a copy at http://standards.ieee.org/getieee/nano/nanoelectronics_roadmap_v1.pdf), which establishes a framework for creating standards to help industry transition electronic applications based on nanotechnology from the laboratory to commercial use. Like IEEE 1650, the NESR was developed by industry professionals, government experts, and academics and from many nations. It focuses on nanomaterials and devices that promise the highest value in the near-term. 

“The goal of the NESR effort was to help define where the industry needs to go next,” says John Tucker, one of the co-chairs of the NESR initiative and the lead marketing engineer for nanotechnology at Keithley Instruments, a manufacturer of electronic test and measurement instruments in Cleveland, OH. “Currently there is no one globally accepted architecture,” he says. “In order to move forward we need to all be on common ground.”

The road map recommends the initiation of five nanoelectronic standards: three for nanomaterials involving conductive interconnects, organic sensor structures, and nano-dispersions; and two for nanodevices involving nanoscale sensors and nanoscale emitting devices (not limited to light emission). It also targets the start of seven nanomaterial standards and five nano-device standards in 2008.

IEEE groups are also currently working on standards for fundamental properties of bulk and compounding materials—called IEEE 1690 (http://grouper.ieee.org/groups/1690/). They’re also working on interoperability issues within silicon-based infrastructures, as yet unnamed.

ANSI, ISO, and IEC collaborate

IEEE is not the only group that is making headway in standards development. ANSI is sponsoring a Nanotechnology Standards Panel to serve as the cross-sector coordinating body for the purposes of facilitating the development of standards in three areas of nanotechnology: nomenclature and terminology; materials properties; and test, meaurement, and characterization procedures.

ANSI has since accredited the International Organization for Standardization (ISO)-formed Technical Committee (TC) 229. (For links to documents relating to ISO TC 229, go to www.iso.org/iso/iso_catalogue/catalogue_tc/cat alogue_tc_browse.htm?commid=381983 to develop a set of standards for those three areas.)

In December 2006, more than 100 delegates from 17 nations gathered in Seoul, Korea, to further the development of the road maps and strategies that will guide the work of the technical committee’s three working groups. Delegates also laid plans for potential coordination with the International Electrotechnical Commission (IEC) technical committee on nanotechnology standards relating to electrical and electronic products and systems.

“We are making quite a bit of progress,” says Clayton Teague, director of the US National Nanotechnology Coordination Office (NNCO) in Washington, DC, and chair of the technical advisory group (TAG) to TC 229. A UK member of the working group to develop a standard for terminology has already submitted for comment a document proposing lexicon and definitions of nanoparticles.

To ensure ongoing progress, ISO has put a five-year limit on standards development, from the submission of the work item to final acceptance. “A standard for terminology will have a huge impact on our ability to communicate and to buy and sell products,” says Teague.

“The work being conducted by TC 229 is relevant because as products come to market we all need a common language,” adds Heather Benko, standards administrator for ANSI. She believes the terminology working group is close to releasing a draft of its terminology standard. “We’ve got a lot of intelligent people at the table working together to meet the needs of the industry,” she says. “It’s an exciting time.”

Meanwhile, the US working group focused on health, safety, and the environment has furthered for publication its draft document, “Health and Safety Practices in Occupational Settings Relative to Nanotechnologies.”

And ANSI has encouraged the national bodies of Japan, South Korea, and the US to develop new work item proposals relative to the characterization of carbon nanotubes for input into the TC 229 working group on measurement and characterization.

The US is expected to submit at least one proposal for work in this area before year-end and has announced its intention to develop a technical report relating to toxicologic assessment of nanomaterials.

ASTM settles on terminology, pursues partnerships

In 2005, the American Society for Testing and Materials (ASTM) launched its own Committee E56 on Nanotechnology to develop standards and guidance documents related to nanotechnology and nanomaterials. Initially, six subcommittees were formed to address terminology; characterization; environmental, health, and safety; international law and intellectual property; international cooperation; and product stewardship. In December 2006, the committee approved its first standard—E 2456: Terminology for Nanotechnology.

Because of the great need for a terminology document that is globally recognized and because of the cooperation of several organizations in making the document a reality, Terminology E 2456 is available free of charge from the ASTM International Website, www.astm.org/cgi-bin/SoftCart.exe/ DATABASE.CART/REDLINE_PAGES/E2456.htm?L+mystore+ylyc6366.

“This ASTM terminology standard will change how I communicate with policymakers, teachers, and my neighbors,” says Vicki Colvin, chair of Committee E56. “For the first time I can use critical terms such as ‘nanoparticle,’ confident my language is precise and shared with other nanotechnologists across the globe.” Colvin adds that the document will also benefit students entering nanotechnology-related industries.

“Now teachers and students interested in nanotechnology can access this dictionary and learn for themselves the nuances of our field,” says Colvin.

To facilitate the development of E56, ASTM initiated and signed partnership agreements with IEEE, the American Society of Mechanical Engineers (ASME), NSF International, Japan’s National Institute of Advanced Industrial Science and Technology, Semiconductor Equipment and Materials International (SEMI), and the American Institute of Chemical Engineers. ASTM believes these partnership agreements will eliminate redundant resource allocation among a variety of standards organizations and will provide for the pooling of technical experts in a single standards development venue.

Teague agrees, saying “it’s critical that there be an international standard because we live in an international marketplace.”

Eliminating boundaries and working together could streamline the standards process, adds IEEE road map co-chair Tucker. “This isn’t a US, EU, [or] Asia issue: It’s a global issue. We need a common standard for every country, and whoever develops the controlling standard controls what the world does.”

Global effort, great opportunity

Tucker recognizes that there is also a sense of urgency among global communities that want to take the lead on standards development. The BSI, for example, currently sponsors technical committee NTI/1 “Nanotechnologies,” holds both the chair and secretariat of ISO TC/229, and serves on the European Commission for Standardization’s Technical Board Working Group 166 on Nanotechnology, whose goal is to analyze the need for nanotechnology standardization. BSI’s Website touts its position on these committees as “enabling the UK to play a key role in leading the development of nanotechnology standards.”

“Currently no one standard is dominating, but we will need global agreement as we go forward,” says Tucker, who urges industry professionals in the US to get involved in their efforts.

“Standards development is a people project, and we need people,” he adds. Tucker sees an opportunity for professionals like himself to shape the future of the industry and to establish themselves as experts. “Getting involved in standards development doesn’t take a lot of time, and it can increase the visibility of you and your company.”

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February 29, 2008 — Lars Liebmann, Distinguished Engineer, Design for Manufacturability, IBM, talks with Solid State Technology‘s Senior Technical Editor Debra Vogler about papers he presented at the SPIE Advanced Lithography conference (Feb. 25-29). He explains the misconceptions that persist regarding restricted design rules (RDRs), and addresses the need for designers to react to systematic and stable effects with broad, coarse, layout adjustments — not worry about minor movements based on a specific moment in time. He also discusses the DFM opportunity that awaits the industry at 22nm with “soft” and “hard” DFM, and how these concepts will be required to keep the scaling path profitable.

February 26, 2008 — /PRNewswire/ — LEHIGH VALLEY, PA — Air Products (NYSE:APD), a pioneer of cryogenic food freezing and chilling technologies, announces the grand opening of its Asia Food Technology Center at the Thailand Science Park in Bangkok. The Center has been established to provide innovative solutions and technical expertise to support the ever-increasing demands from the growing Asian food market.

By strategically locating its technology center in Thailand, one of the world’s leading food processing markets, Air Products can now work even closer to its Asian customers to drive forward new food processing innovations. Air Products is also able to leverage cutting-edge microbiological and food science research capabilities within the Thailand Science Park and nearby universities.

“Our investment in the Asia Food Technology Center underscores the company’s commitment to Asia and to the food processing market. To put our focus on where the market is, the Center enables Air Products to respond more quickly to the changing needs of our food customers, in which time-to-market and innovations are critical for their success,” says Ivo Bols, vice president and general manager of Merchant Gases, Air Products Asia.

On showcase at the center is a broad selection of Air Products’ FreshlineTM food preservation solutions, which maintain the quality and freshness of foods. The Center also includes other facilities such as a laboratory kitchen and a cold storage room. The set up enables the company to work with customers to develop innovations and resolve issues which relate to maintaining high quality and freshness of a wide variety of food products. It also houses a state of the art training center, and is envisaged to be a center of excellence to serve food customers throughout the Asian region.

“Air Products has been serving the food industry globally for over 40 years. The food processing sector in Asia requires the support of unmatched industry experience, expertise, and technical excellence to keep pace with its dynamic growth. By establishing its new Food Technology Center in Asia, Air Products has significantly enhanced its position as the premier food solutions provider to the food industry,” says Dr. Terrence Yee, regional director of applications, Air Products Asia.

The center is integrated into the company’s global advanced technology network, complementing existing technical facilities in North America and Europe.

About Air Products

Air Products serves customers in industrial, energy, technology, and healthcare markets worldwide with a unique portfolio of atmospheric gases, process and specialty gases, performance materials, and equipment and services. Founded in 1940, Air Products has built leading positions in key growth markets such as semiconductor materials, refinery hydrogen, home healthcare services, natural gas liquefaction, and advanced coatings and adhesives. The company is recognized for its innovative culture, operational excellence and commitment to safety and the environment. Air Products has annual revenues of $10 billion, operations in over 40 countries, and 22,000 employees around the globe.

Visit www.airproducts.com

February 28, 2008 — SEMATECH, an association of semiconductor technology developers, has purchased the new Imprio 300 tool from Molecular Imprints (MII) to demonstrate the feasibility of nanoimprint lithography for semiconductor production at 32nm and below. Initial work will focus on demonstrating and enhancing overlay performance, and identify development areas to accelerate the introduction of the technology into manufacturing. Delivery is scheduled for mid-2008.

SEMATECH’s involvement with nanoimprint lithography follows MII’s work with Toshiba, which last fall said it isolated 18nm features with defect levels “very similar” to those seen in the early days of immersion lithography.

The industry’s progression to sub-32nm node semiconductor manufacturing comes with increasing costs and challenges, with one of the notable areas in extending lithography technologies and development of new ones. “One of SEMATECH’s goals is to identify cost-effective and manufacturable technologies,” said Michael Lercel, lithography director at SEMATECH, in a statement. “Nanoimprint has demonstrated excellent resolution and image fidelity, so now is the time to evaluate its manufacturability.

“MII’s S-FIL technology is ideally suited for patterning critical layers in sub-32nm devices, and we anticipate that successful prototyping at the 32nm node will lead to volume manufacturing adoption,” stated Mark Melliar-Smith, CEO of Molecular Imprints, adding that “increasing industry investment in the imprint technology roadmap will accelerate its introduction into manufacturing.”

MII says its step-and-flash imprint litho technology (“S-FIL”) replicates ultrahigh resolution e-beam litho, but with costs likened to dry optical lithography, the company noted, adding that its technology has demonstrated sub-10nm resolution patterning capability.

Feb. 27, 2008 – Rohm & Haas Electronic Materials/CMP Technologies and IBM are adding to their collaborative plate, following news of joint work on 32nm and below implant materials/processes with a pact to develop CMP processes for integrating copper and low-k dielectrics, in order to create copper CMP consumables for 32nm and 22nm device manufacturing. Research will take place at IBM’s Research facility in Yorktown Heights, NY, as well as the U. of Albany’s NanoTech complex and Rohm and Haas’s Technology Centers in Newark, DE, and Phoenix, AZ.

Current Rohm and Haas development efforts are focused on low-stress polishing that can operate at extreme conditions to achieve high volume, reproducible processes, the company noted in a statement. IBM, meanwhile, pioneered use of CMP in semiconductor manufacturing. Together the two already have contributed to industry-standard platforms for CMP polishing pads, noted Sam Shoemaker, president of Rohm and Haas Electronic Materials, CMP Technologies, in a statement.

“We expect this new collaboration with IBM can help solve some critical copper integration challenges that will benefit IBM and its customers, and ultimately result in technology advancements that will benefit the semiconductor industry,” he said.

Developing CMP processes for the 32nm and 22nm nodes “requires a complete understanding of the interaction between pad, slurry and conditioner under various process conditions,” added Cathie Markham, CTO for Rohm and Haas Electronic Materials, citing the company’s expertise in pads, polymers, slurries and the CMP process.

Henkel and EIS have been supplier-distributor partners since 1989, with EIS representing Henkel’s advanced assembly and semiconductor materials, industrial adhesives, sealants and assembly equipment throughout North America. In an effort to recognize outstanding commitment and support of its suppliers, EIS launched the Prime Source Award program in 2007.

(February 27, 2008) Bannockburn, IL — Technological advances on the horizon and future industry demands: this is the focus of “Will You Be Ready?: An Endicott Technology Interchange,” sponsored by IPC, the Association Connecting Electronics industries. On May 14, Endicott Interconnect Technologies Inc. will open up its headquarters in Endicott, NY, for a day of information exchange and networking in order to provide a vision of future direction and needs.

February 26, 2008 — Rudolph Technologies Inc. a provider of process characterization equipment and software for thin film measurement and macro defect inspection, and Sematech, the global consortium of leading chipmakers, has announced that Rudolph has become the first semiconductor equipment supplier company to join Sematech’s Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

Under the membership agreement, Rudolph and Sematech will jointly establish an International Process Characterization (IPC) program, aimed at the development of process, analysis, and characterization technology to address critical challenges in nanoelectronics research.

The IPC program, which will be a foundational component of Sematech’s expanding metrology programs at CNSE’s Albany NanoTech complex, brings together expert researchers and technologists, along with critical tools and software, as part of the consortium’s broader industry-university-government partnership with New York State and CNSE.

As the first associate member, Rudolph will team with Sematech’s members and the members of ISMI (International Sematech Manufacturing Initiative) to accelerate the development and application of measurement methods for advanced semiconductor technologies.